HITACHI CHEMICAL COMPANY, LTD. Patent applications |
Patent application number | Title | Published |
20160141609 | ALUMINUM SILICATE COMPOSITE, ELECTROCONDUCTIVE MATERIAL, ELECTROCONDUCTIVE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, COMPOSITION FOR FORMING NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, COMPOSITION FOR FORMING POSITIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, POSITIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY, COMPOSITION FOR FORMING POSITIVE - An aluminum silicate complex that comprises an aluminum silicate and carbon that is disposed on a surface of the aluminum silicate. | 05-19-2016 |
20160060158 | LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GLASS FRIT, LOW-TEMPERATURE SEALING GLASS PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE GLASS PASTE CONTAINING GLASS COMPOSITION, AND GLASS-SEALED COMPONENT AND ELECTRIC/ELECTRONIC COMPONENT PREPARED USING THE SAME - Disclosed is an Ag | 03-03-2016 |
20160007454 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM USING SAME, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD - The present invention relates to a photosensitive resin composition containing (A) an acid-modified vinyl group-containing epoxy resin, (B) a photopolymerization initiator, (C) a thiol group-containing compound, and (E) a photopolymerizable compound, wherein the component (A) contains at least one acid-modified vinyl group-containing epoxy resin (A1) which is obtained from a bisphenol-novolak epoxy resin (a1) having a structural unit represented by a general formula (IV) or (V), and an acid-modified vinyl group-containing epoxy resin (A2) which is obtained from an epoxy resin (a2) differing from the epoxy resin (a1). | 01-07-2016 |
20150368499 | PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF - A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. | 12-24-2015 |
20150361303 | POLISHING AGENT AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING AGENT - Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent. | 12-17-2015 |
20150323867 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, AND METHOD FOR FORMING RESIST PATTERN - Provided is a photosensitive resin composition comprising (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; (C) a photosensitive acid generator; and (D) a solvent; wherein the photosensitive resin composition comprises 20 to 70 parts by mass of the component (B) relative to 100 parts by mass of the component (A). | 11-12-2015 |
20150315419 | POLISHING SLURRY FOR CMP AND POLISHING METHOD - The invention provides polishing slurry for CMP for suppressing corrosion of wiring lines of a conductive substance, or for suppressing bimetallic corrosion of a barrier conductor and conductive substance, by suppressing electrons from being transferred at near the boundaries between a barrier conductor and a conductive substance such as copper. The invention provides polishing slurry for CMP for polishing at least a conductor layer and a conductive substance layer in contact with the conductor layer, wherein the absolute value of the potential difference between the conductive substance and the conductor at 50±5° C. is 0.25 V or less in the polishing slurry when a positive electrode and a negative electrode of a potentiometer are connected to the conductive substance and the conductor, respectively. The polishing slurry for CMP preferably comprises at least one compound selected from heterocyclic compounds containing any one of hydroxyl group, carbonyl group, carboxyl group, amino group, amide group and sulfinyl group, and containing at least one of nitrogen and sulfur atoms. | 11-05-2015 |
20150299520 | ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE - Provided is an adhesive sheet for an image display device ( | 10-22-2015 |
20150293443 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - The invention provides a photosensitive resin that includes: a binder polymer that has a structural unit derived from (meth)acrylic acid, a structural unit derived from styrene or α-methyl styrene, and a structural unit derived from benzyl (meth)acrylate; a photopolymerizable compound including a first bisphenol di(meth)acrylate that has an ethyleneoxy group and a propyleneoxy group, in which a number of structural units of the ethyleneoxy group is from 1 to 20 and a number of structural units of the propyleneoxy group is from 2 to 7, and in which a total number of structural units of the ethyleneoxy group and the propyleneoxy group is more than 10; and a photopolymerization initiator. | 10-15-2015 |
20150282301 | MULTILAYR WIRING BOARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD - A multilayer wiring board | 10-01-2015 |
20150270508 | ELECTRONIC COMPONENT, PROCESS FOR PRODUCING SAME, SEALING MATERIAL PASTE, AND FILLER PARTICLES - In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10 | 09-24-2015 |
20150239220 | ADHESIVE FILM - The adhesive film includes a film-like adhesive layer, a light release separator and a heavy release separator that are laminated on either side of the adhesive layer, and a carrier film further laminated on the heavy release separator. The outer edges of the light release separator and the carrier film forming the outer layer extend outward beyond the outer edge of the adhesive layer and the heavy release separator forming the inner layer. The outer edge sections of the adhesive layer are thereby protected. The outer edge section of the carrier film is gripped and released first, after which the outer edge section of the light release separator is gripped and released, and finally the heavy release separator is released, thereby allowing each separator and the carrier film to be reliably and easily released in the prescribed order. | 08-27-2015 |
20150175811 | SILVER-SULFIDATION-PREVENTING MATERIAL AND METHOD FOR FORMING SILVER-SULFIDATION-PREVENTING FILM, AND METHOD FOR PRODUCING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE - A silver-sulfidation-preventing material of the present invention comprises clay and a binder. | 06-25-2015 |
20150140904 | SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE - A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces a liquid phase having a content of a non-volatile component of 300 ppm or more when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×10 | 05-21-2015 |
20150139885 | SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE - A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, and produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %. | 05-21-2015 |
20150139589 | OPTICAL FIBER CONNECTOR, METHOD FOR MANUFACTURING OPTICAL FIBER CONNECTOR, METHOD FOR CONNECTING OPTICAL FIBER CONNECTOR AND OPTICAL FIBER, AND ASSEMBLED BODY OF OPTICAL FIBER CONNECTOR AND OPTICAL FIBER - An optical fiber connector in which: an optical fiber guide member includes a fiber guide side substrate portion forming part of a substrate, a fiber guide pattern, and a lid member; and an optical waveguide includes an optical waveguide side substrate portion adjacent to the fiber guide side substrate portion, an optical waveguide side first lower clad layer, an optical signal transmission core pattern, and an optical waveguide side upper clad layer. The fiber guide pattern is formed of a plurality of guide members aligned parallel to one another at intervals. A space defined by every two adjacent guide members, the fiber guide side substrate portion, and a fiber guide side lid member portion forms a fiber guide groove. The fiber guide groove is present on an extension of the optical signal transmission core pattern in an optical path direction. The optical fiber connector facilitates alignment of an optical fiber and an optical waveguide core and also facilitates mounting of the optical fiber with hardly any misalignment of the optical fiber. | 05-21-2015 |
20150132208 | SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE - A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces light transmittance of 50%/cm or more for light having a wavelength of 500 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and a difference between a NO | 05-14-2015 |
20150129796 | ABRASIVE GRAINS, SLURRY, POLISHING SOLUTION, AND MANUFACTURING METHODS THEREFOR - A method for manufacturing an abrasive grain, comprising a step of obtaining a particle including a hydroxide of a tetravalent metal element by mixing a metal salt solution comprising a salt of the tetravalent metal element with an alkali liquid, wherein a temperature of a mixed liquid of the metal salt solution and the alkali liquid is 30° C. or more. | 05-14-2015 |
20150111085 | Separator for Electrochemical Element and Fabrication Method for Same - The present invention provides a novel separator which has a high heat resistance property and excels in flexibility, and a fabrication method of the separator. The present invention relates to a separator for an electrochemical element consisting of a porous base material containing inorganic fibers and an organic substance, wherein a part or all of the inorganic fibers are covered with the organic substance, and the inorganic fibers are bound through the organic substance. | 04-23-2015 |
20150099352 | COMPOSITION FOR FORMING n-TYPE DIFFUSION LAYER, METHOD OF PRODUCING n-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL ELEMENT - A composition for forming an n-type diffusion layer includes a glass powder containing P | 04-09-2015 |
