Senju Metal Industry Co., Ltd. Patent applications |
Patent application number | Title | Published |
20160074971 | Lead-Free Solder Alloy - Disclosed is a Sn—Bi—Cu—Ni series lead-free solder alloy which has a low melting point, good ductility and high tensile strength, suppresses strain in the substrate by suppressing generation of P-rich layer on a joining interface to have high shear strength and is superior in joining reliability. In order to suppress diffusion of Cu and Ni in an electrode and to maintain elongation and wettability of the solder alloy, a solder alloy has an alloy composition containing 31 to 59 mass % of Bi, 0.3 to 1.0 mass % of Cu, 0.01 to 0.06 mass % of Ni and balance of Sn. | 03-17-2016 |
20150343460 | GAS-INTAKE-PORT ARRAY STRUCTURE AND SOLDERING APPARATUS - In a gas-intake-port array structure, which enables any temperature fluctuation during conveying time of a printed circuit board, a semiconductor wafer or the like to be reduced and allows the printed circuit board and the like to be very uniformly heated or cooled, a nozzle pattern P | 12-03-2015 |
20150323007 | HALF BEARING - To provide a half bearing which has excellent abrasion resistance and surely forms an oil film under boundary lubrication in which it is difficult to form any oil film. A half bearing | 11-12-2015 |
20150313025 | Cu BALL - To provide Cu ball that has less α dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu. | 10-29-2015 |
20150305216 | Guide Vane and Jetting Apparatus - A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate | 10-22-2015 |
20150273584 | SLIDING MEMBER AND PRODUCTION METHOD FOR SAME - A sliding member having a hardness proper for an environment where a high-pressure is applied and having a good abrasion resistance. A sliding member | 10-01-2015 |
20150262926 | ELECTRONIC DEVICE INCLUDING SOLDERED SURFACE-MOUNT COMPONENT - The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. The surface-mount component formed using (Sn—Sb)-based solder material having high melting point as the solder material for die pad, the (Sn—Sb)-based solder material containing Cu not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material as the mounting solder material with the solder material being applied on the terminal portion. The melting of die-bonding solder material is prevented even at the heating temperature (240 degrees C. or less) of a reflow furnace. | 09-17-2015 |
20150221606 | Lead-Free Solder Ball - A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total emount of 0.003-0.1 mass %. | 08-06-2015 |
20150158128 | FLUX COMPOSITION, LIQUID FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE - Provided is flux composition which is capable of removing any metal oxide formed on a surface of aluminum and is unnecessary for washing any flux residues. | 06-11-2015 |
20150122874 | SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE - A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is a vacuum pickup surface. Each vacuum pickup surface is a sheared surface and extends along a longitudinal direction of the rectangular parallelepiped solder piece. The solder piece may be located in an open cavity in a supply tape with one of only the four vacuum pickup surfaces exposed to be available for vacuum pickup. | 05-07-2015 |
20150061129 | Bump Electrode, Board Which Has Bump Electrodes, and Method for Manufacturing the Board - A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3. | 03-05-2015 |
20150059928 | Flux and Solder Paste - Provided is flux which is capable of suppressing increase in the viscosity of solder paste during its storage and is also capable of improving the fusibility of a solder alloy. | 03-05-2015 |
20150037088 | Lead-Free Solder Alloy - A lead-free solder alloy capable of forming solder joints in which electromigration and an increase in resistance during electric conduction at a high current density are suppressed has an alloy composition consisting essentially of 1.0-13.0 mass % of In, 0.1-4.0 mass % of Ag, 0.3-1.0 mass % of Cu, a remainder of Sn. The solder alloy has excellent tensile properties even at a high temperature exceeding 100° C. and can be used not only for CPUs but also for power semiconductors. | 02-05-2015 |
20150037087 | Lead-Free Solder Alloy - A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength. | 02-05-2015 |
20150027589 | Solder Paste - A solder paste which solves any nozzle clogging that suddenly occurs in a case of being used in a discharging method and which also realizes residue-free because flux is decomposed by heating during soldering. In the solder paste produced by mixing solder powders with the flux, the flux is flux containing polyalkyl-methacrylate of not less than 1.0 mass % and less than 2.0 mass % as methacrylate polymer of an amount such that it prevents the solder powders from being sedimented at ordinary temperature and it is decomposed or evaporated in the process of heating during the soldering, and containing stearic acid amide of not less than 5.0 mass % and less than 15.0 mass %, as viscosity modifier, wherein viscosity is 50 through 150 Pa·s. It is preferable that the content of flux in the solder paste is not less than 11 mass % and less than 13 mass %. | 01-29-2015 |
20150007958 | SOLDER BUMP FORMING METHOD AND APPARATUS - Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head | 01-08-2015 |
