SHINKO ELECTRIC INDUSTRIES CO., LTD. Patent applications |
Patent application number | Title | Published |
20160099232 | FINGERPRINT RECOGNITION SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A fingerprint recognition semiconductor device includes an insulation layer, a wiring pattern formed on a lower surface of the insulation layer, and a sensor element flip-chip-connected to the wiring pattern. The sensor element includes an active surface, including a sensor portion that recognizes a fingerprint, and a rear surface, located at a side opposite to the active surface. An encapsulation resin fills a gap between the lower surface of the insulation layer and an upper surface of a wiring substrate, facing the rear surface of the sensor element and connected to the wiring pattern by a connecting member. The entire active surface of the sensor element is covered by underfill formed between the active surface of the sensor element and the lower surface of the insulation layer. The insulation layer includes an upper surface, defining an uppermost surface and free from a wiring layer. | 04-07-2016 |
20160044792 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height. | 02-11-2016 |
20160035694 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE - An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head. | 02-04-2016 |
20150348814 | ELECTROSTATIC CHUCK AND SEMICONDUCTOR-LIQUID CRYSTAL MANUFACTURING APPARATUS - An electrostatic chuck includes a base plate including a penetration hole, a cylindrical insulating component inserted in the penetration hole, the cylindrical insulating component including a protruding portion protruding from an upper end of the penetration hole, a placing table arranged on the base plate, a dent portion formed in a lower face of the placing table, the dent portion in which the protruding portion of the cylindrical insulating component is fitted, a concave portion formed in the dent portion of the placing table, an electrode formed in the concave portion of the placing table, and a power feeding terminal arranged in an inner part of the cylindrical insulating component, the power feeding terminal connected to the electrode. | 12-03-2015 |
20150340261 | ELECTROSTATIC CHUCK AND SEMICONDUCTOR-LIQUID CRYSTAL MANUFACTURING APPARATUS - An electrostatic chuck includes a base plate including a penetration hole, a placing table arranged on the base plate, and including an electrode at a position corresponding to the penetration hole, a first cylindrical insulating component arranged on an upper side inside the penetration hole of the base plate, a second cylindrical insulating component arranged on the first cylindrical insulating component, a third cylindrical insulating component arranged under the first cylindrical insulating component, and having an inner diameter smaller than an inner diameter of the first cylindrical insulating component, a connector arranged in the penetration hole, a cylindrical member included in the connector, and including an elastic body in an inner part, and a power feeding terminal included in the connector, and connected to the elastic body. The power feeding terminal touches the electrode of the placing table. | 11-26-2015 |
20150327397 | SEMICONDUCTOR DEVICE, HEAT CONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, and a heat dissipation component arranged on the wiring substrate. The heat dissipation component includes a cavity that accommodates the semiconductor element and includes an inner surface opposing the wiring substrate. The semiconductor element is located between the inner surface of the cavity and the wiring substrate. A heat conductor is bonded to the semiconductor element and to the inner surface of the cavity. The heat conductor includes linear heat conductive matters arranged between the semiconductor element and the heat dissipation component. A first alloy layer bonded to the semiconductor element covers lower ends of the heat conductive matters. The heat dissipation component includes a through hole extending through the heat dissipation component toward the heat conductor from a location outside of the heat conductor in a plan view. | 11-12-2015 |
20150315451 | CARBON NANOTUBE SHEET, ELECTRONIC DEVICE, METHOD OF MANUFACTURING CARBON NANOTUBE SHEET, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A carbon nanotube sheet includes a plurality of carbon nanotubes including a first constriction portion in one end side, and a resin portion filled between the plurality of carbon nanotubes. Each of the plurality of carbon nanotubes is bent at the first constriction portion to a lateral direction in the resin portion. | 11-05-2015 |
20150307765 | METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE MATERIAL, METHOD OF MANUFACTURING HEAT DISSIPATING COMPONENT, AND HEAT DISSIPATING COMPONENT - A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder. | 10-29-2015 |
20150285995 | OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical waveguide device includes a wiring substrate including an insulating layer and a wiring layer formed on the insulating layer, an optical waveguide formed on the insulating layer and the wiring layer, a groove portion formed on an edge side of the optical waveguide, the groove portion including an inclined face, a light path conversion mirror formed on the inclined face, and an opening portion formed in the wiring layer under the optical waveguide, wherein the wiring layer is not formed under the groove portion. | 10-08-2015 |
20150270149 | TEMPERATURE ADJUSTMENT DEVICE - A temperature adjustment device includes a holding plate having a placing surface on which a processed substrate is placed. The holding plate includes a heating element capable of heating the processed substrate placed on the placing surface. A base plate that supports the holding plate includes first through holes extending through the base plate in a thickness direction. An adhesive layer, which adheres the base plate and the holding plate, includes second through holes that are respectively in communication with the first through holes. Adjustment rods are respectively inserted into the first through holes. Each of the adjustment rods includes a distal end located in a corresponding one of the second through holes. | 09-24-2015 |
20150262957 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a wiring substrate including a first surface and a second surface that are opposed to each other, a plurality of mounting pads arranged on the first surface, and a plurality of connection pads arranged on the second surface, and a plurality of connection members respectively connected to the connection pads. Each of the connection members includes a holding member opposing the second surface of the wiring substrate, and a plurality of elastic and conductive connection terminals. Each of the connection terminals includes a first end and a second end. The first end is held by the holding member so that the first end is exposed from a surface of the holding member that is located at a side opposite to the wiring substrate. The second end is connected to a corresponding one of the connection pads. | 09-17-2015 |
20150228624 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a wiring substrate, a first semiconductor chip flip-chip connected to the wiring substrate, a first underfill resin filled between the wiring substrate and the first semiconductor chip, the first underfill resin including a pedestal portion arranged in a periphery of the first semiconductor chip, a second semiconductor chip flip-chip connected to the first semiconductor chip, and being larger in area than the first semiconductor chip, and a second underfill resin filled between the first semiconductor chip and the second semiconductor chip, the second underfill resin covering an upper face of the pedestal portion of the first underfill resin and a side face of the second semiconductor chip. | 08-13-2015 |
20150228551 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a wiring substrate including a first electrode in which a cross-sectional shape is an inverted trapezoidal shape, a semiconductor chip including a second electrode in which a cross-sectional shape is an inverted trapezoidal shape, a metal bonding material bonding a tip end of the first electrode and a tip end of the second electrode which face each other, and an underfill resin filled between the wiring substrate and the semiconductor chip, the underfill resin covering a side face of each of the first electrode and the second electrode and a side face of the metal bonding material. | 08-13-2015 |
20150223330 | WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A wiring substrate includes a first multi-layer wiring layer having a stacked via structure including a first electrode pad, a second multi-layer wiring layer rinsing a non-stacked via structure including a second electrode pad. The second electrode pad is formed on an uppercut first insulating layer. The first electrode pad is formed on a second insulating layer which is located to a position lower by one layer than the first insulating layer, and the first electrode pad is arranged in an opening portion of the first insulating layer such that the upper face and the side face of the first electrode pad are exposed. | 08-06-2015 |
20150206822 | CARBON NANOTUBE SHEET, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING CARBON NANOTUBE SHEET, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A carbon nanotube sheet includes a carbon nanotube aggregate in which a plurality of carbon nanotubes are arrayed, a thermoplastic resin portion formed in a center area of the carbon nanotube aggregate, and an uncured thermosetting resin portion formed in an outer periphery area of the carbon nanotube aggregate so as to surround the thermoplastic resin portion. | 07-23-2015 |
20150192750 | METHOD FOR MANUFACTURING CAMERA MODULE - A method for manufacturing a camera module includes preparing an image capturing unit, preparing a lens unit, detecting the center of a light receiving surface of an image capturing element arranged in the image capturing unit, detecting the center of an opening of a diaphragm arranged in the lens unit, aligning the lens unit and the image capturing unit so that the center of the opening of the diaphragm coincides with the center of the light receiving surface of the image capturing element, and joining the lens unit and the image capturing unit after the aligning the lens unit and the image capturing unit. | 07-09-2015 |
20150147023 | OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical waveguide device includes a wiring substrate, a connection pad formed in the wiring substrate, an optical waveguide is which a first cladding layer, a core layer, and a second cladding layer are formed of the wiring substrate in this order, an opening portion formed in the second cladding layer in a region including the connection pad, a contact hole formed at least in the first cladding layer on the connection pad, and being communicated with the opening portion of the second cladding layer, an optical element, including a connection terminal, connected to the connection pad through the contact hole, and underfill resin filled in the opening portion of the second cladding layer and the contact hole, and sealing a lower side of the optical element, wherein a part of the opening portion or the second cladding layer in exposed from the optical element. | 05-28-2015 |
20150137849 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card includes a first insulation layer, a contact terminal arranged on the first insulation layer, and a wiring pattern arranged on an upper surface of the first insulation layer. The wiring pattern includes a rewire connected to the contact terminal and a first pad connected to the rewire. The probe card further includes a wiring substrate. The wiring substrate includes an interlayer insulation layer, a wiring layer, and a cavity defined in central portions of the interlayer insulation layer and the wiring layer. The wiring substrate is spaced apart from the first insulation layer arranged in the cavity. The cavity is filled with a second insulation layer. A conductive wire is arranged in the second insulation layer to electrically connect the first contact terminal and the wiring layer. The second insulation layer has a lower elasticity than the interlayer insulation layer. | 05-21-2015 |
20150092337 | ELECTRONIC COMPONENT CASE AND ELECTRONIC COMPONENT DEVICE - An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case. | 04-02-2015 |
20140370365 | BATTERY AND METHOD FOR PRODUCING THE SAME - A battery includes a supporting substrate, resin layers, and a plurality of cells. Each resin layer includes a first resin and has 0.5 MPa to 10 MPa in tensile strength. The cells are stacked on the supporting substrate with the resin layers between the cells. | 12-18-2014 |
20140369642 | PHOTOELECTRIC MIXED SUBSTRATE AND OPTICAL MODULE - A photoelectric mixed substrate includes a wiring substrate including a first ground wire, a signal wire arranged above the first ground wire and electrically connected to the photoelectric component and the electronic component, and a waveguide unit stacked on the wiring substrate to cover the signal wire. The waveguide unit includes a first clad layer formed on the wiring substrate, a second ground wire formed above the first clad layer, a core formed on the first clad layer and optically coupled to the photoelectric component, and a second clad layer formed on the first clad layer to cover the core. | 12-18-2014 |