20150097521 | ANTENNA SHEET FOR NON-CONTACT CHARGING DEVICE AND CHARGING DEVICE USING THE ANTENNA SHEET - Provided are an antenna sheet for a non-contact charging device and a charging device using the antenna sheet. The antenna sheet is configured to allow for a high degree of freedom in respect of arrangement of a transmitting side and a receiving side during power charging. The antenna sheet is an antenna sheet for a non-contact charging device, and is usable as a transmitting-side resonator for a transmitting-side device or a receiving-side resonator for a receiving-side device. The antenna sheet comprises: a substrate; and a coil-shaped antenna formed on the substrate, wherein the coil-shaped antenna is configured to function as a pickup coil operable to resonate at a resonant frequency f, when a resonance capacitor is set to have a capacitance C. The resonant frequency (f) is 13.56 MHz, the transmitting-side resonator comprises a resonance capacitor having a capacitance of 1 to 5 pF, and the receiving-side resonator comprises a resonance capacitor having a capacitance of 70 to 100 pF. | 04-09-2015 |
20150094262 | SUSTAINED RELEASE CARRIER FOR DRUGS - The present invention can provide a controlled drug release carrier formed by using a silk fibroin porous material, which has high drug controlled release rate, controllability of the drug controlled release speed, high strength, easy handleability, skin care properties from high biocompatibility, high water retentivity, and capability of efficiently retaining a drug. | 04-02-2015 |
20150069298 | SCINTILLATOR SINGLE CRYSTAL, HEAT TREATMENT PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL, AND PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL - The scintillator single crystal of the invention comprises a cerium-activated orthosilicate compound represented by the following formula (1). | 03-12-2015 |
20150047703 | INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, METHOD FOR PRODUCING INORGANIC PHOSPHOR-CONTAINING POLYMER PARTICLES, AND PHOTOVOLTAIC CELL MODULE - Inorganic phosphor-containing polymer particles that include an inorganic phosphor and a transparent material. The transparent material is preferably a vinyl resin that is a polymer of a vinyl compound. It is preferable that the vinyl compound includes 10% by mass or more of a vinyl compound having a viscosity (at 25° C.) of from 5 mPa·s to 30 mPa·s, or includes at least one of a compound having a structure represented by the following Formula (I-1) or the following Formula (I-2). In Formulae (I-1) and (1-2), each of R | 02-19-2015 |
20150031205 | POLISHING METHOD - Provided is a polishing method including a step of preparing a substrate having ( | 01-29-2015 |
20140363973 | CMP POLISHING LIQUID AND POLISHING METHOD - The CMP polishing liquid containing a medium and silica particles as an abrasive grain dispersed into the medium. The silica particles have a silanol group density of 5.0/nm | 12-11-2014 |
20140363767 | METHOD FOR FORMING RESIN CURED FILM PATTERN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING TOUCH PANEL, AND RESIN CURED FILM - The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 μm or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator. | 12-11-2014 |
20140322635 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERNED CURED FILM, AND ELECTRONIC COMPONENT - There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): | 10-30-2014 |
20140314354 | OIL-IMPREGNATED SINTERED BEARING AND PRODUCTION METHOD THEREFOR - The oil-impregnated sintered bearing made of iron-copper sintered alloy consisting of 10-59% of Cu, 0.5-3% of Sn, and balance of De and impurities, includes pores in the iron-copper sintered alloy matrix of not less than 800 per mm | 10-23-2014 |
20140311543 | THERMOELECTRIC CONVERSION GENERATING DEVICE - To produce a temperature difference in the thermoelectric conversion module, a tabular member of the cooling side arranged side of the thermoelectric conversion module is fitted in a uniform pressed condition on the thermoelectric conversion module. In the airtight container in which the flow tube penetrates the housing and the thermoelectric conversion module is arranged in the reduced pressure space between the housing and the flow tube, a tabular member of the cooling side of the housing corresponding to the thermoelectric conversion module is formed by the thin plate that is flexible, and the thermoelectric conversion module is sandwiched between the thin plate and the flow tube. The thin plate contacts the thermoelectric conversion module in a pressed condition by reducing pressure in the reduced pressure space, and the thin plate deforms by following the shape of the thermoelectric conversion module and fits due to its flexibility. | 10-23-2014 |
20140309106 | ALUMINUM SILICATE, METAL ION ADSORBENT, AND METHOD FOR PRODUCING SAME - The aluminum silicate of the invention has: an element ratio of Si and Al, represented by Si/Al, of from 0.3 to 1.0 by molar ratio; a peak at approximately 3 ppm in a | 10-16-2014 |
20140299539 | BIOMOLECULE CAPTURING FILTER - A biomolecule capturing filter, comprising a gold plating on the surface of a biomolecule capturing filter made of a metal other than gold, the gold plating being electroless gold plating is disclosed. | 10-09-2014 |
20140294654 | IRON-BASED SINTERED ALLOY FOR SLIDING MEMBER AND PRODUCTION METHOD THEREFOR - An iron-based sintered alloy for sliding member, in which seizure resistance is improved, and a production method therefor, are provided. The iron-based sintered alloy for sliding member consists of, by mass %, 10 to 30% of Cu, 0.2 to 2.0 % of C, 0.03 to 0.9 % of Mn, 0.36 to 3.65% of S, and the balance of Fe and inevitable impurities in the overall composition. The iron-based sintered alloy for sliding member exhibits a metallic structure in which copper phases and pores are dispersed in the matrix that includes mainly a martensite structure and sulfide particles are dispersed in the matrix and the copper phases. The sulfide particles are dispersed at 1 to 30 vol. % with respect to the matrix. | 10-02-2014 |
20140286812 | IRON BASE SINTERED SLIDING MEMBER AND METHOD FOR PRODUCING SAME - An iron-based sintered sliding member is provided in which solid lubricating agent is dispersed uniformly inside of powder particles in addition to inside of pores and particle interfaces of the powder, the agent is strongly fixed, and sliding properties and mechanical strength are superior. The iron-based sintered sliding member contains S: 3.24 to 8.10 mass %, remainder: Fe and inevitable impurities, as an overall composition; the metallic structure includes a ferrite base in which sulfide particles are dispersed, and pores; and the sulfide particles are dispersed at a ratio of 15 to 30 vol % versus the base. | 09-25-2014 |
20140286811 | FE-BASED SINTERED ALLOY AND MANUFACTURING METHOD THEREOF - An Fe-based sintered alloy, essentially consists of, in percentage by mass, Mn: 0.5 to 2.0, Mo: 0.3 to 1.6, Cu: 0.4 to 1.5, C: 0.4 to 0.7 and the balance of Fe plus unavoidable impurities; and has a metallic structure made of 5 to 70% of martensite phase relative to a base material except pore and 25 to 90% of bainite phase relative to the base material except the pore. | 09-25-2014 |
20140283972 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME - A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. | 09-25-2014 |
20140252607 | REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION METHOD, AND SEMICONDUCTOR DEVICE - The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes. | 09-11-2014 |
20140251676 | STRUCTURE CONTAINING CONDUCTOR CIRCUIT, METHOD FOR MANUFACTURING SAME, AND HEAT-CURABLE RESIN COMPOSITION - A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings. | 09-11-2014 |
20140248504 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN-ADHERED METAL FOIL AND HEAT DISSIPATION DEVICE - The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition. | 09-04-2014 |
20140242741 | MATERIAL FOR FORMING PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE, PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING THE SAME, AND PHOTOVOLTAIC CELL ELEMENT AND METHOD OF PRODUCING THE SAME - The invention provides a material for forming a passivation film for a semiconductor substrate. The material includes a polymer compound having an anionic group or a cationic group. | 08-28-2014 |
20140231791 | COMPOSITION CAPABLE OF CHANGING ITS SOLUBILITY, HOLE TRANSPORT MATERIAL COMPOSITION, AND ORGANIC ELECTRONIC ELEMENT USING THE SAME - An embodiment of the present invention relates to a composition containing a polymer or oligomer (A) having a repeating unit with hole transport properties and also having a thienyl group which may have a substituent, and an initiator (B), wherein the solubility of the composition is capable of being changed by applying heat, light, or both heat and light. | 08-21-2014 |
20140230603 | POWDER MIXTURE - A powder mixture of the present invention is characterized in that it comprises: an iron powder or an iron-based alloy powder, wherein a graphite powder is adhered to a surface of the iron powder or the iron-based alloy powder by a binding agent containing a polyolefin wax; and a negatively-charged powder to be mixed with the iron powder or the iron-based alloy powder, and consisting of an iron powder and/or an iron-based alloy powder treated for negatively charging. This enables keeping the good adhering property of a graphite powder in a mixed powder and high flowability as a mixture of the raw material powder. | 08-21-2014 |
20140206148 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator. | 07-24-2014 |
20140192501 | MODIFIED SILOXANE COMPOUND HAVING AROMATIC AZOMETHINE, THERMOSETTING RESIN COMPOSITION INCLUDING THEREOF, PREPREG, FILM HAVING RESIN, LAMINATE, MULTI-LAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE - A siloxane compound containing structures represented by the following general formulae (1) and (2): | 07-10-2014 |
