EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD. Patent applications |
Patent application number | Title | Published |
20150206919 | CMOS Integrated Method for Fabrication of Thermopile Pixel on Semiconductor Substrate with Buried Insulation Regions - A method for manufacturing an imaging device in a semiconductor substrate is disclosed. The substrate includes a first surface, a second surface substantially opposite the first surface, and a thickness defined by a distance between the first surface and the second surface. A trench is fabricated in the semiconductor substrate first surface. A passivation layer is applied over the substrate first surface and the trench, optionally filling the trench by depositing a conformal layer over the substrate first surface. The conformal layer and the passivation layer are planarized from the substrate first surface, and a membrane is fabricated on the substrate first surface. From the substrate second surface, a cavity is formed in the substrate abutting the membrane and at least a portion of the trench via the unmasked region. | 07-23-2015 |
20150200347 | CMOS Integrated Method for the Release of Thermopile Pixel on a Substrate by Using Anisotropic and Isotropic Etching - A method for manufacturing an imaging device is presented. The method starts with providing a wafer having a membrane with an opening bonded to a substrate. A photoresist layer is deposited over the membrane and wafer surface. A portion of the substrate back surface under a central part of the membrane is etched anisotropicly. A first region of the photoresist layer is removed, exposing an opening in the membrane, so that a first isotropic etching of the substrate is performed through the membrane opening. A second region of the photoresist layer is stripped, exposing a second membrane opening, providing access for a second isotropic etching of the substrate through the first and/or second membrane opening. | 07-16-2015 |
20150179864 | CMOS INTEGRATED METHOD FOR THE FABRICATION OF THERMOPILE PIXEL WITH UMBRELLA ABSORBER ON SEMICONDUCTOR SUBSTRATE - A method of manufacturing a pixel structure having an umbrella absorber is disclosed. The method includes providing a substrate with a membrane on a first surface of the substrate. The membrane has one or more openings that expose one or more portions of the first surface, and includes a thermopile. A sacrificial layer is deposited on the membrane and in the one or more openings. The sacrificial layer is patterned to expose a portion of the membrane associated with one or more hot junctions of the thermopile. A rigid, thermally-conductive layer is formed on the sacrificial layer and on the exposed portion of the membrane associated with the one or more hot junctions of the thermopile. An absorber is deposited on the rigid, thermally-conductive layer. A cavity is formed in the substrate from a second surface of the substrate to the membrane and the sacrificial layer is removed. | 06-25-2015 |
20140326888 | Passive Infrared Range, Size, and Direction Finding Proximity Detector - Apparatus and methods for proximity detection include a passive proximity detecting device for detecting humans within a detection area and controlling a controlled device. A sensor includes a plurality of pixels arranged in a substantially contiguous array. Each pixel is configured to detect infrared radiation emitted by an object in a predetermined temperature range within the detection area. In response to detecting the object a detection signal is generated having a signal level proportional to the infrared radiation emitted by said object received by the sensor. A processor in communication with the sensor is configured to receive said detection signal, to derive an object distance and a second object parameter using, a signal level of the detection signal. | 11-06-2014 |
20140326887 | Passive Infrared System for Detecting Object Range, Size, and Direction Finding Proximity Detector - A system for proximity detection includes a first sensor and a second sensor each including a sensor housing and a pixel array each configured to detect infrared radiation emitted in a predetermined temperature range, and generate a detection signal. A processor in communication with the first and second sensor is configured to receive detection signals to derive parameters of the detected object including object distance from the sensors, size, position relative to the sensors, object speed, and direction of motion. | 11-06-2014 |
20140145081 | Radiation sensing device and control circuit - A radiation sensing device for sensing first radiation ( | 05-29-2014 |
20140117201 | OPTICAL SENSING ELEMENT ARRANGEMENT WITH INTEGRAL PACKAGE - A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed. | 05-01-2014 |
20140042320 | EMI FILTERING DETECTOR AND METHOD FOR SAME - A circuit for detecting electromagnetic radiation includes a pyroelectric sensor element connected to convert electromagnetic radiation into an electric signal. An n-channel junction field effect transistor is connected to receive the electric signal. A printed circuit board includes at least one low inductance low resistance area to provide a ground path for all alternating current components. A first capacitor is connected between the FET source terminal and a second capacitor is connected between the FET drain terminal and ground. A gate resistor is connected in parallel with the sensor element or a resistor is included in the sensor elements. | 02-13-2014 |
20140041214 | PANELIZED PROCESS FOR SMT SENSOR DEVICES - A method is presented for forming multiple surface mount technology (SMT) sensor packages in a panel for separation into individual SMT sensor packages. A base plate is mapped as a grid of sensor footprints, and each footprint is populated with electronic and sensor components. A cover plate including window elements is mapped to a similar grid. The cover plate is bonded to the base plate, such that the window elements are positioned to allow incident electromagnetic radiation upon corresponding sensors mounted on the printed circuit board. Each sensor footprint is sealed within a recess or cell beneath the cover. The sensor circuits may be tested before and/or after being separated into individual SMT sensor packages. | 02-13-2014 |
20130327944 | HEATED RADIATION SENSOR | 12-12-2013 |
20130214166 | Passive Infrared Range Finding Proximity Detector - Apparatus and methods for a passive range finding proximity detector include a sensor element configured to detect infrared radiation emitted by objects within a detection area. The sensor is configured to detect the temperature, relative size, relative distance, speed or direction of movement of an object from the sensor. The sensor is configured to set parameters for a controlled object based upon the detected size, temperature and/or proximity, speed or direction of an object in relation to one or more size thresholds, temperature thresholds, and/or proximity, speed or direction thresholds. | 08-22-2013 |