20140362552 | INTERPOSER AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - There is provided an interposer for cooling an electronic component. The interposer includes: a substrate body having a hollow cooling channel therein, wherein a cooling medium flows through the cooling channel, the cooling channel including: a plurality of main cooling channels extending in a certain direction and separated from each other; an inflow channel which is communicated with one end of the respective main cooling channels; and an outflow channel which is communicated with the other end of the respective main cooling channels, and a plurality of through electrode groups each comprising a plurality of through electrodes arranged in a line. Each of the though electrodes is formed through the substrate body to reach the first and second surfaces of the substrate body. The respective through electrode groups are partitioned by at least corresponding one of the main cooling channels. | 12-11-2014 |
20140360765 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located. | 12-11-2014 |
20140360760 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer. | 12-11-2014 |
20140354315 | PROBE GUIDE PLATE AND SEMICONDUCTOR INSPECTION APPARATUS - A probe guide plate used for a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting an object via a probe needle, the probe guide plate includes a silicon substrate provided with a through hole that penetrates the silicon substrate from one surface to another surface through which the probe needle is inserted, the through hole including a first tapered portion provided at an end portion at the one surface side such that the hole size of which increases as it approaches the one surface, and a second tapered portion provided at an end portion at the other surface side such that the hole size of which increases as it approaches the other surface; and a silicon oxide film formed on an inner wall surface of the through hole including the first tapered portion and the second tapered portion. | 12-04-2014 |
20140353174 | SOx GAS SENSOR AND METHOD OF MEASURING CONCENTRATION OF SOx GAS | 12-04-2014 |
20140347833 | ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic component device, includes, a plurality of wiring layers including a component connection pad in a center part and an external connection pad in a periphery, an insulating layer formed on the wiring layers, and the insulating layer in which the component connection pad and the external connection pad are exposed, a frame member arranged on the insulating layer, and the frame member in which an opening portion is provided in an area of the center part in which the component connection pad is arranged, and a connection hole is provided on the external connection pad, an electronic component arranged in the opening portion of the frame member and connected to the component connection pad, a sealing resin formed in the opening portion of the frame member and sealing the electronic component, and a metal bonding material formed on the external connection pad in the connection hole. | 11-27-2014 |
20140334059 | ELECTROSTATIC CHUCK AND SEMICONDUCTOR MANUFACTURING DEVICE - An electrostatic chuck includes a placing stage formed from a ceramic including aluminum oxide and yttrium oxide, and an electrostatic electrode arranged in the placing stage, wherein a content rate of the yttrium oxide is 0.5 wt % to 2.0 wt %. Preferably, the electrostatic chuck is used while being heated at a temperature of 100° C. to 200° C. | 11-13-2014 |
20140311771 | WIRING BOARD - A wiring board includes first insulating layers and second insulating layers formed on a core layer in this order; a third insulating layer and a solder resist layer formed on another surface of the core layer in this order, first wiring layers and second wiring layers formed in the first insulating layers and the second insulating layers, respectively, wherein a first end surface of the first via wiring exposes from the first surface of the outermost first insulating layer to be directly connected with an outermost second wiring layer, the first via wiring and the outermost second wiring layer being separately formed, the first surface of the outermost first insulating layer and the first end surface of the first via wiring are polished surfaces, smooth surfaces and are flush with each other, and the wiring density of the second wiring layers is higher than that of the first wiring layers. | 10-23-2014 |
20140301058 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - A wiring substrate includes a first insulation layer, a first wiring layer formed on the first insulation layer, and a second insulation layer stacked on the first insulation layer. The second insulation layer covers the first insulation layer and includes a filler. A third insulation layer is stacked on the second insulation layer. The third insulation layer is filler-free. A through electrode extends through the second and third insulation layers in a thicknesswise direction. A second wiring layer is stacked on the third insulation layer and the through electrode. The through electrode electrically connects the second wiring layer to the first wiring layer. | 10-09-2014 |
20140293564 | INTERPOSER AND ELECTRONIC COMPONENT PACKAGE - An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer. | 10-02-2014 |
20140291865 | ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME - A first semiconductor component and a second semiconductor component are attached together via an adhesion layer so that the first semiconductor component and the second semiconductor component are electrically connected with each other via a through electrode. The through electrode is formed to fill a through hole formed in the second semiconductor component and a through hole formed in a portion the adhesion layer. The through hole formed in the portion the adhesion layer is positioned between the through hole formed in the second semiconductor component and a second connection surface of a first semiconductor component through electrode. | 10-02-2014 |
20140291859 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer. | 10-02-2014 |
20140291827 | Lead Frame and Semiconductor Device - A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead. | 10-02-2014 |
20140266275 | GUIDE PLATE FOR PROBE CARD - The invention provides a guide plate for a probe card including a silicon substrate including a surface and a through-hole, an edge part of the through-hole, and a curved-face part. The through-hole is configured to guide a probe and includes an inner wall face. The edge part of the through-hole is constituted by the surface of the silicon substrate and the inner wall face of the through-hole. The curved-face part is formed on the edge part and formed of a silicon dioxide film. | 09-18-2014 |
20140266274 | PROBE GUIDE PLATE AND METHOD FOR MANUFACTURING THE SAME - There is provided a probe guide plate. The probe guide plate includes: a substrate having a through hole for guiding a probe, which is formed through the substrate, wherein the substrate includes a first main surface and a second main surface opposite to the first main surface; and a first insulating film formed on an inner wall of the through hole and on the first and second main surfaces of the substrate such that portions of the first and second main surfaces of the substrate are exposed. | 09-18-2014 |
20140264417 | WIRING BOARD AND LIGHT EMITTING DEVICE - There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer. | 09-18-2014 |
20140262465 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers. | 09-18-2014 |
20140242729 | SUBSTRATE WARP CORRECTING DEVICE AND SUBSTRATE WARP CORRECTING METHOD - A substrate warp correcting device includes, a lower member including a concave portion, and the lower member on which a substrate is to be arranged, an upper member arranged above the lower member, and the upper member including a gas supplying hole, wherein the substrate is arranged between the lower member and the upper member and above the concave portion, and a sealing member arranged between a periphery part of the substrate and the upper member, and the sealing member sealing a space between the substrate and the upper member. | 08-28-2014 |
20140240936 | ELECTRONIC DEVICE - There is provided an electronic device. The electronic device includes: a wiring board; a first electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a first frequency band; a second electronic component mounted on the wiring board and configured to emit an electromagnetic wave having a second frequency band; a first magnetic thin film covering the wiring board, the first electronic component and the second electronic component, wherein the first magnetic thin film has a composition corresponding to the first frequency band; and a second magnetic thin film covering the first magnetic thin film, wherein the second magnetic thin film has a composition corresponding to the second frequency band. | 08-28-2014 |
20140239508 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate. A through hole extends through the semiconductor substrate. A first insulating layer covers an upper surface of the semiconductor substrate and includes an opening in communication with the through hole. An insulating film covers wall surfaces of the through hole and the opening. A through electrode is formed in the through hole and the opening. A first connection terminal includes an electroless plating metal layer formed on an end surface of the through electrode and an end surface of the insulating film. The first connection terminal has a larger diameter than the through electrode. A wiring pattern is laminated on a lower surface of the semiconductor substrate. An electrode pad is connected to the wiring pattern. The through electrode is connected to the wiring pattern. | 08-28-2014 |
20140239492 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a first wiring substrate, a second wiring substrate positioned above the first wiring substrate, multiple connection terminals provided between the first wiring substrate and the second wiring substrate and configured to electrically connect the first wiring substrate and the second wiring substrate, an electronic component provided on at least one of the first wiring substrate and the second wiring substrate. The multiple connection terminals include a signal terminal and ground terminals provided on both sides of the signal terminal. The signal terminal and the ground terminals have side surfaces that face each other. The signal terminal and the ground terminals are adjacently arranged, so that intervals between the side surfaces of the signal terminal and the ground terminals are constant from a plan view. | 08-28-2014 |
20140210109 | BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE - A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin. | 07-31-2014 |
20140210082 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a first board; a second board joined to the first board; a connection terminal provided between the first board and the second board and electrically connecting the first board and the second board; and an electronic component on at least one of the first board and the second board. The connection terminal serves as an antenna. | 07-31-2014 |
20140209366 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers. | 07-31-2014 |
20140177999 | OPTICAL WAVEGUIDE DEVICE - There is provided an optical waveguide device. The device includes: a wiring substrate having a first opening portion therein and including: a substrate having an upper surface and a lower surface opposite to the upper surface; an upper side wiring layer formed on the upper surface of the substrate, and a lower side wiring layer formed on the lower surface of the substrate, an optical waveguide formed on the lower side wiring layer; a first optical element connected to the upper side wiring layer; a first circuit element electrically connected to the first optical element through the upper side wiring layer; a second optical element connected to the lower side wiring layer through the first opening portion; and a second circuit element electrically connected to the second optical element through the lower side wiring layer. | 06-26-2014 |
20140170810 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor chip includes forming a masking member including an opening on a wiring substrate including a chip mounting region so as to align the opening with the chip mounting region, forming an uncured sealing resin on at least the chip mounting region of the wiring substrate, wherein a support film is formed on the uncured sealing resin, removing the support film from the uncured sealing resin, removing the masking member from the wiring substrate so that the uncured sealing resin remains on the chip mounting region, and flip-chip mounting a semiconductor chip onto the chip mounting region with the uncured sealing resin arranged in between. The uncured sealing resin has a higher temperature when removing the masking member than when removing the support film. | 06-19-2014 |
