Commissariat a I'Energie Atomique et Aux Energies Altematives
Paris, FR
Commissariat a I'Energie Atomique et Aux Energies Altematives Patent applications | ||
Patent application number | Title | Published |
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20130014670 | USE OF ANTICORROSION AGENTS FOR CONDITIONING MAGNESIUM METAL, CONDITIONING MATERIAL THUS OBTAINED AND PREPARATION PROCESSAANM Lambertin; DavidAACI OrangeAACO FRAAGP Lambertin; David Orange FRAANM Frizon; FabienAACI Villeneuve Lez AvignonAACO FRAAGP Frizon; Fabien Villeneuve Lez Avignon FRAANM Blachere; AdrienAACI Entraigues Sur SorguesAACO FRAAGP Blachere; Adrien Entraigues Sur Sorgues FRAANM Bart; FlorenceAACI OrsanAACO FRAAGP Bart; Florence Orsan FR - Use of at least one corrosion-inhibiting additive to reduce the production of hydrogen via corrosion of magnesium metal conditioned in a cement matrix is provided. Also provided is a material for conditioning magnesium metal given such use and its method of preparation. | 01-17-2013 |
20120314112 | Method for Controlling a Light-Sensitive Device - The invention relates to a method for controlling a light-sensitive device comprising a matrix of light-sensitive points arranged into lines and columns. The invention can essentially but not exclusively be used in light-sensitive devices used for detecting X-ray images. The method includes a step (E | 12-13-2012 |
20120199867 | METHOD FOR ATTACHING AN ELECTRONIC COMPONENT TO A PRODUCT - An electronic component is attached to a product, using a transfer method involving the use of a transfer sheet including a substrate sheet and at least one transfer layer covering a portion of the front surface of the substrate sheet. The transfer method consists in: placing the transfer layer in contact with the product; applying a pressure against the back surface of the substrate sheet; and finally removing the substrate sheet, said at least one transfer layer remaining affixed to the product. In addition, the attachment method includes a step prior to the transfer method, during which at least one electronic assembly including at least one electronic chip attached to at least one wire is positioned between the product and the substrate sheet, such that at least one portion of each assembly is held in place by a transfer layer following the removal of the substrate sheet. | 08-09-2012 |