20150281601 | Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core - An imaging device comprises a focal plane array (FPA) having a plurality of singulated unit cells arranged on a carrier substrate. Each of the unit cells comprises a sub-array of pixels in the focal plane array. At least one of the unit cells has a different number or type of pixels than does another one of the unit cells arranged on the carrier substrate to enable multi-spectral imaging. The device also includes at least one lens positioned to direct incident electromagnetic radiation to the unit cells. A modular method for producing the FPA and lenses of a camera core uses wafer-level packaging and optics. Lenses and sub-arrays of pixels are each fabricated on densely packed, batch-fabricated wafers, and subsequently singulated and assembled into arrays (e.g., 3×3, 4×4, 4×5) on respective low cost carrier substrates. The carrier substrates are bonded together at the substrate level to form a series of camera cores, and the stacked substrates are singulated to form individual camera cores. | 10-01-2015 |