20140169731 | OPTICAL WAVEGUIDE DEVICE AND METHOD OF MANUFACTURING THE SAME - An optical waveguide device includes, a substrate, an optical waveguide arranged on the substrate, an optical element arranged on the substrate and optically coupled to one end part of the optical waveguide, a flame retardant adhesive layer covering the optical waveguide, and a connector portion adhered to other end part of the optical waveguide by the flame retardant adhesive layer. | 06-19-2014 |
20140151891 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a first wiring substrate; a first spacer on the first wiring substrate, wherein the first spacer has a rectangular shape; a second spacer on the first wiring substrate to be separated from the first spacer, wherein the second spacer has a rectangular shape; a second wiring substrate on the first spacer and the second spacer and having a first surface and a second surface which is opposite to the first surface, wherein the second wiring substrate has opposed sides; a first semiconductor chip on the first surface of the second wiring substrate; and a second semiconductor chip on the second surface of the second wiring substrate to be disposed between the first spacer and the second spacer. The opposed long sides of the first and second spacers are substantially parallel with the opposed sides of the second wiring substrate. | 06-05-2014 |
20140146503 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - There is provided a wiring substrate. The wiring substrate includes: a wiring pattern of an outermost layer; a solder resist layer having an opening portion therein, wherein a portion of the wiring pattern is exposed through the opening portion, and the exposed portion of the wiring pattern is defined as a connection pad; and a solder bump on the connection pad. The connection pad includes: a solder layer; and a metal post that is entirely covered by the solder layer, wherein a portion of the solder layer is interposed between the connection pad and the metal post. | 05-29-2014 |
20140145317 | ELECTRONIC COMPONENT DEVICE - A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the same layer as each of the wiring layers. An area ratio of the reinforcing pattern to the outer periphery region and an area ratio of the wiring layer to the wiring forming region are substantially the same in each of the layers, and the reinforcing patterns exist without a gap in the outer periphery region when the wiring board is viewed in planar perspective. | 05-29-2014 |
20140138134 | WIRING SUBSTRATE - A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer. | 05-22-2014 |
20140125372 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire. | 05-08-2014 |
20140124186 | RADIATION MEMBER - A radiation member includes a base material; and a composite plating layer, formed on the base material, that includes a metal layer and two or more kinds of carbon materials, having different diameters from each other, dispersed in the metal layer such that to be provided with a plurality of protruding portions, each of the protruding portions being composed by a part of each of the carbon materials that are protruded from a surface of the metal layer. | 05-08-2014 |
20140119702 | OPTICAL WAVEGUIDE AND OPTICAL MODULE - An optical waveguide includes a first cladding layer, at least two core portions formed on the first cladding layer and extended in a first direction, at least two groove portions formed in each of the core portions at positions spaced apart from each other in the first direction, each groove portion having an inclined surface, an optical path conversion mirror formed on one of the inclined surfaces formed in each of the core portions, and a second cladding layer formed on the first cladding layer and the core portions. The optical path conversion mirrors formed in the core portions adjacent to each other are arranged at positions different from each other in the first direction. The groove portions formed in the core portions adjacent to each other are arranged at the same positions in the first direction. | 05-01-2014 |
20140117539 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE - A wiring substrate includes a core layer, first and second wiring layers, and a first insulating layer. The core layer has one and another surfaces and includes a plate-shaped member formed of an aluminum oxide and multiple linear conductors penetrating the plate-shaped member in a thickness direction of the plate-shaped member. The first wiring layer is formed on the one surface of the core layer. The second wiring layer is formed on the other surface of the core layer. The first insulating layer has a same thickness as the first wiring layer and is formed in an area of the one surface of the core layer on which the first wiring layer is not formed. The first and second wiring layers are positioned superposing each other in a plan view. The first and second wiring layers are electrically connected by way of the multiple linear conductors. | 05-01-2014 |
20140103612 | DIELECTRIC LAYER FOR ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK - A dielectric layer for an electrostatic chuck is formed of a ceramic material having a first phase including aluminum oxide and a second phase including composite carbonitride (Ti, Me)(C, N) that contains titanium as fine grains. The Me represents a transition element and metals of Group 4 to Group 6 such as Mo and W. The ceramic material that includes the second phase by 0.05 vol % to 2.5 vol % has a volume resistivity value of about 10 | 04-17-2014 |
20140097013 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A method for manufacturing a wiring substrate includes forming a through-hole penetrating a core layer from one to another surface of the core layer, forming a first metal layer covering the one and the other surface of the core layer and an inner wall surface of the through-hole, forming a second metal layer on the first metal layer, and forming a patterned third metal layer on the second metal layer toward the one surface of the core layer along with forming a patterned fourth metal layer on the second metal layer toward the other surface of the core layer. The forming of the second metal layer includes covering the one and the other surfaces of the core layer and the first metal layer in the through-hole with the second metal layer and closing up a center part of the through-hole with the second metal layer. | 04-10-2014 |
20140087556 | METHOD OF MANUFACTURING WIRING SUBSTRATE - A method of manufacturing a wiring substrate, includes, forming an etching stop layer and a first wiring layer on a supporting member, forming a first insulating layer on the first wiring layer, forming a via hole reaching the first wiring layer, and forming the wiring layers of an n-layer and the insulating layers of an n-layer, removing the supporting member and the etching stop layer, thereby forming a build-up intermediate body, forming a second insulating layer on the wiring layer of an n-th layer, and forming a third insulating layer on first wiring layer, forming a via hole reaching the wiring layer of the n-th layer, and forming a via hole reaching the first wiring layer, forming a roughened face to the third insulating layer, and forming a second wiring layer connected to the wiring layer, and forming a third wiring layer connected to the first wiring layer. | 03-27-2014 |
20140083745 | WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a first wiring layer; a first insulating layer on the first wiring layer; a first coupling agent layer on the first insulating layer; a first copper/tin alloy layer on the first coupling agent layer; a first via hole formed through the first copper/tin alloy layer, the first coupling agent layer, and the first insulating layer to reach the first wiring layer; a metal catalyst provided on only a sidewall of the first via hole; a seed layer provided on the metal catalyst and formed only on the sidewall of the first via hole; and a metal plating layer formed on the first copper/tin alloy layer and the seed layer and filled in the first via hole to contact the first wiring layer. | 03-27-2014 |
20140076614 | WIRING SUBSTRATE - A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole. | 03-20-2014 |
20140070396 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD - A metal plate covers an opening on the upper surface of a core substrate and exposes an outer edge of the upper surface of the core substrate. A conductive layer covers the lower surface of the core substrate. A semiconductor chip bonded to a first surface of the metal plate is exposed through the opening. A first insulating layer covers the upper and side surface of the metal plate and the outer edge of the upper surface of the core substrate. A second insulating layer fills the openings of the metal plate and the conductive layer and covers the outer edge of the lower surface of the core substrate, the conductive layer, and the semiconductor chip. The metal plate is thinner than the semiconductor chip. Total thickness of the conductive layer and the core substrate is equal to or larger than the thickness of the semiconductor chip. | 03-13-2014 |
20140063768 | ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCORPORATED SUBSTRATE - An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate. | 03-06-2014 |
20140063764 | ELECTRONIC COMPONENT INCORPORATED SUBSTRATE - An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post. | 03-06-2014 |
20140055157 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. | 02-27-2014 |
20140042616 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a silicon substrate; a copper post connected to one surface of the silicon substrate; a semiconductor element having a linear expansion coefficient different from that of the silicon substrate; a metal layer provided between the semiconductor element and the silicon substrate to cover the copper post; a first alloy layer provided between the copper post and the semiconductor element, wherein the first alloy layer includes alloy of gold and a metal of the metal layer; and a second alloy layer provided between the metal layer and the semiconductor element, wherein the second alloy layer includes alloy of gold and the metal of the metal layer. | 02-13-2014 |
20140034282 | HEAT RADIATION COMPONENT AND METHOD FOR MANUFACTURING HEAT RADIATION COMPONENT - A heat radiation component includes a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate. | 02-06-2014 |
20140030504 | ELECTROLESS PLATED FILM INCLUDING PHOSPHORUS, BORON AND CARBON NANOTUBE - A nickel electroless plated film includes phosphorus, boron and carbon nanotube. | 01-30-2014 |
20140021625 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE - A wiring substrate includes an insulating layer including a reinforcement member and having a first surface and a second surface positioned on an opposite side of the first surface, an electrode pad exposed from the first surface, a layered body including first insulating layers and being formed on the second surface, the first insulating layers having a first insulating material as a main component, another layered body including second insulating layers and being formed on the layered body, the second insulating layers having a second insulating material as a main component, and another electrode pad exposed from a surface of the another layered body that is opposite to the layered body. The number of the first insulating layers is equal to that of the second insulating layers. The first insulating layers have a thermal expansion coefficient that is greater than that of the second insulating layers. | 01-23-2014 |
20130344718 | CONNECTION TERMINAL STRUCTURE, INTERPOSER, AND SOCKET - A connection terminal structure includes a substrate having one surface and including a pad formed on the one surface, a bonding part constituted by a solder, and a connection terminal having first and second ends and including a fixing part formed on the first end and a connection part formed on the second end. The fixing part includes a first surface that is bonded to the pad by way of the bonding part. The connection terminal includes a pad facing surface that faces the pad and includes the first surface. The connection terminal includes at least one groove that is formed in the pad facing surface. The at least one groove extends from the first surface to the connection part. A portion of the solder that constitutes the bonding part fills in the at least one groove. | 12-26-2013 |
20130333930 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a core layer; a through hole penetrating through the core layer in a thickness direction of the core layer; and an electronic part accommodated inside the through hole, wherein the through hole includes a first opening portion provided on a first surface of the core layer, a second opening portion provided on a second surface of the core layer, and an inward protruding portion inwardly protruding relative to the first and second opening portions, and wherein the electronic part is held by the inward protruding portion. | 12-19-2013 |
20130321974 | ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK - An electrostatic chuck plate is connected to a base plate, which includes a cooling mechanism, by an adhesive layer. The electrostatic chuck plate includes a substrate setting surface on which a processed substrate is set, an electrostatic electrode capable of attracting the processed substrate, and a resistance heat generation body capable of heating the processed substrate. The electrostatic electrode and the resistance heat generation body are incorporated in the electrostatic chuck plate. An adjustment portion is arranged at a position according to a temperature distribution of the substrate setting surface in at least one of the upper surface of the base plate and a lower surface of the electrostatic chuck plate that faces the upper surface through the adhesive layer. The adjustment portion is filled with a resin having a heat conductivity according to the temperature distribution. | 12-05-2013 |