20140326490 | LEAD-FREE SOLDER ALLOY, CONNECTING MEMBER AND A METHOD FOR ITS MANUFACTURE, AND ELECTRONIC PART - A lead-free solder which can reduce the occurrence of voids and a connecting member which uses the solder and has excellent adhesion, bonding strength, and workability are provided. The lead-free solder alloy has a composition consisting essentially of Sn: 0.1-3% and/or Bi: 0.1-2%, and a remainder of In and unavoidable impurities and has the effect of suppressing the occurrence of voids at the time of soldering. The connecting member is prepared by melting the lead-free solder alloy, immersing a metal substrate in the melt, and applying ultrasonic vibrations to the molten lead-free solder alloy and the metal substrate to form a lead-free solder alloy layer on the surface of the metal substrate. A heat sink and a package are soldered to each other through this connecting member by reflow heating in the presence of flux. | 11-06-2014 |
20140186208 | AUDIO SOLDER ALLOY - To provide audio solder alloy which is senary solder alloy (Sn.Ag.Cu.In.Ni.Pb) and has their appropriate contained amounts to obtain excellent sound quality and high auditory assessment, as the joining solder for connecting various kinds of electronics parts used for electronic circuit such as a filter circuit NW for audio system. A preferably example of the contained amounts is as follows: Ag of 1.0 through 1.01% by mass, Cu of 0.71 through 0.72% by mass, In of 0.003 through 0.0037% by mass, Ni of 0.016 through 0.017% by mass, Pb of 0.0025 through 0.0035% by mass and the remainder of Sn. | 07-03-2014 |
20140141273 | Lead-Free Solder Alloy - By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather. | 05-22-2014 |
20140137988 | FLUX - To provide flux which can suppress occurrence of the migration certainly on a soldered portion on which residue of flux is formed. | 05-22-2014 |
20140130940 | Solder Paste - To provide solder paste that can be filled in minute apertures. | 05-15-2014 |
20140112710 | Solder Alloy for Power Devices and Solder Joint Having a High Current Density - A solder joint which is used in power devices and the like and which can withstand a high current density without developing electromigration is formed of a Sn—Ag—Bi—In based alloy. The solder joint is formed of a solder alloy consisting essentially of 2-4 mass % of Ag, 2-4 mass % of Bi, 2-5 mass % of In, and a remainder of Sn. The solder alloy may further contain at least one of Ni, Co, and Fe. | 04-24-2014 |
20140099048 | SLIDING MEMBER AND BEARING - To provide a sliding member that improves seizure resistance by restraining any exposure of the porous layer and improves abrasion resistance and load resistance. | 04-10-2014 |
20140064641 | Sliding Member - To provide a sliding member which can control a relationship between dynamic friction force and static friction force. | 03-06-2014 |
20140061287 | Lead-Free Solder Ball - A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. | 03-06-2014 |
20140029224 | METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOINT PORTION, PRINTED WIRING BOARD WITH CONNECTING LAYER, AND SHEET-LIKE JOINT MEMBER - An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer. | 01-30-2014 |
20130343809 | SOLDER ALLOY - A Sn—Ag—Cu based solder alloy capable of increasing the connection reliability of a solder joint when evaluated in a high temperature environment is provided. The alloy has an alloy composition consisting essentially of, in mass percent, Ag: 1.0-5.0%, Cu: 0.1-1.0%, Sb: 0.005-0.025%, Fe: 0.005-0.015%, and a remainder of Sn. The Fe content in mass percent is 0.006-0.014%. The Sb content in mass percent is 0.007-0.023%. Preferably Fe:Sb as a mass ratio is 20:80-60:40. The total content of Fe and Sb is preferably 0.012-0.032%. | 12-26-2013 |
20130333807 | FLUX - To provide flux for producing solder paste, viscosity of which is prevented from varying. | 12-19-2013 |
20130333806 | FLUX - To provide flux which has a property of suppression of sedimentation of the solder powder, dissolves by heating at the time of the soldering to remain no residue and does not block any wettability of the solder. | 12-19-2013 |
20130133924 | ELECTRODE FOR ENERGY STORAGE DEVICE, MANUFACTURING METHOD THEREOF AND CONNECTING METHOD THEREOF - To increase a ground contact area in comparison with the conventional jointing by the spot-welding or the conventional fastening by a bolt so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop of the voltage. | 05-30-2013 |
20130126305 | OIL SUPPLY DEVICE FOR CONVEYANCE DEVICE - To supply lubricating oil stably to a chain. | 05-23-2013 |
20130082087 | SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE - A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface. | 04-04-2013 |
20130025917 | COPPER COLUMN AND PROCESS FOR PRODUCING SAME - To prevent the breakage of the joint between a ceramic substrate and a glass epoxy substrate. | 01-31-2013 |
20120305297 | METHOD FOR MANUFACTURING SOLDER COLUMN, APPARATUS FOR MANUFACTURING SOLDER COLUMN, AND SOLDER COLUMN - Solder wires are conveyed from insert openings for allowing the solder wires to be inserted toward discharge openings from which the solder wires are discharged and the solder wires project. The projecting wires are cut with first cutting blades and the solder inserted into the insert openings are cut with second cutting blades. This enables fixed cutting stress on a portion of the solder wires to be cut with the first cutting blades and a portion of the solder wires to be cut with the second cutting blades at the same time to prevent deformation of the cut surface of the cut solder wires. Solder columns having a column shape and having a uniform length along a conveying direction thereof can be manufactured. | 12-06-2012 |
