ASIA VITAL COMPONENTS CO., LTD. Patent applications |
Patent application number | Title | Published |
20150354585 | SLIM FAN STRUCTURE - A slim fan structure includes a fan frame, a top cover closed to a top of the fan frame to define a receiving space in the fan frame, a stator assembly mounted in the receiving space, and a hub fitted around the stator assembly. The fan frame has opposite first and third sides forming an air inlet and an air outlet, respectively, and opposite second and fourth sides having a first and a second side wall formed thereon, respectively. The first side wall includes a protruded portion laterally extended toward the air inlet, and the second side wall includes a stop portion located adjacent to the air outlet. With the air inlet and the air outlet formed on two lateral sides of the fan frame, the slim fan structure has an effectively reduced overall thickness and does not produce noise during operation to largely upgrade the operational performance thereof. | 12-10-2015 |
20150330716 | BASE PLATE FIXING STRUCTURE FOR A HEAT DISSIPATING MODULE - A base plate fixing structure for a heat dissipating module includes a base plate and a plurality of fixing components. At a center of the base plate is disposed a through groove. At a bottom edge of the through groove is disposed a holding and engaging part extending and protruding inwards. On two sides of the through groove are respectively disposed two or more than two corresponding fixing holes. On two ends of the through groove are respectively disposed a containing rod arching upwards. The plurality of fixing components each includes a horizontal section and vertical sections extending downwards from two ends of the horizontal section. During assembly, one end of the heat pipe is run through the through groove of the base plate with the containing rod and the holding and engaging part limiting its position. The fixing components are joined to the fixing holes through their vertical sections. The horizontal sections are used to press the heat pipe so that the heat pipe is tightly fixed to the base plate. The fore-going combination facilitates the assembly of a heat dissipating module at a reduced assembly cost. | 11-19-2015 |
20150330715 | MANUFACTURING METHOD OF THERMAL MODULE - A manufacturing method of thermal module includes steps of: providing a base seat and a heat pipe, the base seat having a first face and a second face; mechanically processing the base seat from the first face to the second face to form a receiving channel having a bottom section and a first side section and a second side section respectively vertically extending from two sides of the bottom section; placing the heat pipe into the receiving channel; mechanically processing the base seat and the heat pipe to hold the base seat and the heat pipe in a direction normal thereto; and horizontally mechanically processing the base seat and the heat pipe from outer sides to inner sides of the first and second side sections to form a recess on each of the first and second side sections, whereby a protrusion section is formed to press the heat pipe. | 11-19-2015 |
20150317669 | PROTECTIVE COVER WITH INFORMATION DISPLAY FUNCTION - A protective cover with information display function includes a main body, at least one receiving unit provided on the main body, and at least one sheet of e-paper. The main body has an opening formed on and sunk from one side of the main body, and an object to be protected can be fitted into the opening and safely covered by the main body. The receiving unit is wirelessly connected to an external interface for receiving an electromagnetic wave. The e-paper is selectively provided on the main body or the receiving unit and is electrically connected to the receiving unit, and can be driven by the electromagnetic wave to display information thereon. With the main body having the receiving unit and the e-paper provided thereon, the protective cover can effectively provide the function of displaying advertisement and other information at any place in real time. | 11-05-2015 |
20150315917 | FAN IMPELLER BALANCE CALIBRATING METHOD - A fan impeller balance calibrating method includes steps of: placing a fan impeller onto a measurement platform, the measurement platform having a controller, a speedometer device and a detection device being arranged on the measurement platform for detecting the rotational speed and balance of the fan impeller respectively, the controller receiving data from the speedometer device and the detection device to calculate and generate a detection signal to the measurement platform, according to the received detection signal, the measurement platform displaying calibration data and rotational speed data; and adding at least one weight body to the fan impeller or removing at least one weight body from the fan impeller according to the calibration data to quickly calibrate the balance of the fan impeller. The fan impeller balance calibrating method is advantageous in that the balance calibration time is shortened and the calibration process is simplified. | 11-05-2015 |