20130319749 | PRODUCTION METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 μm or below. | 12-05-2013 |
20130319740 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate comprises a substrate having a core member with an opening in which an electronic component is disposed, a first auxiliary insulating layer formed on a first surface of the core member; a second auxiliary insulating layer formed on a second surface of the core member, the second auxiliary insulating layer having a first via hole, a filling resin portion filling a gap between the electronic component and a side surface of the opening of the core member, and a first wiring layer formed on the second auxiliary insulating layer and connected to the connection terminal of the electronic component through the first via hole. The whole of the first surface and the whole of the second surface of the core member are in direct contact with the first auxiliary insulating layer and the second auxiliary insulating layer, respectively. | 12-05-2013 |
20130314886 | WIRING BOARD AND MOUNTING STRUCTURE - A wiring board includes an insulating layer; a connection part provided on a surface of the insulating layer, the connection part including a first plating layer including a flat surface and a curved surface continuous with the flat surface, wherein the flat surface and the curved surface are exposed on the insulating layer, and an end portion of the curved surface is in contact with the surface of the insulating layer; and a second plating layer formed on an interior surface of the first plating layer so as to be coated with the first plating layer; and a via formed in the insulating layer so as to be connected to the second plating layer. | 11-28-2013 |
20130313697 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a wiring board; a semiconductor chip mounted on the wiring board; and a radiation plate mounted on the semiconductor chip, including an insulating member including a resin that is the same as a resin included in the wiring board, as a main constituent, a first metal foil formed on a first surface of the insulating member, a second metal foil formed on a second surface of the insulating member, the second surface being an opposite to the first surface, the radiation plate being provided with a through hole that penetrates the first metal foil, the insulating member and the second metal foil, and a metal layer formed to cover the inner surface of the through hole to thermally connect the first metal foil and the second metal foil by penetrating the insulating member in a thickness direction. | 11-28-2013 |
20130313018 | ELECTRONIC COMPONENT ENCLOSURE AND ELECTRONIC APPARATUS - There is provided an electronic component enclosure. The electronic component enclosure includes: an upper enclosure and a lower enclosure. The upper enclosure includes: an upper plate portion; an upper sidewall portion extending from a periphery of the upper plate portion; and a hook member extending from the upper sidewall portion. The lower enclosure is engaged with the upper enclosure, and includes: a lower plate portion; a lower sidewall portion extending from a periphery of the lower plate portion; and a reception member extending from the lower sidewall portion and engaging with the hook member. | 11-28-2013 |
20130313010 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a core layer, a through-hole penetrating through the core layer in its thickness direction, a first wiring layer formed on a first surface of the core layer, a through-hole wiring formed in the through-hole and electrically connected to the first wiring layer, and a curved first chamfered portion formed in a boundary portion between an inner side surface of the through-hole and the first surface of the core layer. The first wiring layer includes a first metal layer formed outside the first chamfered portion on the first surface of the core layer and a second metal layer formed on the first chamfered portion and the first metal layer. | 11-28-2013 |
20130313005 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a resin substrate in which first second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils. | 11-28-2013 |
20130308244 | ELECTROSTATIC CHUCK AND METHOD FOR MANUFACTURING THE ELECTROSTATIC CHUCK - An electrostatic chuck includes a pedestal part formed of metal and including a gas passage, an insulation substrate mounted on the pedestal part and including a first surface facing the pedestal part and a second surface on an opposite side of the first surface, the first surface including a first hole part communicating with the gas passage, the second surface including a second hole part having a bore diameter less than that of the first hole part and communicating with the first hole part, and an insulation flow part formed of an insulating material and including a first end provided in the first hole part and a second end provided in the gas passage. The insulation flow part is configured to allow a gas supplied from the gas passage to flow into the second hole part. | 11-21-2013 |
20130307163 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a wiring substrate, a semiconductor chip whose connection terminal is connected to the wiring substrate, an underfill resin formed from a clearance between the wiring substrate and the semiconductor chip to a periphery area of the semiconductor chip, wherein the underfill resin in the periphery area is formed at a same height as an upper surface of the semiconductor chip, an auxiliary member fixed on the semiconductor chip by an adhesive layer, and including a protruding portion which protrudes to an outside from the semiconductor chip, and the protruding portion arranged at least on the underfill resin via the adhesive layer, and a sealing resin sealing the underfill resin and at least side faces of the auxiliary member, wherein respective coefficients of thermal expansion of the auxiliary member and the adhesive layer are larger than a coefficient of thermal expansion of the semiconductor chip. | 11-21-2013 |
20130307113 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first insulating layer; a wiring layer formed on a first surface of the first insulating layer and including a first electrode pad; a semiconductor chip; a second insulating layer including a semiconductor chip accommodating portion; a third insulating layer on the second insulating layer; and a passive element including an electrode and formed of an embedded portion and a protruding portion on a second surface of the first insulating layer, wherein an end surface of the embedded portion is coated by the insulating layer, the electrode of the passive element is electrically connected to the wiring layer through a via wiring formed in the insulating layers, the first electrode pad is electrically connected to another semiconductor device through a joining portion, and a protruding amount of the protruding portion is less than a gap between the second surface and the another semiconductor device. | 11-21-2013 |
20130291378 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE - An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head. | 11-07-2013 |
20130286531 | ELECTROSTATIC CHUCK - An electrostatic chuck includes a base having a first through hole extending through the base. An electrostatic chuck attraction plate is bonded to the base. An attraction electrode is incorporated in the electrostatic chuck attraction plate to generates electrostatic charge and electrostatically attract an attraction subject. A recess is formed in the electrostatic chuck attraction plate in alignment with the first through hole. The recess partially exposes the attraction electrode. An adhesive layer is formed between the electrostatic chuck attraction plate and the base. The adhesive layer covers an inner surface of the recess. A tubular insulator is arranged in the recess. The tubular insulator includes a second through hole. A power supply terminal is arranged in the first through hole and the second through hole. The power supply terminal includes a distal portion electrically connected to the attraction electrode. | 10-31-2013 |
20130285254 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBTRATE - A wiring substrate includes a core substrate. The core substrate includes a first surface, a second surface, and an opening extending through the core substrate between the first and second surfaces. A first conductive film is formed on the first surface and covers the opening. A second conductive film is formed on the second surface. The second conductive film covers the opening. An electronic component is arranged in the opening and connected to the first conductive film. An insulator fills the opening. A first wiring portion includes alternately stacked insulative layers and wiring layers and covers the first surface of the core substrate and the first conductive film. A second wiring portion includes alternately stacked insulative layers and wiring layers, and covers the second surface of the core substrate and the second conductive film. | 10-31-2013 |
20130284509 | CONNECTION STRUCTURE, WIRING SUBSTRATE UNIT, ELECTRONIC CIRCUIT PART UNIT, AND ELECTRONIC APPARATUS - A connection structure includes a column electrode; a first connecting portion connected to one end of the column electrode; and a second connecting portion connected to another end of the column electrode via solder, wherein a height of the column electrode is a width of the first connecting portion or greater. | 10-31-2013 |
20130284499 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes: a wiring substrate body including a first surface and a second surface; a first electrode pad including a first recess therein and foamed on the first surface of the wiring substrate body; a second electrode pad including a second recess therein and formed on the first surface of the wiring substrate body; a first solder resist layer on the first surface of the wiring substrate body to cover the first and second electrode pads, the first solder resist layer including a first opening and a second opening whose opening area is larger than that of the first opening; and a first metal layer electrically connected to the first electrode pad and made of a material whose ionization tendency is smaller than that of a material of the first electrode pad. A depth of the first recess is larger than that of the second recess. | 10-31-2013 |
20130277817 | LEAD FRAME, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD OF THE SAME - A semiconductor package includes a lead frame including a chip mounting portion and a terminal portion, a semiconductor chip, which is mounted on the chip mounting portion and connected to the terminal portion, a through groove penetrating the terminal portion from one surface on a side of the semiconductor chip to another surface in a thickness direction of the terminal portion, a lid portion covering an end portion of the through groove on the side of the semiconductor chip, and a resin portion sealing the semiconductor chip, wherein the another surface of the terminal portion and a side surface of the terminal portion facing an outside of the semiconductor package are coated by a plating film. | 10-24-2013 |
20130277701 | PACKAGE AND METHOD FOR MANUFACTURING PACKAGE - A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion. | 10-24-2013 |
20130271252 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil. | 10-17-2013 |
20130269185 | WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE - A disclosed wiring substrate includes an insulating layer, a recess formed on a surface of the insulating layer, and an alignment mark formed inside of the recess, wherein a face of the alignment mark is roughened, recessed from the surface of the insulating layer, and exposed from the recess. | 10-17-2013 |
20130264695 | STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A stacked semiconductor device includes a unit component including a wiring portion formed by electrically connecting a die pad of and a lead of a lead frame, and a semiconductor package whose connection terminal is connected to the lead, wherein the unit component is stacked, and the leads located to upper and lower sides are connected mutually via an electrode. | 10-10-2013 |
20130264101 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE - There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top. | 10-10-2013 |
20130264100 | Wiring Substrate and Method for Manufacturing Wiring Substrate - A method for manufacturing a wiring substrate includes alternately stacking first wiring patterns and first insulative layers on a first surface of a core substrate and alternately stacking second wiring patterns and second insulative layers on a second surface of the core substrate at an opposite side of the first surface. The number of the second insulative layers excluding the outermost second insulative layer differs from the number of the first insulative layers. The method further includes forming a via hole in the outermost first insulative layer to expose a portion of the outermost first wiring pattern, and exposing the outermost second wiring pattern by reducing the outermost second insulative layer in thickness. The method further includes forming a via in the via hole and forming a wiring pattern, which is connected by the via to the outermost first wiring pattern, on the outermost first insulative layer. | 10-10-2013 |
