SO-KEN CO., LTD.
SO-KEN CO., LTD. Patent applications | ||
Patent application number | Title | Published |
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20080314623 | Printed Circuit Board and Method for Manufacturing the Same - This invention relates to a printed circuit board which comprises a porous sheet or foil composed of a non-conductive material; a circuit pattern composed of a conductive material formed on the porous sheet or foil; and an organic polymer coating as an insulating layer formed by vapor deposition polymerization. | 12-25-2008 |