20140158555 | SENSOR, SENSOR SYSTEM, PORTABLE SENSOR SYSTEM, METHOD OF ANALYZING METAL IONS, MOUNTING SUBSTRATE, METHOD OF ANALYZING PLATING PREVENTING CHEMICAL SPECIES, METHOD OF ANALYZING PRODUCED COMPOUND, AND METHOD OF ANALYZING MONOVALENT COPPER CHEMICAL SPECIES - This invention provides a sensor having such a structure that the area in which a sensor electrode comes into contact with a liquid, a mist or a gas containing an analyte has been previously specified. The sensor comprises at least an electroconductive first electrode, an electroconductive second electrode, electroconductive first and second wirings connected to the first and second electrodes, and an insulating part for insulating the first and second wirings from each other and from a liquid, a mist or a gas containing the analyte. The insulating part is formed of an organic material. In the first and second electrodes, at least the surface, which comes into contact with a liquid, a mist or a gas containing the analyte, is formed of a material which is insoluble in a liquid or a mist containing the analyte, or is not attacked by a gas containing the analyte. | 06-12-2014 |
20140147672 | ELECTRICALLY CONDUCTIVE PARTICLES AND PROCESS FOR PRODUCTION THEREOF - Conductive particles containing at least a carbon-based conductive material and a binder resin, and having an average particle size of 50 μm or less, in which a pressure for causing deformation by 40% of a particle size of the conductive particles at 25° C. is 12 MPa or less, or a mass ratio of the binder resin relative to the carbon-based conductive material is 1/99 to 70/30. | 05-29-2014 |
20140146384 | Light Control Film - A light control film includes two transparent electroconductive resin substrates each having a transparent electroconductive film and a transparent resin substrate and a light control layer sandwiched between the transparent electroconductive film sides of the two transparent electroconductive resin substrates. The transparent electroconductive film of one transparent electroconductive resin substrate having a primer layer is cut through a cutting line to have a shape of a picture or character, and the cutting line is in a form that a start point for the cutting and an end point for the cutting make a closed region. The closed region of the picture of character is electrically insulated from the transparent electroconductive film around the shape of the picture or character. The light control film enables to improve adhesiveness between film matrix and substrates and to provide stable control function. | 05-29-2014 |
20140144481 | SOLAR CELL MODULE - Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member. | 05-29-2014 |
20140128621 | THERMOSETTING RESIN COMPOSITION, EPOXY RESIN MOLDING MATERIAL, AND POLYVALENT CARBOXYLIC ACID CONDENSATE - The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer. | 05-08-2014 |
20140128505 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE - An epoxy resin molding material for sealing includes (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, (E1) an arylamino group-containing alkoxysilane compound, and (E2) an epoxy group-containing alkoxy silane compound. | 05-08-2014 |
20140124253 | PHOTOSENSITIVE CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING CONDUCTIVE PATTERN, AND CONDUCTIVE FILM SUBSTRATE - A photosensitive conductive film | 05-08-2014 |
20140120648 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL - The composition for forming an n-type diffusion layer in accordance with the present invention contains a glass powder and a dispersion medium, in which the glass powder includes an donor element and a total amount of the life time killer element in the glass powder is 1000 ppm or less. An n-type diffusion layer and a photovoltaic cell having an n-type diffusion layer are prepared by applying the composition for forming an n-type diffusion layer, followed by a thermal diffusion treatment. | 05-01-2014 |
20140110048 | URETHANE (METH)ACRYLATE OLIGOMER AND SHEET USING THE SAME - Disclosed is a urethane (meth)acrylate oligomer which is obtained by reacting at least one polyoxyalkylene polyol (A), at least one monool (B1) soluble in the component (A) and/or at least one silane coupling agent (B2) reactive with an isocyanate group, at least one polyisocyanate (C) and at least one hydroxylated mono (meth)acrylate compound (D) at a ratio at which the equivalent weights of hydroxy groups, active hydrogen groups and isocyanate groups in the respective components satisfy the following formulae (1)-(3). The urethane (meth)acrylate oligomer does not substantially contain an unreacted isocyanate group. B(active hydrogen)+D(OH)=C(NCO)−A(OH) (1) 1.05≦C(NCO)/A(OH)≦2 (2) {C(NCO)−2A(OH)+2m}×0.35≦D(OH)≦{C(NCO)−2A(OH)+2m}×0.70 (3) In the formulae (1)-(3), A(OH) represents the total equivalent weight of hydroxy groups contained in the component (A); B(active hydrogen) represents the total equivalent weight of active hydrogen groups contained in the component (B1) and/or the component (B2); C(NCO) represents the total equivalent weight of isocyanate groups contained in the component (C); D(OH) represents the total equivalent weight of hydroxy groups contained in the component (D); and m represents the number of moles of the component (A). | 04-24-2014 |
20140102500 | Thermoelectric Device Assembly, Thermoelectric Module and its Manufacturing Method - In a structure for joining thermoelectric devices and electrodes in a thermoelectric module, the thermoelectric module is configured such that multiple P-type thermoelectric devices and multiple N-type thermoelectric devices are alternately disposed so as to be electrically connected in series via electrode members. A connected portion of the electrode member to the P-type thermoelectric device and a connected portion of the electrode member to the N-type thermoelectric device are made of different materials. This can suppress a considerable reduction in connection reliability between the thermoelectric devices and the electrodes even at a high temperature and efficiently transmit a peripheral temperature to the thermoelectric devices. | 04-17-2014 |
20140087619 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR FORMING PARTITION WALL OF IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE - The present invention provides a photosensitive resin composition which can form an excellently light-resistant partition wall of an image display device and has excellent patterning properties. One embodiment of the present invention is a photosensitive resin composition for forming a partition wall of an image display device, comprising: (A) a binder polymer; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) an inorganic black pigment; (E) a surfactant; and (F) a mercapto group-containing compound, wherein the (B) photopolymerizable compound contains a photopolymerizable compound having at least one unsaturated group and an isocyanuric ring structure in a molecule. | 03-27-2014 |
20140076396 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL - The semiconductor substrate of the present invention contains a semiconductor layer and an impurity diffusion layer containing at least one impurity atom selected from the group consisting of an n-type impurity atom and a p-type impurity atom and at least one metallic atom selected from the group consisting of K, Na, Li, Ba, Sr, Ca, Mg, Be, Zn, Pb, Cd, V, Sn, Zr, Mo, La, Nb, Ta, Y, Ti, Ge, Te, and Lu. | 03-20-2014 |
20140065761 | COMPOSITION FOR FORMING P-TYPE DIFFUSION LAYER, METHOD OF FORMING P-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL - The composition for forming a composition for forming a p-type diffusion layer, the composition containing a glass powder and a dispersion medium, in which the glass powder includes an acceptor element and a total amount of a life time killer element in the glass powder is 1000 ppm or less. A p-type diffusion layer and a photovoltaic cell having a p-type diffusion layer are prepared by applying the composition for forming a p-type diffusion layer, followed by a thermal diffusion treatment. | 03-06-2014 |
20140060385 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL - The composition for forming an n-type diffusion layer in accordance with the present invention contains a donor element-containing glass powder and a dispersion medium. An n-type diffusion layer and a photovoltaic cell having an n-type diffusion layer are prepared by applying the composition for forming an n-type diffusion layer, followed by a thermal diffusion treatment. | 03-06-2014 |
20140057159 | Graphite Particles And Lithium Secondary Battery Using The Same As Negative Electrode - A method for forming a negative electrode for a lithium secondary battery, includes providing a paste comprising graphite particulates comprise assembled or bound graphite particles in each of which a plurality of flat-shaped particles are assembled or bound together so that the planes of orientation are not parallel to one another, and the mixture including 3 to 10 parts by weight of the organic binder per 100 parts by weight of the graphite particulates, a binder and a solvent, coating the paste on a current collector, drying the paste coated on the current collector to form a mixture of the graphite particulates and the binder, and integrating the mixture with the current collector by pressing to provide a density of the mixture of graphite particulates and organic binder of 1.5 to 1.9 g/cm | 02-27-2014 |
20140051250 | CMP POLISHING FLUID, METHOD FOR MANUFACTURING SAME, METHOD FOR MANUFACTURING COMPOSITE PARTICLE, AND METHOD FOR POLISHING BASE MATERIAL - A CMP polishing liquid comprises water and an abrasive particle, wherein the abrasive particle comprises a composite particle having a core including a first particle, and a second particle provided on the core, the first particle contains silica, the second particle contains cerium hydroxide, and the pH of the CMP polishing liquid is equal to or lower than 9.5. | 02-20-2014 |