20130256854 | LEAD FRAME, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LEAD FRAME - A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer. | 10-03-2013 |
20130250533 | WIRING SUBSTRATE HAVING COLUMNAR PROTRUDING PART - A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate. | 09-26-2013 |
20130249075 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package includes: a metal plate including a first surface, a second surface and a side surface; a semiconductor chip on the first surface of the metal plate, the semiconductor chip comprising a first surface, a second surface and a side surface; a first insulating layer that covers the second surface of the metal plate; a second insulating layer that covers the first surface of the metal plate, and the first surface and the side surface of the semiconductor chip; and a wiring structure on the second insulating layer and including: a wiring layer electrically connected to the semiconductor chip; and an interlayer insulating layer on the wiring layer. A thickness of the metal plate is thinner than that of the semiconductor chip, and the side surface of the metal plate is covered by the first insulating layer or the second insulating layer. | 09-26-2013 |
20130248894 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, MANUFACTURING METHOD OF THE SAME, AND LIGHT-EMITTING ELEMENT PACKAGE - A light-emitting element mounting package including a first wiring forming a first light-emitting element mounting portion, which is provided on one surface of a substrate to mount a light-emitting element, and a first through wiring having one end and another end, the one end being electrically connected to the first light-emitting element mounting portion so as to be thermally transferable, and the other end protruding from another surface of the substrate. | 09-26-2013 |
20130236138 | PHOTOELECTRIC COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - There is provided a photoelectric composite substrate including: a wiring substrate comprising a first region and a second region; an optical waveguide disposed on the first region of the wiring substrate and including: a first cladding layer on the wiring substrate; a core layer on the first cladding layer; a second cladding layer on the core layer; a wiring layer on the second region of the wiring substrate; and an insulating layer having an opening portion on the wiring layer such that the wiring layer is exposed through the opening portion, wherein the insulating layer is made of the same material as that of the core layer. | 09-12-2013 |
20130235543 | WIRING BOARD AND SEMICONDUCTOR DEVICE - A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board within the opening portion, and the plating resist layer, when used, is removed. An insulating layer is formed on the electrode, as well as the support board or solder resist layer, and a wiring portion connected to the electrode at the insulating layer is also formed. A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer. Another solder resist layer having an opening portion may then be formed on the exposed surface of the insulating layer. | 09-12-2013 |
20130233607 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes an insulation substrate including a first surface, a second surface on an opposite side of the first surface, and first and second through-holes penetrating the insulation substrate from the first surface to the second surface; a wiring layer formed on the first surface of the insulation substrate; a first via formed in the first through-hole and connected to the wiring layer; a bus line positioned away from the wiring layer and the first via, and formed on the first surface of the insulation substrate; and a second via formed in the second through-hole and connected to the bus line. | 09-12-2013 |
20130193567 | LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one direction, and standing side surfaces standing upright to a depth direction, and arranged in two opposing sides in other direction, on a backside of a die pad by a first stamping, and forming a second dimple having second inclined side surfaces inclined on the backside of the die pad by a second stamping, such that a second inclined side surfaces of the second dimple are arranged in side areas of the standing side surfaces of the first dimple, wherein the standing side surfaces are transformed into reversed inclined side surfaces inclined to a reversed direction to the first inclined side surfaces, and a front side of the die pad is semiconductor element mounting surface. | 08-01-2013 |
20130192880 | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion. | 08-01-2013 |
20130188361 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating layer on the heat sink; first and second wiring patterns on the insulating layer to be separated from each other at a certain interval; a first reflective layer including a first opening on the insulating layer so as to cover the first and second wiring patterns, wherein a portion of the first and second wiring patterns is exposed from the first opening, and wherein the portion of the first and second wiring patterns is defined as a mounting region on which a light emitting element is to be mounted; and a second reflective layer on the insulating layer, wherein the second reflective layer is interposed between the first and second wiring patterns. A thickness of the second reflective layer is smaller than that of the first reflective layer. | 07-25-2013 |
20130187190 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; a first insulating layer on the heat sink; a wiring pattern on the first insulating layer, wherein the wiring pattern is configured to mount a light emitting element thereon; and a second insulating layer on the first insulating layer such that the wiring pattern is exposed from the second insulating layer. | 07-25-2013 |
20130187182 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member. | 07-25-2013 |
20130185936 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 07-25-2013 |
20130163632 | LIGHT EMITTING DEVICE - A light emitting device includes: a first light emitting element mounting unit including: a first substrate; a first light emitting element on a first surface of the first substrate; and a first substrate holder which includes a first column, and a first protrusion which extends from the first column toward the first light emitting element and bonded to the first surface of the first substrate; and a second light emitting element mounting unit including: a second substrate; a second light emitting element mounted on a first surface of the second substrate; and a second substrate holder which includes: a second column, and a second protrusion which extends from the second column toward the second light emitting element and bonded to the first surface of the second substrate. The second light emitting element mounting unit is stacked on the first light emitting element mounting unit. | 06-27-2013 |
20130163206 | SEMICONDUCTOR DEVICE - A semiconductor device includes a structure in which a semiconductor element (chip) is mounted in a cavity formed in a wiring board with an adhesive interposed between the chip and a bottom surface of the cavity, and electrode terminals of the chip are connected via wires to wiring portions formed on the board around the cavity. The chip is mounted in close contact with a side wall of the cavity, the side wall being near a region where a wiring for higher frequency compared with other wirings within the wiring portion is formed. A recessed portion is provided in a region of the bottom surface of the cavity, and a thermal via extending from the bottom surface of the recessed to the outside of the board is provided, the region being near a portion where the chip is in close contact. | 06-27-2013 |
20130161813 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate. The semiconductor substrate includes a first surface, a second surface, and a through hole that extends through the semiconductor substrate from the first surface to the second surface. An insulating layer covers the first surface and includes an opening at a location facing the through hole. An insulating film covers an inner wall of the through hole and an inner wall of the opening. A through electrode is formed in the through hole and the opening that are covered by the insulating film. A first connecting terminal is formed integrally with the through electrode to cover one end of the through electrode exposed from the insulating layer. The first connecting terminal has a larger size than the through electrode as viewed from above. | 06-27-2013 |
20130161776 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes a first wiring substrate including a component mounting area, a second wiring substrate stacked on the first wiring substrate, in which an opening portion is provided in a part corresponding to the component mounting area, and connected to the first wiring substrate via solder bumps which are arranged on a periphery of the component mounting area, a frame-like resin dam layer formed between the solder bumps on the periphery of the component mounting area, and surrounding the component mounting area, and an electronic component mounted on the component mounting area of the first wiring substrate, wherein a sealing resin is filled between the first wiring substrate and the second wiring substrate such that the component mounting area is formed as a resin non-forming area by the resin dam layer. | 06-27-2013 |
20130154102 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD - A support substrate includes a first surface and a second surface located above the level of the first surface. Chips are mounted on the first surface. A first insulating film is disposed over each chip. First conductive plugs are connected to the chip extending through each first insulating film. Filler material made of resin filling a space between chips. Wirings are disposed over the first insulating film and the filler material for interconnecting different chips. The second surface, an upper surface of the first insulating film and an upper surface of the filler material are located at the same level. | 06-20-2013 |
20130153946 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THESE - A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer. | 06-20-2013 |
20130153945 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE, LIGHT-EMITTING ELEMENT PACKAGE, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion. | 06-20-2013 |
20130153271 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 06-20-2013 |
20130148253 | SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE AND MANUFACTURING METHOD THEREOF - A substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an object to be attracted; a base plate to which the electro static chuck is fixed; an adhesive layer formed between the electro static chuck and the base plate; and a heat insulation layer formed between the electro static chuck and the base plate, wherein the electro static chuck includes a base body having a mounting surface on which the object to be attracted is mounted, a heat generator directly formed on a surface opposite to the mounting surface of the base body, and an insulating layer formed to cover the heat generator. | 06-13-2013 |
20130146220 | METHOD OF MANUFACTURING WIRING SUBSTRATE - Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate. | 06-13-2013 |
20130143062 | METHOD AND SUPPORT MEMBER FOR MANUFACTURING WIRING SUBSTRATE, AND STRUCTURE MEMBER FOR WIRING SUBSTRATE - A wiring substrate manufacturing method includes forming a layered configuration including a first metal layer, a peeling layer, and a second metal layer, removing an edge part of the layered configuration, so that the first metal layer is smaller than the second metal layer from a plan view, forming a support body by adhering the first metal layer to a base member and adhering the base member to a process part, the process part being formed by the removing of the edge part, forming a wiring substrate on the second metal layer, removing a part of the support body and a part of the wiring substrate that are superposed with respect to the process part from a plan view, and separating the second metal layer and the wiring substrate from the support body after the removing of the parts of the support body and the wiring substrate. | 06-06-2013 |
20130140692 | WIRING SUBSTRATE, MANUFACTURING METHOD OF WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer. | 06-06-2013 |
20130134594 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor element on which electrode pads are laid out. A wiring substrate includes connecting pads respectively arranged in correspondence with the electrode pads. Pillar-shaped electrode terminals are respectively formed on the electrode pads of the semiconductor element. A solder joint electrically connects a distal portion of each electrode terminal and the corresponding connecting pad on the wiring substrate. Each electrode terminal includes a basal portion, which is connected to the corresponding electrode pad, and a guide, which is formed in the distal portion. The guide has a smaller cross-sectional area than the basal portion as viewed from above. The guide has a circumference and the basal portion has a circumference that is partially flush with the circumference of the guide. The guide is formed to guide solder toward the circumference of the guide. | 05-30-2013 |
