Rohm Co., Ltd.
|Rohm Co., Ltd. Patent applications|
|Patent application number||Title||Published|
|20150255628||BIDIRECTIONAL ZENER DIODE - A bidirectional Zener diode of the present invention includes a semiconductor substrate of a first conductivity type, a first electrode and a second electrode which are defined on the semiconductor substrate, and a plurality of diffusion regions of a second conductivity type, which are defined at intervals from one another on a surface portion of the semiconductor substrate, to define p-n junctions with the semiconductor substrate, and the plurality of diffusion regions include diode regions which are electrically connected to the first electrode and the second electrode, and pseudo-diode regions which are electrically isolated from the first electrode and the second electrode.||09-10-2015|
|20150255379||SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EXTENDING OBLIQUELY - A semiconductor device in which a semiconductor chip, a lead frame and metal wires for electrically connecting the lead frame are sealed with sealing resin. The lead frame has a plurality of lead terminal portions, a supporting portion for supporting the semiconductor chip, and hanging lead portions supporting the supporting portion. Each of the lead terminal portions adjacent to the hanging lead portion is a chamfered lead terminal portion having, at its head, a chamfered portion formed substantially in parallel with the hanging lead portion so as to avoid interference with the hanging lead portion.||09-10-2015|
|20150249055||CHIP DIODE AND DIODE PACKAGE - [Theme] To provide a chip diode, with which a p-n junction formed on a semiconductor layer can be prevented from being destroyed and fluctuations in characteristics can be suppressed even when a large stress is applied to a pad for electrical connection with the exterior, and a diode package that includes the chip diode.||09-03-2015|
|20150243612||CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE - A chip part according to the present invention includes a substrate having a penetrating hole, a pair of electrodes formed on a front surface of the substrate and including one electrode overlapping the penetrating hole in a plan view and another electrode facing the one electrode, and an element formed on the front surface side of the substrate and electrically connected to the pair of electrodes.||08-27-2015|
|20150243412||CHIP COMPONENT AND PRODUCTION METHOD THEREFOR - A chip part according to the present invention includes a substrate having a front surface and a side surface, an electrode integrally formed on the front surface and the side surface so as to cover an edge portion of the front surface of the substrate, and an insulating film interposed between the electrode and the substrate. A circuit assembly according to the present invention includes the chip part according to the present invention and a mounting substrate having a land, bonded by solder to the electrode, on a mounting surface facing the front surface of the substrate.||08-27-2015|
|20150241630||DIRECTIONAL COUPLER, AND MULTIPLEXER AND DEMULTIPLEXER - The directional coupler includes: lattice points periodically arranged in the 2D-PC slab and configured to diffract optical waves, THz waves, or millimeter waves in PBG frequencies in PBG structure of the 2D-PC slab in order to prohibit existence in a plane of the 2D-PC slab; a first 2D-PC waveguide formed of a line defect; a second 2D-PC waveguide which can be mode-coupled to the first waveguide; a directional coupling unit disposed between the first waveguide and the second waveguide in two rows, and having lattice points between waveguides of which the radius is smaller than that of the lattice points, wherein in order to match the first waveguide with an operational band at a side of an input port from the directional coupling unit, the width of the second waveguide is narrowed so that the whole dispersion curve of the directional coupling unit is moved to a higher-frequency side.||08-27-2015|
Patent applications by Rohm Co., Ltd.