20120292087 | METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMPONENT - The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. | 11-22-2012 |
20120240424 | REFLOW FURNACE - To prevent evaporated flux from being attached to rotation axes of motors which rotate fans positioned in a preheating zone, a main heating zone and a cooling zone and being solidified, the evaporated flux is efficiently and surely collected with the flux liquefying before the flux is solidified and having fluidity. | 09-27-2012 |
20120224837 | SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH - A solder bath comprises a solder bath main body containing lead-free solder. A heating member heats the solder and is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member. The thermal diffusion member is heated by heat of the heating element to heat the solder bath main body evenly through thermal diffusion from the thermal diffusion member up to a constant range of temperature and the solder contained in the solder bath is heated evenly to a constant range of temperature. | 09-06-2012 |
20120178039 | NOZZLE FOR HEATING DEVICE, HEATING DEVICE, AND NOZZLE FOR COOLING DEVICE - To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output. | 07-12-2012 |
20120006886 | LOCALIZED JET SOLDERING DEVICE AND PARTIAL JET SOLDERING METHOD - To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath. | 01-12-2012 |
20110297433 | SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET - A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer. | 12-08-2011 |
20110284619 | POINT FLOW SOLDERING APPARATUS - To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder. | 11-24-2011 |
20110278348 | AUTOMATIC SOLDERING DEVICE AND CARRIER DEVICE - To enable the circuit board to be fixed on a predetermined position and to be conveyed to the solder processing portion. | 11-17-2011 |
20110248068 | SOLDERING APPARATUS - In a reflow soldering apparatus, when changing the operation mode from a production mode to a temperature profile mode, a warning-issue-time is set to a point of time (for example, several seconds) before the circuit board reaches an exit of the main body of the soldering apparatus to issue an alarm at this set time. A control unit thereof calculates a period of time when the alarm issues based on the set warning-issue-time before circuit-board-discharge and the like. After a sensor of entrance side has detected that the circuit board enters into main body of the reflow soldering apparatus, the control unit determines whether or not the starting time of the alarm sound has been elapsed. The control unit controls the information unit to sound the alarm when the control unit determines that the starting time of the warning issue has elapsed. | 10-13-2011 |
20110247202 | SOLDERING APPARATUS - In a reflow soldering apparatus, air heated by heaters is blown by fans onto a printed circuit board. Temperature controllers that control temperature of the heaters supply operation amount thereof to a calculation unit that calculates consumed electric energy of soldering apparatus. Inverters that control revolution of fans supply a value of current to the calculation unit. A control unit supplies a coefficient of the consumed electric energy to the calculation unit. The calculation unit calculates a total amount of consumed electric energy of the reflow soldering apparatus based on the operation amount, value of current and coefficient of the consumed electric energy thus obtained. A display unit displays on an operation screen the total amount of consumed electric energy of the reflow soldering apparatus, which has been calculated by the calculation unit. | 10-13-2011 |
20110089568 | POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A power semiconductor device includes a substrate, an element circuit pattern formed on the substrate and made of Cu covered with an electroless Ni—P plating layer, and a power semiconductor element bonded to the element circuit pattern by a solder, wherein the solder is an alloy of Sn, Sb, and Cu, and the weight percent of Cu is in the range of 0.5 to 1%, inclusive. | 04-21-2011 |
20100163606 | APPARATUS AND METHOD OF COATING FLUX - An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening. | 07-01-2010 |
20100163600 | SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH - A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member. | 07-01-2010 |
20090148338 | Alloy for a Fusible Plug and a Fusible Plug - Problems: A conventional alloy for a fusible plug contained harmful elements such as Cd and Pb, and there was a concern of pollution by these harmful elements. The present invention provides a fusible plug which does not contain the harmful elements Cd and Pb, with which the alloy is not forced out of the fusible plug even when used for long periods as a safety device for refrigeration equipment, and which has a strong mechanical strength such as creep strength. | 06-11-2009 |
20090134142 | REFLOW FURNACE - The suction ports of a hot air blowing heater are arranged in a zigzag shape crossing the direction of travel of a printed circuit board, and hot air discharge nozzles project from inside or alongside the suction ports. Accordingly, in the reflow furnace according to the present invention, hot air discharged from the hot air discharge nozzles does not collide with hot air sucked into the suction ports, and turbulence does not take place. | 05-28-2009 |