20140031579 | METHOD OF PRODUCING NORBORNANEDICARBOXYLIC ACID ESTER - A method of producing a norbornanedicarboxylic acid ester, the method including a step of reacting a norbornadiene and a formic acid ester in the presence of a ruthenium compound, a cobalt compound, a halide salt and a basic compound. | 01-30-2014 |
20140026951 | SOLAR BATTERY CELL AND SOLAR BATTERY MODULE - To accurately connect a TAB wire to intended positions while preventing an increase in manufacturing costs. | 01-30-2014 |
20140023799 | OPTICAL RESIN COMPOSITION, OPTICAL RESIN MATERIAL USING THE SAME, OPTICAL - The invention provides an optical resin composition being transparent, having suitable adhesion and necessary impact absorption for protection of an image display device etc., not affecting constituent materials of a image display panel, and being excellent in reliability, and an optical resin material using the same. | 01-23-2014 |
20140017893 | CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME - Disclosed is a CMP polishing liquid for polishing a substrate having a layer containing ruthenium, comprising: an oxidizing agent; polishing particles; water; and a compound having a structure represented by the following Formula (1), or a salt thereof. This CMP liquid is improved in at least the polishing rate to a ruthenium layer when compared with conventional polishing liquid. Also disclosed is a method for polishing a substrate using such a CMP polishing liquid. | 01-16-2014 |
20130340813 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF - Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C). | 12-26-2013 |
20130340806 | ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION, CONNECTOR AND SOLAR CELL MODULE - Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C. | 12-26-2013 |
20130333744 | CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE - Provided is a conductive adhesive composition including: conductive particles (A) containing metal having a melting point of equal to or lower than 210° C.; a resin (B) having a softening point of equal to or lower than the melting point of the metal of the conductive particles and being solid at a room temperature; a flux activator (C); and a solvent (D). | 12-19-2013 |
20130330563 | MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME - There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. | 12-12-2013 |
20130328646 | ELECTROMAGNETIC COUPLING STRUCTURE, MULTILAYERED TRANSMISSION LINE PLATE, METHOD FOR PRODUCING ELECTROMAGNETIC COUPLING STRUCTURE, AND METHOD FOR PRODUCING MULTILAYERED TRANSMISSION LINE PLATE - This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole. | 12-12-2013 |
20130319499 | CONDUCTIVE BINDER COMPOSITION AND METHOD FOR PRODUCING THE SAME, BONDED UNIT, AND SOLAR CELL MODULE AND METHOD FOR PRODUCING THE SAME - Provided is a conductive adhesive composition which contains conductive particles (A) containing metal having a melting point of equal to or lower than 210° C., a thermosetting resin (B), and a flux activator (C), in which viscosity of the conductive adhesive composition is 5 to 30 Pa·s, and a content of the conductive particles (A) is 70 to 90% by mass with respect to the total amount of the conductive adhesive composition. | 12-05-2013 |
20130318786 | CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEASURING KIT, SENSOR SUBSTRATE, AND SENSOR SUBSTRATE INTERPOLATED CYLINDER - A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and a cut portion; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region. | 12-05-2013 |
20130310547 | RARE EARTH METAL COMPLEX - Provided is a rare earth metal complex including a rare earth metal atom and a β-diketone compound coordinated to the rare earth metal atom, the β-diketone compound being represented by the following Formula (1). In Formula (1), R represents a monovalent aromatic hydrocarbon group or a monovalent aromatic heterocyclic group. | 11-21-2013 |
20130302675 | NEGATIVE ELECTRODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, METHOD FOR MANUFACTURING SAME, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY - The invention provides a negative electrode material for lithium ion secondary battery, including a composite particle of a first particle containing a carbonic substance A and a second particle containing silicon, which are combined with a carbonic substance B, wherein, when a cross-section of the composite particle is observed with respect to: the content of silicon atom in a core region in a circle having a center thereof on the midpoint of the major axis, which constitutes the maximum length, and having a radius of ⅛ of the length of the minor axis orthogonally intersecting the major axis at the midpoint thereof, and the content thereof in a rim region extending from the circumference to a depth of ⅛ of the length of the minor axis, the ratio of the content in the rim region to that in the core region is 2 or higher. | 11-14-2013 |
20130302603 | ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME - The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or more. | 11-14-2013 |
20130300954 | ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, IMAGE DISPLAY DEVICE, AND ADHESIVE RESIN COMPOSITION - The adhesive sheet for an image display device includes a structural unit derived from the following general formula (a), wherein the glass transition temperature is from 10 to 50° C., and tan δ at 40 to 80° C. is from 0.5 to 1.1, | 11-14-2013 |
20130286604 | PHOTO CURABLE RESIN COMPOSITION, IMAGING DISPLAY DEVICE AND PRODUCTION METHOD THEREOF - A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. | 10-31-2013 |
20130273718 | TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes. | 10-17-2013 |
20130266900 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD - The invention relates to a photosensitive element comprising a support film and a photosensitive layer derived from a photosensitive resin composition formed on the support film, wherein the support film haze is 0.01-1.5%, the total number of particles with diameters of 5 μm and larger and aggregates with diameters of 5 μm or larger in the support film is no greater than 5/mm | 10-10-2013 |
20130255778 | SPHERICAL PHOSPHOR, WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL, PHOTOVOLTAIC CELL MODULE, AND PRODUCTION METHODS THEREOF - A spherical phosphor includes a fluorescent substance having a maximum excitation wavelength of 400 nm or longer; and a transparent material containing the fluorescent substance, in which, in an excitation spectrum, an excitation spectral intensity in a wavelength region of from 340 nm to 380 nm is 50% or higher of an excitation spectral intensity at a maximum excitation wavelength. A wavelength conversion-type photovoltaic cell sealing material includes a light-permeable resin composition layer that contains the spherical phosphor and a sealing resin. | 10-03-2013 |
20130252426 | POLISHING AGENT AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING AGENT - Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic polymer and a cationic polysaccharide. The present invention can provide a polishing agent which is capable of polishing an insulating film at a high speed with less polishing flaws, and having a high polishing rate ratio of a silicon oxide film and a stopper film, in the CMP technology of flattening insulating film. The present invention can also provide a polishing agent set for storing the polishing agent, and a method for polishing a substrate using this polishing agent. | 09-26-2013 |
20130226032 | PORTABLE DEVICE FOR EX VIVO STIMULATION OF WHOLE BLOOD - Disclosed are methods, device kits, and systems for improved quantification of mRNA from whole blood. More particularly, the devices and kites related thereto are useful for the controlled and repeatable ex vivo stimulation of whole blood. | 08-29-2013 |
20130224425 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR PRODUCING IMAGE DISPLAY DEVICE AND IMAGE DISPLAY DEVICE - A pressure-sensitive adhesive sheet | 08-29-2013 |
20130220540 | METHOD FOR CONNECTING CONDUCTOR, MEMBER FOR CONNECTING CONDUCTOR, CONNECTING STRUCTURE AND SOLAR CELL MODULE - The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor. | 08-29-2013 |
20130214974 | ANTENNA BEAM SCAN MODULE, AND COMMUNICATION APPARATUS USING THE SAME - Signals are maintained to be in phase at beam input ports of a Rotman lens antenna, and thus scanning at non-step antenna beam angles can be realized without increasing the number of input beams. The present invention provides an antenna beam scan module including: a Rotman lens that has plural beam ports and plural antenna ports; plural antenna elements; relative phase detectors that detect a relative phase difference between the signals input to the adjacent beam ports; phase shifters that offset the relative phase difference between the signals supplied to the adjacent beam ports on the basis of the relative phase difference detected by the relative phase detectors; and switches that select routes of the signals supplied to the beam ports through variable amplifiers, wherein the phase shifters are arranged on alternate routes through which the signals are supplied to the plural beam ports. | 08-22-2013 |
20130201549 | SUSPENDED PARTICLE DEVICE, LIGHT CONTROL DEVICE USING THE SAME, AND DRIVING METHOD - A suspended particle device includes a first substrate; a second substrate; a first electrode that can be controlled for a potential; a second electrode that can be controlled for a potential different from that of the first electrode; an electrified body; and a liquid suspension containing charged light control particles and a dispersion medium, in which the first electrode, the second electrode and the electrified body are disposed between the first substrate and the second substrate, and the liquid suspension is sealed between the first substrate and the second substrate, and the light control particles are capable of being accumulated to a periphery of the electrified body. Thus, it is possible to ensure uniformity of transmission light as well as to hold a light transmittance state in a state where the power supply is stopped. | 08-08-2013 |
