Avago Technologies General IP (Singapore) Pte. Ltd . Patent applications |
Patent application number | Title | Published |
20150349723 | HYBRID POWER AMPLIFIER HAVING ELECTRICAL AND THERMAL CONDUCTION PATH - A heterojunction bipolar transistor (HBT) hybrid type RF (radio frequency) power amplifier includes a first device including an input terminal for receiving an RF signal, a pre-driver stage for amplifying the received RF signal, and an output terminal, the input terminal, the pre-driver stage and the output terminal being disposed in or over a first substrate; and a second device having a main stage having an HBT amplifier circuit disposed in or over a second substrate to further amplify the RF signal amplified by the pre-driver stage. The RF signal further amplified by the main stage is output through the output terminal of the first device. | 12-03-2015 |
20150110493 | DEMULTIPLEXING DEVICE FOR OPTO-ELECTRONIC TRANSCEIVER - An optical demultiplexing device includes an optics body, a minor, optical filters, and opto-electronic detectors. The optics body has a fiber port configured to receive an end of an optical fiber, a reflective surface aligned with the fiber port, a substantially planar filter mounting surface, and a substantially planar mirror mounting surface. The filter mounting surface and the minor mounting surface are parallel to one another and formed on the same side of the optics body as each other. The minor is mounted on the minor mounting surface, and the filters are mounted on the filter mounting surface. Each filter is transparent to a different wavelength and is interposed in an optical path between one of the opto-electronic detectors and the reflector. | 04-23-2015 |
20140333329 | METHOD AND APPARATUS FOR MEASURING THICKNESS OF LAYER IN PRINTED CIRCUIT BOARD - A method for testing an electronic device comprises providing a device under test (DUT) defined on a printed circuit board (PCB). The DUT includes a measurement target layer forming part of the PCB, and a transmission line which is in contact with the measurement target layer. The method further comprises applying an electric power to the transmission line, measuring a capacitance of the measurement target layer while the electric power is being applied, and computing a thickness of the measurement target layer based on the measured capacitance. | 11-13-2014 |
20140312371 | HYBRID REFLECTOR CUP - A package for a light source and methods of manufacturing the same are disclosed. In particular, a light source package is disclosed with an outer component and an interchangeable inner component. The inner component can be modular and replaceable with other inner components having different properties, thereby enabling a flexible design of a light source package to accommodate different lighting conditions and desired lighting effects. | 10-23-2014 |
20140269122 | SYSTEM AND METHOD FOR INTEGRATED CIRCUIT MEMORY REPAIR - Memory blocks in an integrated circuit (IC) chip can be repaired by employing automated test equipment external to the IC chip to aid in burning fuses on the IC chip by encoding the fuses with binary-encoded numbers. Each binary-encoded number represents a bit position of each “1” bit of a repair control word corresponding to a defective memory location. During a repair sequence preceding operation of the IC chip, the binary-encoded numbers are read out of the fuses and used to form a serial stream of repair chain information. | 09-18-2014 |
20140219619 | Adapter and Methods for Cleaning an Optical Junction and Reducing Optical Back Reflection - An adapter includes a housing with opposed openings for receiving a first connector that is mechanically and optically mateable with a second connector to form one or more optical signal communication links. The housing is arranged with a slot for receiving a flexible material having an index of refraction that approximates the index of refraction of aligned pairs of optical fibers. The flexible material is appropriately sized to cover the fibers from each of the connectors. The optical fiber ends of a respective connector can be cleaned by inserting the connector in the adapter and advancing the flexible material. Once the optical fiber ends of both connectors have been cleaned and the flexible material further advanced, the connectors can be reinserted in the adapter to establish an optical signal link between the optical fibers. | 08-07-2014 |
20140112668 | STAMPED METAL OPTIC FOR USE IN AN OPTICAL COMMUNICATIONS MODULE - A stamped metal optic is provided that is a unitary, or integrally formed, part that includes at least a bench for holding at least one optoelectronic component and a reflector for folding an optical pathway. The stamped metal optic is formed of a piece of metal that is shaped using known metal stamping techniques. The stamped metal optic preferably has at least one fiducial mark formed therein that is used for placement of the optoelectronic device on the bench to ensure that the optoelectronic device is precisely aligned with the reflector. Because metal objects can be formed relatively inexpensively with high precision using known stamping techniques, the stamped metal optics can be manufactured with high precision at relatively low cost. | 04-24-2014 |
20140111992 | LEADFRAME-BASED SURFACE MOUNT TECHNOLOGY SEGMENTED DISPLAY DESIGN AND METHOD OF MANUFACTURE - A multi-segment display is disclosed. The multi-segment display includes substantially no hotspots and is substantially free of color discoloration that accompanies hotspots. The multi-segment display is configured for surface mounting. The multi-segment display is provided with a leadframe that fits into a package body thereby placing the light sources mounted on the leadframe in closer proximity to the encapsulant that fills vias of each segment. | 04-24-2014 |