20130134593 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR ELEMENT - A method for manufacturing a semiconductor device includes preparing a semiconductor element including electrode pads laid out along the periphery of the semiconductor element in a tetragonal frame-shaped array to form a line of electrode pads along each side of the semiconductor element, preparing a wiring substrate including connection pads corresponding to the electrode pads, applying solder including a bulging central portion on an upper surface of each connection pad, forming pillar-shaped electrode terminals on the electrode pads so that each electrode terminal has an axis separated from a peak of the bulging central portion of the solder on the corresponding connection pad in a longitudinal direction of the corresponding connection pad, and electrically connecting the electrode terminals with the solder to the connection pad. | 05-30-2013 |
20130134127 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 05-30-2013 |
20130126916 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE PACKAGE - A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively. | 05-23-2013 |
20130122657 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - There is provided a method of manufacturing a semiconductor package. The method includes: (a) providing a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein a pad is formed on the first surface; (b) disposing the semiconductor chip on a supporting substrate such that the first surface is directed upward; (c) forming an encapsulation resin layer on the supporting substrate so as to cover the semiconductor chip; and (d) polishing the encapsulation resin layer to expose a top surface of the pad. | 05-16-2013 |
20130121009 | Light Emitting Device - A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion. | 05-16-2013 |
20130120649 | CAMERA MODULE AND MOBILE TERMINAL UNIT - A camera module of the present invention includes a wiring substrate having a connection pad, and on which an imaging device is mounted, on an upper surface side thereof, and a lens unit provided on the wiring substrate and equipped with a lens portion arranged over the imaging device, an actuator (voice coil motor) for driving the lens portion, and projected connection terminal protruding downward and connected to the actuator. The projected connection terminal of the lens unit is arranged on the connection pad of the wiring substrate, and the connection pad and the projected connection terminal are joined mutually by a conductive adhesive agent. | 05-16-2013 |
20130119562 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - A semiconductor package includes a semiconductor chip, a first insulating layer formed to cover the semiconductor chip, a wiring structure formed on the first insulating layer. The wiring structure has an alternately layered configuration including wiring layers electrically connected to the semiconductor chip and interlayer insulating layers each located between one of the wiring layers and another. The interlayer insulating layers include an outermost interlayer insulating layer located farthest from a surface of the first insulating layer. A groove formed in the outermost interlayer insulating layer passes through the outermost interlayer insulating layer in a thickness direction. | 05-16-2013 |
20130113015 | Substrate, Light Emitting Device and Method for Manufacturing Substrate - A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other. | 05-09-2013 |
20130105964 | Semiconductor Device | 05-02-2013 |
20130100625 | WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes a resin substrate in which reinforcement members are arranged horizontally, a through electrode filled in a through hole penetrating the substrate in a thickness direction, and wiring layers respectively formed on both surfaces of the substrate and electrically connected to each other via the through electrode. The reinforcement members are arranged such that reinforcement members arranged in a middle region of the substrate in the thickness direction has higher density than reinforcement members arranged in the regions other than the middle region of the substrate. | 04-25-2013 |
20130099273 | WIRING SUBSTRATE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate. | 04-25-2013 |
20130097856 | METHOD OF FABRICATING A WIRING BOARD - A method of fabricating a wiring board includes forming a surface plating layer on a support member, and forming an external connecting pad on the surface plating layer formed on the support member such that an area of the external connecting pad formed on the surface plating layer is smaller than an area of the surface plating layer. The method also includes forming an insulating layer and a wiring layer on a surface of the support member where the external connecting pad is formed, and removing the support member. | 04-25-2013 |
20130084718 | WIRING SUBSTRATE WITH SPRING TERMINAL AND MOUNTING STRUCTURE FOR THE SAME, AND SOCKET - A wiring substrate with spring terminal, includes a wiring substrate including a first face and a second face on an opposite side to the first face, and a spring terminal mounted on the first face of the wiring substrate, wherein a wiring layer provided on the first face of the wiring substrate includes a first wiring pattern connected electrically to the spring terminal, and a first ground pattern grounded to a ground potential, and the first ground pattern is insulated from the first wiring pattern, and is formed on the first face to surround the first wiring pattern. | 04-04-2013 |
20130082378 | RESIN SEALING METHOD OF SEMICONDUCTOR DEVICE - A resin sealing method of a semiconductor device includes: positioning semiconductor devices at predetermined positions of an adhesive layer formed on a support body and adhering the semiconductor devices thereto, sealing a part of each of the semiconductor devices with resin by curing a first seal resin in a fluidization state so as to fix the semiconductor devices adhered to the predetermined positions of the adhesive layer formed on the support body, setting the semiconductor devices fixed to the predetermined positions of the adhesive layer formed on the support body in a mold and sealing the exposure parts of the semiconductor devices exposed from the first seal resin with a second seal resin, and removing the support body and the adhesive layer from the semiconductor devices sealed with the resin. | 04-04-2013 |
20130081796 | THERMAL INTERFACE MATERIAL, METHOD FOR MANUFACTURING THERMAL INTERFACE MATERIAL, AND JOINING STRUCTURE USING THERMAL INTERFACE MATERIAL - A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors. | 04-04-2013 |
20130075145 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height. | 03-28-2013 |
20130069251 | WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE - A wiring substrate includes: a substrate layer made of glass or silicon and including: a first surface formed with a first hole; and a second surface formed with a second hole and being opposite to the first surface, wherein the first hole is communicated with the second hole; a connection pad formed in the second hole; a first wiring layer formed in the first hole and electrically connected to the connection pad; a first insulation layer formed on the first surface of the substrate layer to cover the first wiring layer; and a second wiring layer formed on the first insulation layer and electrically connected to the first wiring layer. A diameter of the first hole is gradually decreased from the first surface toward the second surface, and a diameter of the second hole is gradually decreased from the second surface toward the first surface. | 03-21-2013 |
20130069245 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor chip including a target circuit surface and a side surface, a first sealing insulating layer including a first surface positioned toward the target circuit surface and a second surface positioned opposite to the first surface, the first sealing insulating layer sealing the target circuit surface and the side surface, a wiring layer formed on the first surface of the first sealing insulating layer, an insulating layer formed on the wiring layer, a second semiconductor chip mounted on the second surface of the first sealing insulating layer, and a second sealing insulating layer formed on the second surface and sealing the second semiconductor chip. | 03-21-2013 |
20130069219 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor chip including a target circuit surface and a side surface, a first sealing insulating layer including a first surface positioned toward the target circuit surface and configured to seal the target circuit surface and the side surface, at least one wiring layer formed on the first surface of the first sealing insulating layer, at least one insulating layer formed on the at least one wiring layer, a second semiconductor chip mounted on the at least one insulating layer, and a second sealing insulating layer formed on the at least one insulating layer and configured to seal the second semiconductor chip. | 03-21-2013 |
20130062778 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a flat-plate shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a flat-plate shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a first signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode. | 03-14-2013 |
20130062754 | WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE - A wiring substrate includes: a substrate body made of an inorganic material; a first electrode portion, having a rectangular plane shape, which penetrates through the substrate body in a thickness direction of the substrate body; a second electrode portion, having a rectangular plane shape, which penetrates through the substrate body in the thickness direction and faces the first electrode portion at a prescribed interval; and a signal electrode, which is provided between the first electrode portion and the second electrode portion and penetrates through the substrate body in the thickness direction, wherein one of the first electrode portion and the second electrode portion is a ground electrode and the other is a power electrode. | 03-14-2013 |
20130062108 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: a first wiring layer; a first insulating layer formed on the first wiring layer and including a reinforcing material therein, the first insulating layer having a first opening; a contact layer formed on the first insulating layer and having a second opening communicated with the first opening; and a second wiring layer comprising a second via and a second wiring pattern connected to the second via. The second wiring pattern is formed on the contact layer, and the second via is filled in the first and second openings. An adhesion property between the contact layer and the second wiring pattern is higher than that between the first insulating layer and the second wiring pattern, and a thickness of the contact layer is smaller than that of the first insulating layer. | 03-14-2013 |
20130056251 | WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE INCLUDING WIRING SUBSTRATE - A wiring substrate includes an inorganic substrate including a substrate body formed of an inorganic material, a wiring pattern formed on the substrate body, and an external connection terminal being electrically connected to the wiring pattern, an organic substrate that is formed below the inorganic substrate, the organic substrate including an insulating layer and a wiring layer formed on the insulating layer, and a bonding layer interposed between the inorganic substrate and the organic substrate, the bonding layer including a stress buffer layer and a penetration wiring that penetrates the stress buffer layer. A thermal expansion coefficient of the stress buffer layer is greater than a thermal expansion coefficient of the inorganic substrate and less than a thermal expansion coefficient of the organic substrate. The wiring pattern and the wiring layer are electrically connected by way of the penetration wiring. | 03-07-2013 |
20130048359 | SUBSTRATE WITH SPRING TERMINAL AND METHOD OF MANUFACTURING THE SAME - A substrate with spring terminals includes a substrate including a connection pad, a spring terminal whose connection portion is connected to the connection pad by a solder layer, and a resin portion formed to cover a side surface of the solder layer, thereby the failure that the spring terminal falls down is prevented. | 02-28-2013 |
20130048350 | BASE MEMBER - A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer. | 02-28-2013 |
20130048217 | ELECTROSTATIC CHUCK AND SEMICONDUCTOR/LIQUID CRYSTAL MANUFACTURING EQUIPMENT - An electrostatic chuck includes, a chuck function portion including a plurality of chuck regions on which an attractable object is placed respectively, and a concave surface portion provided in an outer region of the chuck regions, and electrodes arranged in an inner part of the chuck function portion corresponding to the chuck regions and an inner part of the chuck function portion corresponding to the concave surface portion, respectively. | 02-28-2013 |