20150308436 | THIN FAN STRUCTURE - A thin fan structure includes a case, a fan impeller, a circuit board, a silicon steel sheet and a winding assembly. The case has a receiving space and a bearing cup protruding into the receiving space. The bearing cup is formed with a bearing hole. The fan impeller has a hub section, multiple blades and a shaft extending from a center of the hub section. A magnetic member is annularly disposed on inner circumference of the hub section. The circuit board is disposed in the receiving space. The silicon steel sheet disposed on the circuit board has a base section and multiple first magnetic conductive sections, which together define a receiving space. The winding assembly is fixedly disposed in the receiving space. The winding assembly has a bottom section attached to the base section and a side section attached to the first magnetic conductive sections. | 10-29-2015 |
20150296663 | HEAT SINK FASTENING DEVICE AND THERMAL MODULE ASSEMBLY USING SAME - A heat sink fastening device includes an operating member and a retaining member axially extended through the operating member and associated with the latter via a pivot shaft. The operating member includes a cylindrical cam portion, which has an elastic element received therein to provide the cam portion with an elastic force. The cam portion has an upper end formed into a pair of cam surfaces, on which the pivot shaft is rested. The operating member can be horizontally rotated about an axis thereof. When the operating member is rotated, the cam surfaces rotate and cause the pivot shaft to move from a higher to a lower position on the cam surfaces or vice versa, so that the retaining member associated with the operating member via the pivot shaft is brought by the pivot shaft to axially move downward to a released position or upward to a fastened position. | 10-15-2015 |
20150296654 | HEAT SINK RETAINER UNIT AND THERMAL MODULE DEVICE - A heat sink retainer unit includes a buckle body, a retainer member, an elastic member and a handle. The elastic member is disposed in the buckle body and fitted on the retainer member. The retainer member is passed through the buckle body from a lower side thereof. A top end of the retainer member is positioned above the buckle body. The handle is positioned above the buckle body and pivotally connected with the top end of the retainer member. By means of operating the handle, the retainer member can be moved up and down, whereby the elastic member can apply elastic force to the buckle body. | 10-15-2015 |
20150296295 | FAN ACTIVE NOISE SELF-LOWERING SYSTEM - A fan active noise self-lowering system includes a fan, a push assembly, at least one pickup unit and a digital signal processing unit. The pickup unit serves to capture the noise made by the fan to generate a noise input signal and transmit the noise input signal to the digital signal processing unit. The digital signal processing unit receives the noise input signal and processes the noise input signal to output a control signal for controlling the push winding assembly to operate so as to push the fan impeller of the fan to move up and down. Accordingly, the fan impeller will generate a reverse sonic wave to offset the noise. | 10-15-2015 |
20150263652 | SYNCHRONIZING METHOD OF FAN ROTATIONAL SPEED - A synchronizing method of fan rotational speed includes steps of: using a first Hall sensor to detect pulse period width generated by the rotational speed of the first fan and converting the pulse period width into a first pulse signal and transmitting the first pulse signal to a microprocessor; using a second Hall sensor to detect pulse period width generated by the rotational speed of the second fan and converting the pulse period width into a second pulse signal and transmitting the second pulse signal to the microprocessor; using the microprocessor to compare the first and second pulse signals corresponding to the pulse period widths of the rotational speeds of the first and second fans; and the microprocessor generating a pulse modulation signal to the second fan so as to control the rotational speed of the second fan to be equal to the rotational speed of the first fan. | 09-17-2015 |
20150260462 | THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE - A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof. | 09-17-2015 |