20130199830 | RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD - By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed. | 08-08-2013 |
20130180769 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and a fibrous base material and wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate body. A laminate plate containing at least one cured resin layer of the resin composition and at least one glass substrate layer, wherein the glass substrate layer accounts for from 10 to 70% by volume relative to the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate, which comprises forming a fiber-containing cured resin layer on the surface of a glass substrate. | 07-18-2013 |
20130180765 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate. | 07-18-2013 |
20130180760 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 07-18-2013 |
20130172208 | ASSESSMENT OF BONE MARROW RECOVERY BY MEASURING PLASMA EXOSOME mRNAS - The present disclosure relates to the characterization of bone marrow conditions through the quantification of bone marrow-associated markers. In several embodiments, the bone marrow-associated markers are expressed in exosomes, which can be obtained from biological fluid samples, such as plasma or whole blood. In several embodiments, quantification of such markers allows for the assessment of bone marrow recovery following bone marrow transplantation. | 07-04-2013 |
20130168135 | INDIVIDUALLY ADDRESSABLE BAND ELECTRODE ARRAYS AND METHODS TO PREPARE THE SAME - Band electrode arrays, methods of manufacturing, and a method of using are disclosed. The arrays have individually addressable band electrodes such that diffusion layers of the band electrodes overlap. An exemplary method of manufacturing may comprise: a first insulating layer is disposed on a substrate; a first band electrode is disposed on the first insulating layer; a second insulating layer is disposed on the first insulating layer and completely covers the first band electrode; a second band electrode is disposed on the second insulating layer; a third insulating layer is disposed on the second insulating layer and completely covers the second band electrode; the first and second band electrodes are electrically insulated from each other and individually addressable; cross-sectional surfaces of the first and second band electrodes are exposed on the test surface; and these exposed cross-sectional surfaces substantially overlap each other in a direction perpendicular to the substrate. | 07-04-2013 |
20130160841 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE AND CIRCUIT CONNECTING MATERIAL USING THE SAME, CONNECTING STRUCTURE OF CIRCUIT MEMBER AND MANUFACTURING METHOD THEREOF - Provided is an adhesive composition containing an organoaluminum complex (A), a silane coupling agent (B), and a curable component (C). | 06-27-2013 |
20130143390 | DICING/DIE BONDING INTEGRAL FILM, DICING/DIE BONDING INTEGRAL FILM MANUFACTURING METHOD, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD - A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm, | 06-06-2013 |
20130143127 | ANODE MATERIAL FOR LITHIUM ION SECONDARY BATTERY, ANODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY - An anode material for a lithium ion secondary battery that includes a carbon material having an average interlayer spacing d | 06-06-2013 |
20130140083 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, CIRCUIT CONNECTION STRUCTURE, METHOD FOR CONNECTING CIRCUIT MEMBERS, USE OF ADHESIVE COMPOSITION, USE OF FILM-LIKE ADHESIVE AND USE OF ADHESIVE SHEET - An adhesive composition for bonding a first circuit member including a first circuit electrode formed on a first circuit substrate and a second circuit member including a second circuit electrode formed on a second circuit substrate, the first circuit electrode and the second circuit electrode being electrically connected, wherein at least one substrate among the first circuit substrate and the second circuit substrate includes a thermoplastic resin having a glass transition temperature of not more than 200° C. The adhesive composition contains core-shell type silicon particles having a core layer and a shell layer provided for coating the core layer. | 06-06-2013 |
20130126775 | Alcoholic Solution and Sintered Magnet - The purpose of the present invention is to provide an alcoholic solvent, in which FeCo based particles becoming a soft magnetic material are improved, for enhancing properties of a magnetic material using no heavy rare earth elements, and is to provide a sintered magnet produced by using it. | 05-23-2013 |
20130118573 | PASTE COMPOSITION FOR ELECTRODE, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL - The present invention provides a paste composition for an electrode comprising a phosphorus-containing copper alloy particle, a tin-containing particle, a nickel-containing particle, a glass particle, a solvent, and a resin. | 05-16-2013 |
20130112460 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate comprising a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130112459 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130094689 | Microphone Unit, Method of Manufacturing Microphone Unit, Electronic Apparatus, Substrate for Microphone Unit and Method of Manufacturing Substrate for Microphone Unit - This microphone unit includes a vibrating portion converting a sound to an electric signal, a substrate having a first surface where the vibrating portion is set and a second surface opposite to the first surface and including a hollow portion transmitting a sound therein, and a coating layer formed on an inner surface of the hollow portion of the substrate. The substrate further includes a first substrate sound hole portion provided on the first surface for causing the hollow portion and the vibrating portion to communicate with each other, a second substrate sound hole portion provided on the first surface for causing the hollow portion and the exterior to communicate with each other, and a coating liquid draining hole portion provided on the second surface for causing the hollow portion and the exterior to communicate with each other. | 04-18-2013 |
20130090460 | RARE EARTH METAL COMPLEX - A rare earth metal complex including a rare earth element and a β-diketone compound represented by the following formula (1) as a ligand, and in formula (1), R | 04-11-2013 |
20130080116 | WAVELENGTH-CONVERTING RESIN COMPOSITION FOR PHOTOVOLTAIC CELL AND PHOTOVOLTAIC CELL MODULE - A wavelength-converting resin composition for a photovoltaic cell, comprising: a fluorescent substance having a maximum absorption wavelength in an absorbance spectrum of which being λ | 03-28-2013 |
20130078759 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD OF FORMING N-TYPE DIFFUSION LAYER, AND METHOD OF PRODUCING PHOTOVOLTAIC CELL - The composition for forming an n-type diffusion layer in accordance with the present invention contains a glass powder and a dispersion medium, in which the glass powder includes an donor element and a total amount of the life time killer element in the glass powder is 1000 ppm or less. An n-type diffusion layer and a photovoltaic cell having an n-type diffusion layer are prepared by applying the composition for forming an n-type diffusion layer, followed by a thermal diffusion treatment. | 03-28-2013 |
20130074928 | WAVELENGTH CONVERSION TYPE PHOTOVOLTAIC CELL SEALING SHEET AND PHOTOVOLTAIC CELL MODULE - A wavelength conversion type photovoltaic cell sealing sheet of the present invention includes a dispersion medium resin, and a fluorescent material having an absorption wavelength peak at from 300 to 450 nm, wherein a content of an ultraviolet absorber other than the fluorescent substance is 0.15 parts by mass or less with respect to 100 parts by mass of the dispersion medium resin. Furthermore, a photovoltaic cell module of the present invention has a photovoltaic cell and the wavelength conversion type photovoltaic cell sealing sheet. | 03-28-2013 |
20130068299 | SPHERICAL PHOSPHOR, WAVELENGTH CONVERSION-TYPE PHOTOVOLTAIC CELL SEALING MATERIAL, PHOTOVOLTAIC CELL MODULE, AND PRODUCTION METHODS THEREFOR - A spherical phosphor is formed by including a fluorescent substance and a transparent material including the fluorescent substance. In addition, a wavelength conversion-type photovoltaic cell sealing material is formed by including a light transmissive resin composition layer including the spherical phosphor and a sealing resin. | 03-21-2013 |
20130059439 | CMP POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND ELECTRONIC COMPONENT - The CMP polishing liquid of the invention is used by mixing a first solution and a second solution, the first solution comprises cerium-based abrasive grains, a dispersant and water, the second solution comprises a polyacrylic acid compound, a surfactant, a pH regulator, a phosphoric acid compound and water, the pH of the second solution is 6.5 or higher, and the first solution and second solution are mixed so that the phosphoric acid compound content is within a prescribed range. The CMP polishing liquid of the invention comprises cerium-based abrasive grains, a dispersant, a polyacrylic acid compound, a surfactant, a pH regulator, a phosphoric acid compound and water, with the phosphoric acid compound content being within a prescribed range. | 03-07-2013 |
20130056152 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 03-07-2013 |