20130043581 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wiring substrate, a first semiconductor chip mounted on the wiring substrate, and a second semiconductor chip mounted on the wiring substrate. The second semiconductor chip generates less heat than the first semiconductor chip. A heat dissipation plate is arranged on the wiring substrate and partially at a higher location than the first and second semiconductor chips. The heat dissipation plate is connected to the first semiconductor chip and includes an opening formed at a location corresponding to an upper surface of the second semiconductor chip. The upper surface of the second semiconductor chip is entirely exposed from the heat dissipation plate through the opening. | 02-21-2013 |
20130037943 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor device includes a semiconductor substrate, which includes a through hole that extends through the semiconductor substrate. An insulative layer includes a first surface, an opposite second surface covering the semiconductor substrate, and an opening aligned with the through hole. An insulative film covers an inner wall surface of the semiconductor substrate and the opening. A through electrode is formed in the through hole and the opening inward from the insulative film. The through electrode includes a first end surface that forms a pad exposed from the first surface of the insulative layer. The first end surface of the through electrode is flush with the first surface of the insulative layer. | 02-14-2013 |
20130011096 | OPTICAL WAVEGUIDE LAMINATED WIRING BOARD - A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion. | 01-10-2013 |
20130001767 | PACKAGE AND METHOD FOR MANUFACTURING PACKAGE - A method for manufacturing a package, includes preparing a substrate having a first surface on which a connecting pad is formed, mounting a sacrificing material on the connecting pad, forming a package portion covering the first surface of the substrate, exposing the sacrificing material from a surface of the package portion, and removing the exposed sacrificing material from the side of the surface of the package portion, and forming an opening portion in the package portion on the connecting pad. | 01-03-2013 |
20130000955 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part. | 01-03-2013 |
20120327626 | WIRING SUBSTRATE, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE - One embodiment provides a wiring substrate including: a core substrate having an insulative base member, the insulative base member having a first surface and a second surface, a plurality of linear conductors penetrating through the insulative base member from the first surface to the second surface; an inorganic material layer joined to at least one of the first surface and the second surface of the insulative base member; and a penetration line penetrating through the inorganic material layer, wherein one end of the penetration line is electrically connected to a corresponding part of the linear conductors, without intervention of a bump. | 12-27-2012 |
20120327574 | ELECTRONIC COMPONENT - At least one embodiment provides an electronic component including: connection electrodes; and flexible electrode terminals connected to the respective connection electrodes so that spaces are formed under the respective flexible electrode terminals, each flexible electrode terminal having a main body and a connection projection provided on a top surface of the main body, each flexible electrode terminal being elastically deformable when receiving pressure. | 12-27-2012 |
20120326334 | INTERPOSER, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE - At least one embodiment provides an interposer including: a lower wiring substrate; an upper wiring substrate disposed over the lower wiring substrate via a gap; and through-electrodes which penetrate through the upper wiring substrate and the lower wiring substrate across the gap to thereby link the upper wiring substrate and the lower wiring substrate, portions of the through-electrodes being exposed in the gap. | 12-27-2012 |
20120325529 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion. | 12-27-2012 |
20120322205 | METHOD FOR MANUFACTURING WIRING SUBSTRATE - A method for manufacturing a wiring substrate includes forming a first pad and a second pad on one side of a substrate, plating a surface of the second pad to form a bonding pad used for a wire-bonded connection, covering a surface of the first pad with an adhesive layer, adhering solder powder to the adhesive layer, applying flux containing halogen to the substrate, and melting the solder powder and covering the first pad with a solder to form a connection pad used for a flip-chip-connection. The flux has a halogen concentration of less than or equal to 0.15 wt %. | 12-20-2012 |
20120319289 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip having plural electrode pads, and a wiring substrate having plural electrode pads to mount the semiconductor chip on the wiring substrate, wherein the plural electrode pads of the semiconductor chip include a first electrode pad, and a second electrode pad arranged on an outer periphery side of the first electrode pad, the plural electrode pads of the wiring substrate include a third electrode pad, and a fourth electrode pad arranged on an outer periphery side of the third electrode pad, the first electrode pad and the third electrode pad are connected via a first connecting portion, and the second electrode pad and the fourth electrode pad are connected via a second connecting portion including a pin. | 12-20-2012 |
20120319274 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad. The resin layer is formed between the mounting surface of the circuit substrate and the support plate and the support plate is subsequently removed, whereby a truncated-cone-shaped via is formed in the resin layer along the truncated-cone-shaped solder layer. A reflow process is thereafter performed, whereby the truncated-cone-shaped solder layer is formed into a spherical solder layer within the truncated-cone-shaped via. | 12-20-2012 |
20120318964 | OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME, AND OPTICAL WAVEGUIDE DEVICE - An optical wave guide includes an optical waveguide layer in which a core layer is surrounded by a cladding layer, a light path converting portion provided to a light entering side and a light emitting side of the optical waveguide layer respectively, a light entering portion demarcated in an outer surface of the cladding layer, in which a light is entered to the light path converting portion of the light entering side; and a light emitting portion demarcated in an outer surface of the cladding laver, in which a light from the light path converting portion of the light emitting side is emitted, wherein an outer surface of the cladding layer except the light entering portion and the light emitting portion is formed as a roughened. surface. | 12-20-2012 |
20120315803 | CONNECTION TERMINAL, METHOD FOR MANUFACTURING CONNECTION TERMINAL, AND SOCKET INCLUDING CONNECTION TERMINAL - A connection terminal for connecting a first connection object and a second connection object and including a metal plate having a resilient property, an insulating layer covering at least a part of the metal plate, a conductive layer formed on at least a part of the insulating layer, first and second fixing parts configured to be fixed to corresponding adjacent pads of the second connection object, and first and second connection parts configured to contact corresponding adjacent pads of the first connection object. The first fixing part and the first connection part are positioned opposite from each other. The second fixing part and the second connection part are positioned opposite from each other. The first and the second connection parts are faced outward to the first connection object. The first and the second fixing parts are faced outward to the second connection object. | 12-13-2012 |
20120313265 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed. | 12-13-2012 |
20120313245 | SEMICONDUCTOR DEVICE - One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films. | 12-13-2012 |
20120313226 | WIRING SUBSTRATE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a wiring substrate, and a semiconductor chip, wherein the wiring substrate includes a glass plate having an opening portion penetrating through a first surface of the glass plate to a second surface of the glass plate, a resin portion penetrating through the first surface to the second surface, and a through wiring penetrating through the resin portion from the first surface to the second surface to electrically connect a first wiring layer formed on a side of the first surface with a third wiring layer formed on a side of the second surface, wherein the semiconductor chip is accommodated inside the opening portion. | 12-13-2012 |
20120313203 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame. | 12-13-2012 |
20120306100 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device, includes temporarily fixing a semiconductor chip to a supporting member to direct a connection electrode toward the supporting member side, forming an insulating layer for preventing resin-permeation covering the semiconductor chip, on the supporting member and the semiconductor chip, forming a resin substrate sealing a periphery and a back surface side of the semiconductor chip, on the insulating layer, and removing the supporting member to expose the connection electrode of the semiconductor chip. A build-up wiring is connected directly to the connection electrode of the semiconductor chip. | 12-06-2012 |
20120298413 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a body including first and second surfaces, a trench having an opening on the first surface and including, a bottom surface, a side surface, and a slope surface that connects a peripheral part of the bottom surface to a one end part of the side surface and widens from the peripheral part to the one end part, the one end part being an end part opposite from the first surface, a hole including an end communicating with the bottom surface and another end being open on the second surface, a first layer filling at least a portion of the hole and including a top surface toward the trench, a second layer covering the top surface and formed on at least a portion of the trench except for a part of the side surface, and a third layer covering the second layer and filling the trench. | 11-29-2012 |
20120293973 | MULTILAYERED WIRING BOARD AND METHOD FOR FABRICATING THE SAME - In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers | 11-22-2012 |
20120287955 | OPTICAL SEMICONDUCTOR ELEMENT PACKAGE AND OPTICAL SEMICONDUCTOR DEVICE - An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion. | 11-15-2012 |
20120287552 | SUBSTRATE TEMPERATURE ADJUSTING-FIXING DEVICE - A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses. | 11-15-2012 |
20120261832 | Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board - A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part. | 10-18-2012 |
20120261801 | Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board - A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole. | 10-18-2012 |
20120258636 | CONNECTING TERMINAL STRUCTURE, SOCKET AND ELECTRONIC PACKAGE - A connecting terminal structure includes a supporting body; a plurality of first electrode pads provided on a first side of the supporting body; a plurality of second electrode pads provided on a second side of the supporting body; a flexible substrate configured to electrically connect the first electrode pads to the second electrode pads; and a plurality of connecting terminals joined to at least one of the first electrode pads and the second electrode pads. | 10-11-2012 |
20120248591 | LEAD FRAME AND SEMICONDUCTOR DEVICE - A lead frame for a resin-seal type semiconductor device, which includes a semiconductor element having an electrode, a bonding wire connected to the electrode of the semiconductor element, and a sealing resin covering and sealing the semiconductor element and the bonding wire. The lead frame includes a substrate frame, a four-layer plating, and a three-layer plating. The substrate frame include leads, a connection region, which is sealed by the sealing resin and connected to the bonding wire, and an exposed region, which is not sealed by the sealing resin. A four-layer plating is applied to a portion of the substrate frame that is to be connected to the bonding wire and sealed by the sealing resin. A three-layer plating is applied to an exposed region of the substrate frame that is exposed from the sealing resin. | 10-04-2012 |
20120248588 | LEAD FRAME - A lead frame including rails, section bars, and lead frame cells. The rails are respectively arranged at edges of the lead frame extending in a first direction. The section bars extend between the rails in a second direction and are orthogonal to the rails. The lead frame cells are aligned along the section bars. At least one of the section bars includes a rib extending in the second direction and formed through a half blanking process. | 10-04-2012 |