20150258643 | METHOD OF MANUFACTURING THERMAL MODULE WITH ENHANCED ASSEMBLING STRUCTURE - A thermal module with enhanced assembling structure includes a base and a heat pipe. The base is formed on a middle portion with a longitudinal receiving recess, which has two end portions forming two supporting portions and a middle portion formed into an opening. A first and a second extended arm are formed at junctions between the receiving recess and two longitudinal sides of the opening. Wall surfaces of the first and second extended arms adjacent to the longitudinal sides of the opening are formed with alternating elevated and sunken areas. The heat pipe is held down in the receiving recess by the first and second extended arms to fitly engage with the elevated and sunken areas. Therefore, there is an increased fitting tightness between the heat pipe and the base to ensure enhanced assembling strength of the thermal module and reduce the manufacturing cost thereof. | 09-17-2015 |
20150233646 | THERMAL MODULE ASSEMBLING STRUCTURE - A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel. | 08-20-2015 |
20150233444 | FAN VIBRATION ABSORBING STRUCTURE AND FAN USING SAME - A fan vibration absorbing structure includes a bearing cup and a vibration absorbing element. The bearing cup includes a first section, a second section and a bearing holding hole. The first and the second section are connected end-to-end to enclose a receiving space therein, which communicates with the bearing holding hole. The vibration absorbing element is fitted between the first and the second section. With the fan vibration absorbing structure included in a fan, it is able to largely reduce the vibration occurred during fan operation. | 08-20-2015 |
20150226492 | Heat Pipe Structure and Thermal Module Using Same - A thermal module includes a heat pipe structure, a plurality of heat radiation fins and a fan. The heat pipe structure includes a pipe having a first end, a second end and a middle section. The first and the second end are located adjacent to each other and form two heat-absorption sections, and the middle section forms a heat-dissipation section and is extended from the first end to the second end in a curve to have a substantially round shape defining a central opening. The heat radiation fins are arranged on the middle section of the pipe. The fan is correspondingly mounted to the heat-dissipation section and is faced to the heat radiation fins. With these arrangements, the thermal module is cost-effective and has largely upgraded heat transfer efficiency. | 08-13-2015 |
20150226230 | SERIES FAN FRAME BODY STRUCTURE MADE OF DIFFERENT MATERIALS - A series fan frame body structure made of different materials includes at least two fans, which are serially connected with each other. The fan frames of the two fans are made of different plastic materials. Accordingly, the excited frequency of the fan is prevented from being close to the natural frequency of the fan frames. Therefore, the vibration frequencies of the fan frames are different from each other so that the co-vibration is reduced to lower the noise. By means of the series fan frame body structure made of different materials, the problem of vibration of the fan is effectively improved. | 08-13-2015 |
20150226222 | SERIES FAN - A series fan includes a first fan and a second fan. The first fan has a first frame, a second frame and a first flow passage. The second fan has a third frame, a fourth frame and a second flow passage. A first static blade is disposed at the first frame, while a second static blade is disposed at the fourth frame. A first dynamic blade assembly is disposed in the first flow passage, while a second dynamic blade assembly is disposed in the second flow passage. The second frame is assembled with the third frame. The first and second static blades serve to enhance the support strength and protection effect for the series fan. In addition, the first and second dynamic blade assemblies can be designed with an increased aerodynamic volume. | 08-13-2015 |
20150221576 | Heat Dissipation Structure for Semiconductor Element - A heat dissipation structure for semiconductor element includes a semiconductor element and a covering. The covering has a first side and an opposite second side and is formed on the second side with a heat radiation layer. The covering is externally covered on one side of the semiconductor element with the first side of the covering attached to the covered side of the semiconductor. By attaching the covering to one side of the semiconductor element, heat emitted by the semiconductor element during operation can be more quickly absorbed by the covering and radiated from the heat radiation layer into ambient environment to avoid heat accumulation on the semiconductor element. | 08-06-2015 |
20150219410 | Heat Dissipation Structure Enhancing Heat Source Self Heat Radiation - A heat dissipation structure enhancing heat source self heat radiation includes a heat source and a heat radiation layer formed on at least one side of an exterior of the heat source. With the heat dissipation structure, the heat source can have largely increased self heat radiation efficiency, enabling heat emitted by the heat source to be quickly dissipated into ambient environment to avoid heat accumulation on the heat source. | 08-06-2015 |
