Kulicke and Soffa Industries, Inc.
|Kulicke and Soffa Industries, Inc. Patent applications|
|Patent application number||Title||Published|
|20150249027||THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF OPERATING THE SAME - A thermocompression bonding system for bonding semiconductor elements is provided. The thermocompression bonding system includes (1) a bond head assembly including a heater for heating an semiconductor element to be bonded, the bond head assembly including a fluid path configured to receive a cooling fluid; (2) a pressurized cooling fluid source; (3) a booster pump for receiving a pressurized cooling fluid from the pressurized cooling fluid source, and for increasing a pressure of the received pressurized cooling fluid; (4) a pressurized fluid reservoir for receiving pressurized cooling fluid from the booster pump; and (5) a control valve for controlling a supply of pressurized cooling fluid from the pressurized fluid reservoir to the fluid path.||09-03-2015|
Patent applications by Kulicke and Soffa Industries, Inc.