DATEC COATING CORPORATION Patent applications |
Patent application number | Title | Published |
20120247641 | METHOD OF MELT BONDING HIGH-TEMPERATURE THERMOPLASTIC BASED HEATING ELEMENT TO A SUBSTRATE - A method for producing a thermoplastic film-substrate resistive thick film heating element is described, involving the melt bonding of an electrically insulating, optionally filled high temperature thermoplastic film to a substrate. This thick film heating element includes an optionally filled high temperature thermoplastic film-substrate onto which is deposited at least a resistive thick film, and is capable of operating over a wide range of power densities for consumer and industrial heating element applications. | 10-04-2012 |
20090272731 | Thick film high temperature thermoplastic insulated heating element - The present invention provides an integrated thick film heating element on a substrate made from high temperature melt-flowable thermoplastic polymer/powder additive formulations which form an electrically insulating thermoplastic dielectric coating on the substrate, and electrically resistive lead free films and electrically conductive film formulations that are deposited and fired to form an integrated thick film heating element on a substrate at a processing temperature well below 600° C. This thick film heating element is formed on a substrate material coated first with the electrically insulating, filled melt flowable high temperature thermoplastic polymer/powder composite layer on which is deposited the electrically resistive lead free thick film that is capable of operating over a wide range of power densities for consumer and industrial heating element applications, with suitable electrical insulation properties under temperature cycling to for example 250° C. | 11-05-2009 |