20150219406 | Heat Dissipation Device - A heat dissipation device includes a main body and a radiation heat dissipation layer. The main body has a first board body and a second board body. The first and second board bodies are correspondingly mated with each other to define a receiving space. At least one capillary structure and a working fluid are disposed in the receiving space. The radiation heat dissipation layer is formed on one face of the second board body, which face is distal from the first board body. The heat dissipation device is disposed in a mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced. | 08-06-2015 |
20150219120 | FAN FRAME BODY STRUCTURE - A fan frame body structure includes a fan frame. The fan frame has an air inlet and an air outlet. The fan frame body structure is characterized in that the fan frame is composed of multiple frame layers, which are stacked to form the fan frame. The respective frame layers are made of different materials of different compositions with totally different vibration frequencies. The multiple frame layers of different materials with different vibration frequencies are stacked to form the fan frame so as to greatly reduce the co-vibration of the fan frame and lower the noise. | 08-06-2015 |
20150212557 | HEAT DISSIPATION STRUCTURE APPLIED TO MOBILE DEVICE - A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced. | 07-30-2015 |
20150202836 | MANUFACTURING METHOD OF HEAT DISSIPATION STRUCTURE APPLIED TO MOBILE DEVICE - A manufacturing method of heat dissipation structure applied to mobile device. The heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced. | 07-23-2015 |
20150185793 | HEAT DISSIPATION STRUCTURE OF MOBILE DEVICE - A heat dissipation structure of mobile device includes a case and a heat generation component. The case defines a receiving space. The heat generation component is disposed in the receiving space. One face of the heat generation component is attached to one face of a cooling chip. The other face of the cooling chip is attached to the case. The cooling chip serves to absorb the heat generated by the heat generation component and conduct the heat to the case to dissipate the heat, whereby the heat dissipation problem of the mobile device is solved and an energy-saving effect is achieved. | 07-02-2015 |
20150184948 | STRUCTURE FOR HOLDING A HEAT PIPE TO A BASE - A structure for holding a heat pipe to a base includes a base and a heat pipe. The base has a first side and an opposite second side, and is formed at a middle portion with a receiving recess, such that two sidewalls are raised from two lateral sides of the receiving recess. Each of the sidewalls has at least one projected section formed using a part material of the base, such that portions of the base adjacent to the projected sections respectively form an opening. The heat pipe is laid in the receiving recess and has a top and a bottom surface. The projected sections are bent to flatly press against the top surface of the heat pipe to firmly hold the heat pipe to the base. Since the projected sections are formed using a part material of the base, the holding structure is manufactured at largely reduced cost. | 07-02-2015 |
20150160703 | Heat Dissipation Unit of Handheld Electronic Device - A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced. | 06-11-2015 |
20150159966 | Manufacturing Method of Thermal Module - A manufacturing method of thermal module includes steps of: providing a base seat with a raised section and a heat dissipation unit with a recess; heating the heat dissipation unit and fitting the raised section of the base seat into the recess of the heat dissipation unit to connect the heat dissipation unit with the base seat; and tightly connecting the heat dissipation unit with the base seat to form an integrated body after the heat dissipation unit is cooled. According to the manufacturing method of thermal module, the manufacturing cost of the thermal module is lowered and the manufacturing process is greatly simplified. | 06-11-2015 |
20150159663 | Fan Motor Control Device - A fan motor control device includes a zero-crossing detection unit, a phase control unit, an operation processing unit, a first rectifier element and a second rectifier element. The zero-crossing unit generates a synchronization reference signal to the phase control unit, which in turn generates a phase control signal to the operation processing unit. According to the received phase control unit, the operation processing unit generates a motor-starting processing signal to the first and the second rectifier element for driving a fan motor to rotate. Since the phase control unit provides the effect of controlling the fan motor's output power and rotational speed, it enables the fan to have increased rotational speed and provide improved heat dissipation and ventilation effects. | 06-11-2015 |