20130042912 | SOLDER BONDED BODY, METHOD OF PRODUCING SOLDER BONDED BODY, ELEMENT, PHOTOVOLTAIC CELL, METHOD OF PRODUCING ELEMENT AND METHOD OF PRODUCING PHOTOVOLTAIC CELL - The solder bonded body according to the present invention contains: an oxide body to be bonded having an oxide layer on the surface thereof; and a solder layer bonded to the oxide layer, which the solder layer is formed by an alloy containing at least two metals selected from the group consisting of tin, copper, silver, bismuth, lead, aluminum, titanium and silicon and having a melting point of lower than 450° C. and has a zinc content of 1% by mass or less. | 02-21-2013 |
20130037753 | ORGANIC ELECTRONIC MATERIAL, POLYMERIZATION INITIATOR AND THERMAL POLYMERIZATION INITIATOR, INK COMPOSITION, ORGANIC THIN FILM AND PRODUCTION METHOD FOR SAME, ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, LIGHTING DEVICE, DISPLAY ELEMENT, AND DISPLAY DEVICE - Disclosed is an organic electronic material comprising charge transporting compounds and ionic compounds having electron-accepting properties and high solubility in a solvent. The organic electronic material is characterized by comprising charge transporting compounds and ionic compounds, and in that at least one of the ionic compounds is any one kind of compounds represented by general formulas (1b)-(3b). (In the formulas Y | 02-14-2013 |
20130033741 | Suspended Particle Device, Light Control Device Using the Same, and Method for Driving the Same - The suspended particle device includes a first substrate and a second substrate, a first electrode, a second electrode, a third electrode and a suspension disposed between the first substrate and the second substrate, wherein the first electrode is formed on the first substrate, the second electrode and the third electrode are formed on the second substrate, the suspension includes light-control particles and a disperse medium, the light-control particles are charged, an orientation state of the light-control particles is controlled by applying AC voltage to at least any one of the first electrode, the second electrode, and the third electrode, and the light-control particles are dispersed in the suspension or biased to the third electrode by applying DC voltage to at least one of the first electrode, the second electrode, and the third electrode. | 02-07-2013 |
20130025670 | SEMICONDUCTOR SUBSTRATE AND METHOD FOR PRODUCING THE SAME, PHOTOVOLTAIC CELL ELEMENT, AND PHOTOVOLTAIC CELL - The semiconductor substrate of the present invention contains a semiconductor layer and an impurity diffusion layer containing at least one impurity atom selected from the group consisting of an n-type impurity atom and a p-type impurity atom and at least one metallic atom selected from the group consisting of K, Na, Li, Ba, Sr, Ca, Mg, Be, Zn, Pb, Cd, V, Sn, Zr, Mo, La, Nb, Ta, Y, Ti, Ge, Te, and Lu. | 01-31-2013 |
20130025669 | PHOTOVOLTAIC CELL SUBSTRATE, METHOD OF PRODUCING PHOTOVOLTAIC CELL SUBSTRATE, PHOTOVOLTAIC CELL ELEMENT AND PHOTOVOLTAIC CELL - The invention provides a photovoltaic cell substrate that is a semiconductor substrate comprising an n-type diffusion layer, an n | 01-31-2013 |
20130025668 | ELEMENT AND PHOTOVOLTAIC CELL - The invention provides an element including a semiconductor substrate and an electrode disposed on the semiconductor substrate, the electrode being a sintered product of a composition for an electrode that includes phosphorus-containing copper alloy particles, glass particles and a dispersing medium, and the electrode includes a line-shaped electrode having an aspect ratio, which is defined as electrode short length:electrode height, of from 2:1 to 250:1. | 01-31-2013 |
20130020283 | POLISHING SOLUTION FOR COPPER POLISHING, AND POLISHING METHOD USING SAME - The polishing solution for copper polishing of the invention comprises a first organic acid component which is at least one type selected from among an organic acid containing a hydroxyl group, an organic acid salt and an organic acid anhydride, an inorganic acid component which is at least one type selected from among a dibasic or greater inorganic acid and an inorganic acid salt, an amino acid, a protective film-forming agent, an abrasive grain, an oxidizing agent and water, wherein the inorganic acid component content in terms of inorganic acid is 0.15 mass % or greater, the amino acid content is 0.30 mass % or greater, the protective film-forming agent content is 0.10 mass % or greater, based on the entire polishing solution for copper polishing, and the ratio of the first organic acid component content in terms of organic acid with respect to the protective film-forming agent content is at least 1.5. | 01-24-2013 |
20130020021 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): | 01-24-2013 |
20130017142 | APPARATUS FOR PRODUCING NANOCARBON MATERIAL AND METHOD FOR PRODUCING NANOCARBON MATERIALAANM Noda; SuguruAACI Bunkyo-kuAACO JPAAGP Noda; Suguru Bunkyo-ku JPAANM Osawa; ToshioAACI Bunkyo-kuAACO JPAAGP Osawa; Toshio Bunkyo-ku JPAANM Kim; Dong YoungAACI Bunkyo-kuAACO JPAAGP Kim; Dong Young Bunkyo-ku JPAANM Haba; EisukeAACI Tsukuba-shiAACO JPAAGP Haba; Eisuke Tsukuba-shi JPAANM Ueda; ShunsukeAACI Tsukuba-shiAACO JPAAGP Ueda; Shunsuke Tsukuba-shi JP - The present invention provides a carbon nanomaterial production apparatus | 01-17-2013 |
20130008593 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2):
| 01-10-2013 |
20130008592 | ADHESIVE AGENT, ADHESIVE MATERIAL USING THE SAME, AND METHOD OF USE THEREOF - An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3):
| 01-10-2013 |
20120325297 | GLASS COMPOSITION AND CONDUCTIVE PASTE FOR ALUMINUM ELECTRODE WIRING, ELECTRONIC COMPONENT PROVIDED WITH THAT ALUMINUM ELECTRODE WIRING AND METHOD FOR PRODUCING THIS ELECTRONIC COMPONENT - Disclosed is a constitution formed from an oxide of an element having a smaller work function than aluminum. This oxide is comprises an oxide of vanadium (V), an oxide of an alkaline earth metal and an oxide of an alkali metal. The elements for the alkaline earth metal are comprise one or more elements out of the elements calcium (Ca), strontium (Sr) and barium (Ba) and at least contain barium. The elements for the alkali metal include at least one or more of sodium (Na), potassium (K), rubidium (Rb) and cesium (Cs). When the element vanadium is included as vanadium pentoxide (V | 12-27-2012 |
20120318559 | ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT - The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance. | 12-20-2012 |
20120315763 | POLISHING LIQUID FOR CMP AND POLISHING METHOD USING THE SAME - An object of the present invention is to provide a polishing liquid for CMP with which polishing scratches can be reduced and a sufficiently high polishing rate can be obtained in a CMP step for an ILD film, aggregation of an abrasive grain is difficult to occur, and high flatness is obtained, and provide a polishing method using the same. The polishing liquid for CMP according to the present invention is a polishing liquid for CMP containing an abrasive grain, an additive, and water, wherein the abrasive grain comprises a cerium-based particle, and the additive comprises a 4-pyrone-based compound and at least one of a nonionic surfactant or a cationic surfactant: | 12-13-2012 |
20120313199 | MATERIAL FOR FORMING PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE, PASSIVATION FILM FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF PRODUCING THE SAME, AND PHOTOVOLTAIC CELL ELEMENT AND METHOD OF PRODUCING THE SAME - The invention provides a material for forming a passivation film for a semiconductor substrate. The material includes a polymer compound having an anionic group or a cationic group. | 12-13-2012 |
20120305048 | SOLAR BATTERY CELL, SOLAR BATTERY MODULE AND METHOD OF MAKING SOLAR BATTERY MODULE - A solar battery cell and related methodology are provided which enable a TAB wire to be accurately connected to an intended position, thus allowing a possible increase in manufacturing costs to be suppressed. The solar battery cell can include a substrate, a plurality of finger electrodes formed on a light receiving surface of the substrate, and a back surface electrode on a back surface of the substrate, the back surface electrode to be connected to a plurality of finger electrodes on an adjacent cell by applying a first TAB wire via a conductive adhesive, wherein the back surface electrode has omitted portions arranged to define at least one alignment marking indicative of a position where the first TAB wire is to be applied, the at least one alignment marking having a width less than a width of said first TAB wire. | 12-06-2012 |
20120302699 | RESIN COMPOSITION, MOLDED BODY AND COMPOSITE MOLDED BODY - In accordance with the present invention, by using a resin composition including lignin and a curing agent in which the lignin is soluble in an organic solvent and contained in the resin composition in an amount of from 10 to 90% by mass, there are provided a molded product and a composite molded product which are obtained from plant resources as a main raw material and to which a good flame retardance and a good antibacterial property are imparted. | 11-29-2012 |
20120299158 | CMP POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND ELECTRONIC COMPONENT - The CMP polishing liquid of the invention is used by mixing a first solution and a second solution, the first solution comprises cerium-based abrasive grains, a dispersant and water, the second solution comprises a polyacrylic acid compound, a surfactant, a pH regulator, a phosphoric acid compound and water, the pH of the second solution is 6.5 or higher, and the first solution and second solution are mixed so that the phosphoric acid compound content is within a prescribed range. The CMP polishing liquid of the invention comprises cerium-based abrasive grains, a dispersant, a polyacrylic acid compound, a surfactant, a pH regulator, a phosphoric acid compound and water, with the phosphoric acid compound content being within a prescribed range. | 11-29-2012 |