20120247814 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a wiring substrate, includes obtaining a laminated body in which a first copper tin alloy layer and a copper layer are arranged in sequence on a first coupling agent layer, on a first insulating resin layer, forming a seed layer on the copper layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a metal plating layer in the opening portion of the plating resist by applying an electroplating that utilizes the seed layer as a plating power feeding path, removing the plating resist, and forming a first wiring layer on the first coupling agent layer by etching the seed layer, the copper layer, and the first copper tin alloy layer while using the metal plating layer as a mask. | 10-04-2012 |
20120235292 | HEAT RADIATING COMPONENT AND SEMICONDUCTOR PACKAGE HAVING THE SAME - In one embodiment, there is provided a heat radiating component. The heat radiating component includes: a base material made mainly of copper; an electroplated aluminum layer that covers at least a part of a surface of the base material; and an alumite layer formed on the electroplated aluminum layer and formed by anodic-oxidizing the electroplated aluminum layer. | 09-20-2012 |
20120229157 | PROBE CARD AND MANUFACTURING METHOD THEREOF - In one embodiment, a probe card is provided. The probe card includes: a substrate having a first surface and a second surface opposite to the first surface; a through hole formed through the substrate and extending between the first surface and the second surface; an elastic member formed in the through hole to extend to the first surface; a through electrode formed in through hole to extend to the second surface; a first trace on a surface of the elastic member to be electrically connected to the through electrode; and a contact bump on the elastic member via the first trace to be electrically connected to the first trace, wherein the contact bump is electrically connected to an electrode pad formed on a DUT (device under test) when an electrical testing is performed on the DUT using the probe card. | 09-13-2012 |
20120223732 | TRANSMISSION DEVICE AND METHOD OF TESTING TRANSMISSION CHARACTERISTIC OF DUT - There is provided a transmission device. The transmission device includes: an adapter device ( | 09-06-2012 |
20120222894 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATES - A wiring substrate includes a wiring layer, an outermost insulating layer laminated to the wiring layer, and a pad electrically connected to the wiring layer and exposed from a surface of the outermost insulating layer. The pad consists essentially of a first metal layer and a second metal layer. The first metal layer includes a first surface, which is exposed from the surface of the outermost insulating layer, and a second surface, which is located opposite to the first surface. The second metal layer includes is formed between the second surface of the first metal layer and the wiring layer. The first metal layer is formed from a metal selected from gold or silver or from an alloy including at least one of gold and silver. The second metal layer is formed from palladium or a palladium alloy. | 09-06-2012 |
20120216997 | COMPOSITE PLATING LIQUID - In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method. | 08-30-2012 |
20120204424 | METHOD FOR MANUFACTURING WIRING BOARD - There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer. | 08-16-2012 |
20120189839 | METHOD OF MANUFACTURING METAL COMPOSITE MATERIAL, METAL COMPOSITE MATERIAL, METHOD OF MANUFACTURING HEAT DISSIPATING COMPONENT, AND HEAT DISSIPATING COMPONENT - A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder. | 07-26-2012 |
20120175157 | WIRING BOARD AND METHOD OF PRODUCING THE SAME - A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the wiring board, an outer peripheral edge of the external connection pad is retracted from an outer peripheral edge of the surface plated layer toward a center of the external connection pad. | 07-12-2012 |
20120175153 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings. | 07-12-2012 |
20120161311 | WIRING BOARD AND SEMICONDUCTOR PACKAGE - A wiring board includes a stacked body having a plurality of insulating layers and a plurality of wiring layers which are alternately stacked, and a solder-resist layer being formed on one side of the stacked body and covering the wiring layer exposed to the one side of the stacked body. The insulating layer is exposed to the other side of the stacked body. The solder-resist layer is in a transparent or semitransparent light yellow color. | 06-28-2012 |
20120155823 | TWO-LAYER OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME - A two-layer optical waveguide includes a core layer having a first surface and a second surface opposite to the first surface, and a cladding layer laminated on the first surface of the core layer. The two-layer optical waveguide further includes a mirror structure provided at a plurality of positions on the first surface of the core layer, the mirror structure directing a light signal which travels in the core layer, toward the second surface of the core layer. Each mirror structure includes an inclined plane formed on the first surface of the core layer, and a metal film formed on the inclined plane. | 06-21-2012 |
20120155822 | OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME, AND OPTICAL WAVEGUIDE DEVICE - A method of manufacturing an optical waveguide, includes forming a first light path core layer having a first light path length on a first cladding layer, forming a groove portion having an inclined surface in an end side of the first light path core layer, forming a second light path core layer having a second light path length which is longer than the first light path length, in a lateral area of the first light path core layer, forming a groove portion having an inclined surface, arranged to an outer side than the groove portion of the first light path core layer, in an end side of the second light path core layer, forming partially a metal layer on the respective inclined surfaces of the first and second light path core layer, and forming a second cladding layer covering the first and second light path core layer. | 06-21-2012 |
20120155048 | WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM - There are provided steps of providing a dielectric layer and a wiring layer on a surface of a support to form an intermediate body, removing the support from the intermediate body to obtain a wiring board, and carrying out a roughening treatment over a surface of the support before the intermediate body forming step. | 06-21-2012 |
20120154918 | FRAME-ATTACHED ANTI-REFLECTION GLASS AND METHOD OF MANUFACTURING THE SAME - A frame-attached anti-reflection glass (a cap for optical device) includes a plate-shaped member including an anti-reflection film formed on at least one surface of a plate-shaped glass, and a frame-shaped member made of silicon joined to a peripheral portion on one surface side of the plate-shaped member. The anti-reflection film includes two partial films having different compositions, and one partial film is a light-absorbent film. The two partial films are continuously formed on the plate-shaped glass, and respective surfaces of each partial film are on a level with each other. The plate-shaped glass and the frame-shaped member (silicon) are joined together by anodic bonding. | 06-21-2012 |
20120153509 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR - According to one embodiment, there is provided a semiconductor package including: a semiconductor chip; a resin portion formed to cover the semiconductor chip; a wiring structure formed on the resin portion and electrically connected to the semiconductor chip; and a warpage preventing member provided above the resin portion to have a thermal expansion coefficient closer to that of the semiconductor chip than to that of the wiring structure. | 06-21-2012 |
20120153507 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method include disposing a semiconductor chip having an electrode pad formed on a circuit forming surface on one surface of a support so that the electrode pad contacts with the one surface of the support, forming a first insulating layer on the one surface of the support so that the first insulating layer covers at least a side surface of the semiconductor chip, removing the support and forming an interconnection terminal on the electrode pad, forming a second insulating layer on the circuit forming surface of the semiconductor chip and the first insulating layer so that the second insulating layer covers the interconnection terminal, exposing an end portion of the interconnection terminal from a top surface of the second insulating layer, and forming a wiring pattern that is electrically connected to the end portion of the interconnection terminal, on the top surface of the second insulating layer. | 06-21-2012 |
20120153506 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A wiring substrate includes a plurality of connection pads, and a protection insulating layer in which opening portion exposing said plurality of connection pads collectively is provided, wherein a notched opening portion is provided to a sidewall of the opening portion of the protection insulating layer in area between said plurality of connection pads. When a semiconductor chip is flip-chip connected to the connection pads by the prior sealing technology, a void occurring in the sealing resin is trapped in the notched opening portion. | 06-21-2012 |
20120153457 | SEMICONDUCTOR PACKAGE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE - According to one embodiment, there is provided a semiconductor package manufacturing method utilizing a support body in which a first layer is stacked on a second layer, the method including: a first step of forming an opening in the first layer to expose the second layer therethrough; a second step of arranging a semiconductor chip on the second layer through the opening; a third step of forming a resin portion on the first layer to cover the semiconductor chip; and a fourth step of forming a wiring structure on the resin portion so as to be electrically connected to the semiconductor chip. | 06-21-2012 |
20120149249 | SOCKET AND SEMICONDUCTOR DEVICE PROVIDED WITH SOCKET - There is provided a socket. The socket includes: a wiring substrate including a first surface and a second surface opposite to the first surface; a plurality of connection terminals provided on the wiring substrate and each including a contact portion, wherein the connection terminals extend from the first surface of the wiring substrate; and a positioning member formed in a frame shape and provided on the wiring substrate to surround the connection terminals. The positioning member includes a sidewall plate having a plurality of holes formed therethrough. | 06-14-2012 |
20120144666 | METHOD FOR MANUFACTURING WIRING BOARD - There is prepared an insulation layer generation member having a support film and a semi-cured insulation layer provided on a surface of the support film. Subsequently, the insulation layer generation member is affixed to a pad such that the pad contacts the semi-cured insulation layer. The semi-cured insulation layer is cured, to thus generate an insulation layer. Subsequently, the insulation layer is exposed to laser by way of the support film, thereby opening an opening in the insulation layer. | 06-14-2012 |
20120141063 | OPTICAL WAVEGUIDE AND METHOD OF MANUFACTURING THE SAME, AND OPTICAL WAVEGUIDE DEVICE - A method of manufacturing an optical waveguide, includes preparing a light path conversion component including a structure in which a protruding portion having a light path conversion inclined surface is covered with a metal layer and the metal layer serves as a light path conversion mirror, and a structural body in which a core layer is formed on a first cladding layer and an opening portion is provided in an end side of a light path of the core layer, arranging the light path conversion mirror of the light path conversion component in the opening portion of the core layer, and forming a second cladding layer covering the core layer, wherein a light path of a light that propagates through the core layer is converted toward a first cladding layer side by the light path conversion mirror. | 06-07-2012 |
20120133056 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS AND SEMICONDUCTOR DEVICE FABRICATING METHOD - There is provided a semiconductor device which includes a primary semiconductor chip | 05-31-2012 |
20120128021 | LIGHT EMITTING DEVICE AND PACKAGE COMPONENT - A light emitting device includes a light emitting element mounting component, including a cubic package component formed of a silicon member covered with a insulating layer, and the package component including a bottom portion, a sidewall portion provided to stand upright on both ends of the bottom portion respectively, and a backwall portion provided to stand upright on an innermost part of the bottom portion, and the package component in which a cavity is provided in an inner side, and a light emitting element mounted on an inner side surface of the backwall portion of the package component, and including a light emitting surface on an upper end part, wherein a plurality of said light emitting element mounting components are stacked in a depth direction of the cavity to direct toward an identical direction. | 05-24-2012 |
20120126423 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough. | 05-24-2012 |
20120120624 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE - A wiring substrate | 05-17-2012 |