20150159491 | FAN WHEEL STRUCTURE - A fan wheel structure includes a ring member and a rotor. The ring member has two opposite open ends and an inner space defined between and communicable with the two open ends. A blade seat having a plurality of blades formed therearound is insert-molded on an outer side of the ring member. The rotor includes a hub fitted in the inner space of the ring member to associate with the ring member and the blade seat, and a rotary shaft having a coupling end inserted into the hub. The rotor can be fitted in the inner space of the ring member from either of the two open ends thereof for the completed fan wheel structure to have either a clockwise or a counterclockwise blade rotating direction. Therefore, only one mold, and accordingly an effectively reduced cost, is needed for manufacturing the fan wheel structures of different rotating directions. | 06-11-2015 |
20150143426 | ELECTRONIC PROGRAM LIST OPERATION SYSTEM APPLIED TO PORTABLE ELECTRONIC DEVICE AND OPERATION METHOD THEREOF - An electronic program list operation system applied to portable electronic device and an operation method thereof. The electronic program list operation system includes a controlled device, at least one portable electronic device and a wireless transmission module. The portable electronic device is wirelessly connected to a network platform for readily downloading and updating program list information, whereby a user can check the program list information on the portable electronic device and input an operation command to select a desired channel. The wireless transmission module serves to transmit at least one remote control signal to the corresponding controlled device to switch to the selected channel. Accordingly, a user can browse the program list information on the portable electronic device and immediately switch to the selected channel for watching a desired program. | 05-21-2015 |
20150125283 | FAN SALT-FOG-RESISTANT STRUCTURE AND FAN FRAME THEREOF - A fan salt-fog-resistant structure and a fan frame thereof. The fan salt-fog-resistant structure includes a base seat having a bearing cup and at least one flow guide body. Multiple connection bodies outward extend from the base seat. The flow guide body is disposed at a junction between the base seat and the connection bodies. The fan frame includes a main body having a first open side and a second open side and a flow passage defined therebetween. One end of the connection body is connected with the second open side. When airflow entraining moisture and salt fog flows through the junction between the base seat and the connection bodies, the flow guide body serves to guide the airflow and prevent the airflow from forming eddy, whereby the salt fog entrained by the airflow will not crystallize to form sediments at the junction between the base seat and the connection bodies. | 05-07-2015 |
20150125276 | BEARING HOLDING STRUCTURE - A bearing holding structure includes a base and at least one bearing. The base includes a bearing cup, which is axially extended from a center of the base and defines a receiving space therein. The bearing is fitted in the receiving space of the bearing cup and has a shaft hole. At least one groove is provided on one or both of an inner surface of the bearing cup and an outer surface of the bearing; and the groove is communicable with the receiving space of the bearing cup. The groove is filled with a meltable filler, which is melted by laser welding to fixedly connect the bearing and the bearing cup to one another, such that the bearing is not brought by a rotary shaft to rotate and slide in the bearing cup, enabling the bearing and the bearing cup to have prolonged service life. | 05-07-2015 |
20150125262 | SERIES FAN ASSEMBLING STRUCTURE - A series fan assembling structure includes a connection assembly, a first fan and a second fan. The connection assembly has a first connection member having a first end face and a second end face opposite to the first end face. A second connection member is disposed at an upper end of the first connection member to outward horizontally extend from the first end face. A third connection member is disposed at a lower end of the first connection member to outward horizontally extend from the second end face. A passage is formed at the centers of the first and second end faces. The first fan is mated with the first end face of the first connection member and horizontally connected with the second connection member. The second fan is mated with the second end face of the first connection member and horizontally connected with the third connection member. | 05-07-2015 |
20150122460 | HEAT PIPE STRUCTURE - A heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered. | 05-07-2015 |
20150122456 | HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING SAME - A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed. | 05-07-2015 |