20120289674 | COMPOUND HAVING TRIMETHYLENE STRUCTURE, POLYMER COMPOUND CONTAINING UNIT THAT HAS TRIMETHYLENE STRUCTURE, AND REACTIVE COMPOUND HAVING TRIMETHYLENE STRUCTURE - A compound represented by a formula 1 shown below. | 11-15-2012 |
20120282547 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 11-08-2012 |
20120276392 | THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION VARNISH, PREPREG AND LAMINATE - Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided. | 11-01-2012 |
20120251830 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME - A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. | 10-04-2012 |
20120244332 | RESIN COMPOSITION, PREPREG USING SAME, METAL FOIL WITH RESIN, ADHESIVE FILM, AND METAL-CLAD LAMINATE - A resin composition comprising a polyamideimide and a polyfunctional glycidyl compound, the polyamideimide having 2 or more carboxyl groups on at least one end of the molecular chain. | 09-27-2012 |
20120238094 | CMP POLISHING SOLUTION AND POLISHING METHOD - The CMP polishing liquid of the invention comprises a metal salt containing at least one type of metal selected from the group consisting of metals of Groups 8, 11, 12 and 13, 1,2,4-triazole, a phosphorus acid, an oxidizing agent and abrasive grains. The polishing method of the invention comprises a step of polishing at least a palladium layer with an abrasive cloth while supplying a CMP polishing liquid between the palladium layer of a substrate having the palladium layer and the abrasive cloth, wherein the CMP polishing liquid comprises a metal salt containing at least one type of metal selected from the group consisting of metals of Groups 8, 11, 12 and 13, 1,2,4-triazole, a phosphorus acid, an oxidizing agent and abrasive grains. | 09-20-2012 |
20120234584 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SAME - It is an object of the invention to provide a method for producing a substrate for mounting a semiconductor chip, that can reduce bridging and allows excellent wire bondability and solder connection reliability to be obtained, even when forming fine-pitch wirings. The method for producing a substrate for mounting a semiconductor chip according to the invention comprises a resist-forming step in which a resist is formed on the first copper layer of a stack comprising an inner board with an inner layer circuit on the surface and a first copper layer formed on the inner board separated by an insulating layer at the sections other than those that are to constitute a conductor circuit, a conductor circuit-forming step in which a second copper layer is formed by electrolytic copper plating on the first copper layer to obtain a conductor circuit, a nickel layer-forming step in which a nickel layer is formed by electrolytic nickel plating on at least part of the conductor circuit, a resist removal step in which the resist is removed, an etching step in which the first copper layer is removed by etching, and a gold layer-forming step in which a gold layer is formed by electroless gold plating on at least part of the conductor circuit. | 09-20-2012 |
20120228559 | CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL - Conductive fine particles have core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface. The phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A. The phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater. | 09-13-2012 |
20120227786 | CONDUCTIVE ADHESIVE, SOLAR CELL, METHOD FOR MANUFACTURING SOLAR CELL, AND SOLAR CELL MODULE - A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members | 09-13-2012 |
20120227785 | SOLAR BATTERY CELL, SOLAR BATTERY MODULE, METHOD OF MAKING SOLAR BATTERY CELL AND METHOD OF MAKING SOLAR BATTERY MODULE - A solar battery cell and related methodology are provided which enable a TAB wire to be accurately connected to an intended position, thus allowing a possible increase in manufacturing costs to be suppressed. A solar battery cell includes a plurality of finger electrodes arranged on a light receiving surface of a photovoltaic substrate, and an alignment marking indicating a position where a TAB wire is to be connected to the finger electrodes via a conductive adhesive. The alignment marking has portions discontinuously provided on the light receiving surface along a line crossing two of the finger electrodes positioned nearest opposite ends of the light receiving surface. | 09-13-2012 |
20120227784 | SOLAR BATTERY CELL, SOLAR BATTERY MODULE, METHOD OF MAKING SOLAR BATTERY CELL AND METHOD OF MAKING SOLAR BATTERY MODULE - A solar battery cell and related methodology are provided which enable a TAB wire to be accurately connected to an intended position, thus allowing a possible increase in manufacturing costs to be suppressed. A solar battery cell includes a plurality of finger electrodes arranged on a light receiving surface of a photovoltaic substrate, the light receiving surface having a region of predetermined width to receive a conductive adhesive of a same width as the region. The region is provided with an alignment marking indicating a position where the adhesive is to be applied over the surface, the alignment marking having a cross-dimension in a widthwise direction of the region that is less than the predetermined width. | 09-13-2012 |
20120214307 | CHEMICAL-MECHANICAL POLISHING LIQUID, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND POLISHING METHOD USING SAID POLISHING LIQUID - The first embodiment of the CMP polishing liquid of the invention comprises cerium oxide particles, an organic compound with an acetylene bond, and water, the content of the organic compound with an acetylene bond being at least 0.00001 mass % and not greater than 0.01 mass % based on the total mass of the CMP polishing liquid. The second embodiment of the CMP polishing liquid of the invention comprises cerium oxide particles, an organic compound with an acetylene bond, an anionic polymer compound or salt thereof, and water, the anionic polymer compound being obtained by polymerizing a composition comprising a vinyl compound with an anionic substituent as a monomer component, the content of the organic compound with an acetylene bond being at least 0.000001 mass % and less than 0.05 mass % based on the total mass of the CMP polishing liquid. | 08-23-2012 |
20120196977 | URETHANE RESIN COMPOSITION, CURED OBJECT, AND PHOTOSEMICONDUCTOR DEVICE USING CURED OBJECT - A urethane resin composition obtained by a method comprising the steps of:
| 08-02-2012 |
20120175253 | ION SELECTIVE ELECTRODE CARTRIDGE - A wet flow-type ion selective electrode device requires not only a large amount of test solution but also cumbersome management works such as flow path cleaning and device conditioning. Provided is an ion selective electrode cartridge which includes at least one ion selective electrode forming an electrical path with a reference electrode when a test solution is infused, and in which the ion selective electrode and the reference electrode is arranged to surround a container. | 07-12-2012 |
20120138868 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER - The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material. | 06-07-2012 |
20120114517 | Thermoelectric material formed of Mg2Si-based compound and production method therefor - A thermoelectric material (and a method for producing the same) is essentially formed of an Mg | 05-10-2012 |
20120104333 | COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME - [Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle ( | 05-03-2012 |
20120100718 | CMP Fluid and Method for Polishing Palladium - The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. | 04-26-2012 |
20120097902 | ANISOTROPIC CONDUCTIVE PARTICLES - The anisotropic conductive particles of the invention have conductive fine particles | 04-26-2012 |
20120094491 | CMP POLISHING LIQUID AND POLISHING METHOD - The invention relates to a CMP polishing liquid comprising a medium and silica particles as an abrasive grain dispersed into the medium, characterized in that:
| 04-19-2012 |
20120085579 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER - An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%. | 04-12-2012 |
20120040290 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME - The present invention relates to a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein the (C) photopolymerization initiator comprises a compound represented by the following general formula (1). In formula (1), R | 02-16-2012 |
20120039563 | METHOD FOR PRODUCING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE WIRING BOARD - (1) A method for producing a flexible optical waveguide, containing: a step of forming a first cladding layer; a step of forming a first core layer by laminating a resin film for forming a core layer on at least one end portion of the first cladding layer; a step of forming a second core layer by laminating a resin film for forming a core layer on an entire surface of the first core layer and the first cladding layer; a step of forming a core pattern by patterning the first and second core layers; and a step of embedding the core pattern by forming a second cladding layer on the core pattern and the first cladding layer, (2) a flexible optical waveguide containing a lower cladding layer, a core part and an upper cladding layer, the upper cladding layer having a width that is smaller than a width of the lower cladding layer at least in a bent portion, and is equal to or smaller than a width of the lower cladding layer in an end portion, and the lower cladding layer having a width in a bent portion that is equal to or smaller than a width thereof in an end portion, and a method for producing the same. A flexible optical waveguide that is excellent in bending durability and has small optical loss, and a method for producing the same. | 02-16-2012 |
20120024818 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME - A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied.
