GLOBAL CIRCUIT INNOVATIONS INCORPORATED
GLOBAL CIRCUIT INNOVATIONS INCORPORATED Patent applications | ||
Patent application number | Title | Published |
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20140252584 | Method and apparatus for printing integrated circuit bond connections - A method for assembling a packaged integrated circuit is provided. The method includes placing a die into a cavity of a package base, securing the die to the package base with a die attach adhesive, printing a bond connection between a die pad of the die and a lead of the package base or a downbond, and sealing a package lid to the package base. | 09-11-2014 |