20150113807 | MANUFACTURING METHOD OF HEAT PIPE STRUCTURE - A heat pipe structure and a manufacturing method of the heat pipe structure. The heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered. | 04-30-2015 |
20150109788 | OPTICAL TOUCH MODULE AND DEVICE THEREOF - An optical touch device includes multiple optical touch modules and multiple L-shaped connection boards, which are assembled to form a frame body. Each L-shaped connection board is connected between two adjacent optical touch modules. Each optical touch module includes an LED circuit board and a control circuit board. Multiple LED components are disposed on one face of the LED circuit board. The other face faces the control circuit board. The other face of the control circuit board is connected with the L-shaped connection board. A first connector and a second connector are positioned in a space between overlapping sections of the LED circuit board and the control circuit board and mated with each other. The control circuit board has at least one third connector mated with a fourth connector of the L-shaped connection board. Electronic components and/or an extension section of a filter member are positioned in the space. | 04-23-2015 |
20150109256 | OPTICAL TOUCH MODULE AND OPTICAL TOUCH COMPONENT STRUCTURE - An optical touch component structure includes multiple optical touch modules and multiple L-shaped connection boards, which are assembled to form a frame body. Each optical touch module includes an LED circuit board and a control circuit board. The L-shaped connection boards are respectively connected to two ends of the control circuit boards. At least one first and second connector are disposed on correspondingly overlapping sections of the LED circuit board and the control circuit board and vertically mated with each other. Two outermost ends of the control circuit boards have two third connectors horizontally mated with fourth connectors of the L-shaped connection boards. A space exists between the LED circuit board and the control circuit board and between the LED circuit board and the L-shaped connection board. Electronic components are disposed in the space and an extension section of a filter member extends into the space. | 04-23-2015 |
20150109255 | OPTICAL TOUCH MODULE AND ASSEMBLY FORMED THEREFROM - An optical touch assembly includes a plurality of optical touch modules connected to one another via L-shaped coupling plates to form a frame. Every optical touch module includes a light-emitting-diode (LED) circuit board having a plurality of LED elements mounted thereto and a control circuit board located below and overlapped with the LED circuit board. The L-shaped coupling plates connected to two opposite ends of each optical touch module are located below and overlapped with the LED circuit board. First connectors are provided on a bottom surface of the LED circuit board for correspondingly vertically connecting to second and third connectors provided on the control circuit board and the L-shaped coupling plates, respectively, so that intermediate spaces are formed in overlap areas between the LED circuit board and the control circuit board and the L-shaped coupling plates for mounting electronic elements and an extended section of a filter therein. | 04-23-2015 |
20150086351 | SERIES FAN STRUCTURE WITH MULTISTAGE FRAME BODY - A series fan structure with multistage frame body includes a first main body, a second main body, a first frame and a second frame. The first main body has a first fan frame having a first opening and a second opening. The second main body is correspondingly serially connected to the first main body. The second main body has a second fan frame having a third opening and a fourth opening. The third opening corresponds to the second opening. The first frame is correspondingly serially connected to one side of the first fan frame with the first opening. The first frame and the first fan frame together define a first flow passage. The second frame is correspondingly serially connected to one side of the second fan frame with the fourth opening. The second frame and the second fan frame together define a second flow passage. | 03-26-2015 |
20150084569 | INTEGRATED SYSTEM OF CIRCUITS FOR SERIAL FAN STRUCTURE - An integrated system of circuits for serial fan structure includes a first and a second fan connected back to back. A first driving unit and a first control unit for the first fan and a second driving unit and a second control unit for the second fan are sequentially electrically connected to a circuit board in the second fan. Further, a first coil assembly of the first fan and a second coil assemble of the second fan are also electrically connected to the circuit board in the second fan; and some low-use-rate electronic circuits are included in a common circuit unit of the first and the second fan. Therefore, the serial fan structure can save one circuit board and some low-use-rate electronic circuits from the first fan to achieve the purpose of reducing the manufacturing cost of the serial fan structure. | 03-26-2015 |