| 02-02-2012 |
20120015126 | ADHESIVE MATERIAL REEL - A bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has a region in which an adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and an end tape which is bonded to the terminal end of the tape for circuit connection so as to cover the region, and extends toward the core from the terminal end. | 01-19-2012 |
20120012999 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator. | 01-19-2012 |
20110318929 | CMP POLISHING SOLUTION AND POLISHING METHOD - The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film. | 12-29-2011 |
20110308729 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 12-22-2011 |
20110308728 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 12-22-2011 |
20110301362 | NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF - The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). | 12-08-2011 |
20110300778 | ABRADING AGENT AND ABRADING METHOD - A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1 kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3. | 12-08-2011 |
20110300326 | ADHESIVE MATERIAL REEL - The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region. | 12-08-2011 |
20110291260 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | 12-01-2011 |
20110275285 | POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION - The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad. | 11-10-2011 |
20110275217 | POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION - The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad. | 11-10-2011 |
20110272292 | METAL COLLECTION METHOD AND METAL COLLECTION DEVICE - The method of the present invention includes a step (i) in which a voltage is applied between first and second electrodes | 11-10-2011 |
20110267791 | CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL - A circuit connection material | 11-03-2011 |
20110241968 | MULTI-BEAM ANTENNA DEVICE - Provided is a multi-beam antenna device capable of suppressing an increase in loss of a Rotman lens so as to achieve enhanced gain. | 10-06-2011 |
20110223539 | PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE - The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles. | 09-15-2011 |
20110198433 | REEL - A reel comprising a columnar wind-up unit | 08-18-2011 |
20110176288 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. | 07-21-2011 |
20110159430 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN AND METHOD OF PRODUCING PRINTED WIRING BOARD - A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. | 06-30-2011 |
20110139922 | REEL - A reel including a columnar wind-up unit | 06-16-2011 |
20110139916 | REEL - A reel including a columnar wind-up unit | 06-16-2011 |
20110133346 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-09-2011 |
20110127667 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-02-2011 |
20110121447 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 05-26-2011 |
20110121243 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES - The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle. | 05-26-2011 |
20110111344 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition. | 05-12-2011 |
20110086309 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator. | 04-14-2011 |
20110081616 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight. | 04-07-2011 |
20110052118 | Fabrication Method of Optical Wiring Board and Optical Printed Circuit Board - The fabrication of an optical wiring board is performed in the following manner: A core member | 03-03-2011 |
20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 02-24-2011 |
20110045354 | ARTIFICIAL GRAPHITE PARTICLES AND METHOD FOR MANUFACTURING SAME, NONAQUEOUS ELECTROLYTE SECONDARY CELL NEGATIVE ELECTRODE AND METHOD FOR MANUFACTURING SAME, AND LITHIUM SECONDARY CELL - Artificial graphite particles, having a secondary particle structure in which a plurality of primary particles composed of graphite are clustered or bonded together, and having a layer structure in which the edge portion of the primary particles is bent in a polyhedral shape. | 02-24-2011 |
20110031631 | PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device | 02-10-2011 |
20110031449 | CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL - The invention provides conductive fine particles with a satisfactory monodisperse property, low cost, resistance to migration and excellent conductivity. Conductive fine particles having core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface, wherein the phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A, the phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater. | 02-10-2011 |
20110027997 | POLISHING LIQUID FOR CMP AND POLISHING METHOD - The present invention can provide a polishing liquid for CMP having good dispersion stability and a high polishing rate in polishing of interlayer insulating films and a polishing method. Disclosed a polishing liquid for CMP comprising: a medium; and colloidal silica particles dispersed in the medium, a blending amount of the colloidal silica particles being 2.0 to 8.0% by mass relative to 100% by mass of the polishing liquid,
| 02-03-2011 |
20100327237 | CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE - A conductive particle | 12-30-2010 |
20100327227 | SCINTILLATOR SINGLE CRYSTAL, HEAT TREATMENT PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL, AND PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL - The scintillator single crystal of the invention comprises a cerium-activated orthosilicate compound represented by the following formula (1). | 12-30-2010 |
20100307805 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME - The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability. | 12-09-2010 |
20100294329 | MEMBER FOR CONDUCTOR CONNECTION, METHOD FOR MANUFACTURING THE SAME, CONNECTION STRUCTURE, AND SOLAR CELL MODULE - The member for conductor connection of the invention is a member for conductor connection having an adhesive layer | 11-25-2010 |
20100288328 | CONDUCTOR-CONNECTING MEMBER, METHOD FOR PRODUCING THE SAME, CONNECTION STRUCTURE, AND SOLAR CELL MODULE - The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer | 11-18-2010 |
20100277884 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE - The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. | 11-04-2010 |
20100263208 | CIRCUIT CONNECTING METHOD - The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. | 10-21-2010 |
20100248162 | Photosensitive Resin Composition, Photosensitive Element Using Same, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board - The photosensitive resin composition of the invention is characterized by comprising (A) a binder polymer, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1). | 09-30-2010 |
20100243303 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER - The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component. | 09-30-2010 |
20100243059 | SOLAR BATTERY CELL - Disclosed is a solar battery cell comprising: a crystalline silicon substrate; a cell electrode for extracting external electric power formed on a light-receiving surface of the crystalline silicon substrate; a front surface tab line connected to the cell electrode; a rear surface electrode formed on a reverse light-receiving surface of the crystalline silicon substrate; and a rear surface tab line connected to the rear surface electrode, wherein the rear surface electrode and the rear surface tab line are connected with a resin conductive paste or conductive film, and the rear surface electrode is uniformly formed on the reverse light-receiving surface of the crystalline silicon substrate. The solar battery cell can improve efficiency of electric power generation and decrease costs for members thereof. | 09-30-2010 |
20100221533 | CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE - A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive. | 09-02-2010 |
20100216309 | CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME - Disclosed is a CMP polishing liquid for polishing a substrate having a layer containing ruthenium, comprising: an oxidizing agent; polishing particles; water; and a compound having a structure represented by the following Formula (1), or a salt thereof. This CMP liquid is improved in at least the polishing rate to a ruthenium layer when compared with conventional polishing liquid. Also disclosed is a method for polishing a substrate using such a CMP polishing liquid. | 08-26-2010 |
20100212943 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-26-2010 |
20100208444 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-19-2010 |
20100167030 | ADHESIVE TAPE AND ADHESIVE TAPE ROLL - The invention provides an adhesive tape comprising a tape-like support base and a tape-like adhesive layer, wherein the adhesive layer is formed on the main side of the support base and the width of the support base is longer than the width of the adhesive layer. According to the invention, seepage of adhesive components in the adhesive layer of the adhesive tape in the widthwise direction from the sides of the support base can be reduced compared to the prior art. | 07-01-2010 |
20100147355 | CONNECTED STRUCTURE AND METHOD FOR MANUFACTURE THEREOF - A method for electrically connecting a surface electrode of a solar battery cell and a wiring member via a conductive adhesive film, wherein the conductive adhesive film contains an insulating adhesive and conductive particles, and wherein when the ten point height of roughness profile and maximum height of the surface of the surface electrode in contact with the conductive adhesive film are Rz (μm) and Ry (μm) respectively, the average particle diameter r (μm) of the conductive particles is equal to or greater than the ten point height of roughness profile Rz, and the thickness t (μm) of the conductive adhesive film is equal to or greater than the maximum height Ry. | 06-17-2010 |
20100140556 | FILMY ADHESIVE FOR CIRCUIT CONNECTION - A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90° or greater. | 06-10-2010 |
20100139947 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER - A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 μm and the thickness of the metal layer being 65-125 nm. | 06-10-2010 |