20150083372 | HEAT DISSIPATION UNIT - A heat dissipation unit includes a housing and a heat pipe. The housing has a chamber in which a working fluid is contained. Multiple support posts and multiple fixing members are disposed in the chamber. The heat pipe has a heat absorption section positioned in the chamber of the housing and securely supported by the fixing members, and a heat dissipation section extending from the heat absorption section through the housing and positioned outside the chamber of the housing. | 03-26-2015 |
20150083371 | HEAT DISSIPATION STRUCTURE FOR HAND-HELD MOBILE DEVICE - A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air. | 03-26-2015 |
20150060020 | THERMAL MODULE - A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers. | 03-05-2015 |
20150055818 | SPEAKER STRUCTURE - A speaker structure includes a main body, a circuit board and a magnetic component. The main body has a receiving section and a recess formed on an outer circumference of the receiving section. A center of the main body is formed with a hole in communication with the receiving section. The circuit board has a board body and an outer frame body inlaid in the recess of the main body. The magnetic component is received in the hole. A voice coil collar is disposed around the magnetic component. Multiple windings are wound around a surface of the voice coil collar. Two ends of the windings are attached to the circuit board. According to the above arrangement, the volume of the speaker structure is greatly reduced and the manufacturing cost of the speaker structure is lowered. | 02-26-2015 |
20150055300 | HEAT DISSIPATION STRUCTURE AND HANDHELD ELECTRONIC DEVICE WITH THE HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the first face. A chamber is defined between the first and second faces. More than one capillary structure and a working fluid are disposed in the chamber. One of the first and second faces or both of the first and second faces are in contact with the electronic components of the handheld electronic device. One of the first and second faces is in contact with the housing of the handheld electronic device. Accordingly, the heat generated by the electronic components can be quickly conducted and dissipated outward. | 02-26-2015 |
20150055295 | HEAT DISSIPATION DEVICE - A heat dissipation device is arranged in an outer case of an electronic device, and includes an oscillation assembly, an air disturbing member and at least one fixing seat. The oscillation assembly includes a base and an oscillating member provided on the base; and the air disturbing member is connected at a first end to the oscillating member and at an opposite second end to the fixing seat. When an electric power is supplied to the oscillation assembly, the oscillating member is oscillated to thereby vibrate the first end of the air disturbing member, producing a continuous wave of the air disturbing member. The waving air disturbing member in turn disturbs air in the outer case, forcing the air toward a heat source and causing air convection in the outer case to enable largely upgraded heat dissipation efficiency of the electronic device. | 02-26-2015 |
20150055211 | REWORKABLE FILTER STRUCTURE OF INFRARED TOUCH MODULE - A reworkable filter structure of infrared touch module includes a main body having an upper protrusion section and an extension section. The upper protrusion section and the extension section respectively angularly extend from an upper end and a lower end of the main body in reverse directions. The upper protrusion section extends to upper sides of multiple infrared transmitters and multiple infrared receivers. The main body is positioned in front of the transmission faces of the infrared transmitters and the receiving faces of the infrared receivers to shield the transmission faces and the receiving faces. The extension section extends to a position between a transparent panel and a second circuit board. The reworkable filter structure further includes a connection means for connecting the extension section of the main body with the second circuit board. | 02-26-2015 |
20150054789 | FILTER STRUCTURE OF INFRARED TOUCH MODULE - A filter structure of infrared touch module includes a main body having an upper protrusion section and an extension section. The upper protrusion section and the extension section respectively extend from an upper end and a lower end of the main body in reverse directions. The upper protrusion section extends to upper sides of multiple infrared transmitters and multiple infrared receivers. The main body is positioned in front of the transmission faces of the infrared transmitters and the receiving faces of the infrared receivers to shield the transmission faces and the receiving faces. The extension section extends to a position between a transparent panel and a second circuit board. | 02-26-2015 |
20150032284 | DETECTION MODULE, DEVICE AND SYSTEM FOR DETECTING FAN'S CONNECTION AND DISCONNECTION STATES - A detection system for detecting fan's connection and disconnection states includes a detection module connected to a fan and a host. The fan has four external connection terminals for connecting to the detection module. Two of the four external connection terminals are a rotation speed control terminal, via which a detection signal and a rotation speed control signal are transmitted from the detection module to the fan, and a rotation speed feedback terminal, via which a fed back detection signal and a fan rotation speed signal are transmitted from the fan to the detection module. The host determines whether the fan is connected to or disconnected from the detection module according to whether or not a fed back detection signal is received by the detection module from the fan. | 01-29-2015 |
20150029664 | FAN ANTI-CORROSION STRUCTURE - A fan anti-corrosion structure includes a base seat, a circuit board and at least one coating unit. The base seat has a sidewall and a bearing cup. A rest face extends from the sidewall toward the bearing cup. The circuit board is fitted around the bearing cup and disposed on the rest face. A closed space is defined between the circuit board and the base seat. The coating is coated on the circuit board. The circuit board is protected from the corrosion of the moisture and the salt fog by the coating unit and the closed space. Also, the cost of the mold for forming the coating unit is saved to lower the manufacturing cost. | 01-29-2015 |
20150028745 | LIGHT EMITTING DIODE DRIVING CIRCUIT STRUCTURE - A light emitting diode (LED) driving circuit structure includes a surge absorber unit, a voltage suppression unit connected to the surge absorber unit, a rectifier unit electrically connected to the voltage suppression unit, a control chip connected to a fourth junction of the rectifier unit, and an impedance unit connected to the control chip. The LED driving circuit structure is installed on an LED light circuit board having a plurality of LEDs mounted thereon. According to the sinusoidal wave form of the alternating current (AC) supplied to the LEDs as well as the number and layout of the LEDs on the LED light circuit board, the LED driving circuit structure controls the current flowing through the LEDs to vary with changes of supply voltage, so as to enable effectively increased power factor and reduced harmonics, as well as effectively lowered manufacturing and material costs. | 01-29-2015 |
20150027668 | VAPOR CHAMBER STRUCTURE - A vapor chamber structure is disclosed and includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost. | 01-29-2015 |
20150026981 | MANUFACTURING MEHTOD OF VAPOR CHAMBER STRUCTURE - A manufacturing method of vapor chamber structure is disclosed. The vapor chamber structure includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost. | 01-29-2015 |
20150012138 | FAN OPERATION CONTROL SYSTEM - A fan operating control system includes a magnetic sensor unit, a control unit, a rectifier unit and a coil unit. The control unit is electrically connected to the magnetic sensor unit and the rectifier unit; the rectifier unit is further electrically connected to a ground; and the coil unit is electrically connected to the control unit and the ground. The control unit detects any fan electric current flowing through the coil unit and generates a rotating speed signal accordingly. When no fan electric current is detected at the coil unit, the control unit stops generating the rotating speed signal. Therefore, it is able to avoid a whole fan system from making an error decision and outputting rotating speed signal continuously when there is not fan electric current flowing through the coil unit, and any abnormal condition that would adversely affect the fan service life can be avoided, too. | 01-08-2015 |
20140356170 | OIL RETURN STRUCTURE FOR FAN - An oil return structure for fan includes a base, a bearing, a retaining ring and a rotor. The base has a bearing cup internally defining a receiving space for receiving the bearing therein. The bearing has a centered and axially extended shaft hole. The retaining ring is located at a front end of the bearing and has a central hole. The rotor includes a hub and a shaft. The shaft is extended through the central hole of the retaining ring into the shaft hole of the bearing, and is provided with an annular groove corresponding to the retaining ring. Oil in the bearing flowing to the annular groove during fan operation is centrifugally pulled out of the shaft and then caught by the retaining ring, from where the oil returns to the bearing. Therefore, loss of oil from the bearing is largely reduced to ensure extended fan service life. | 12-04-2014 |
20140356054 | CONNECTION STRUCTURE APPLIED TO A FAN FOR CONNECTING A METAL MEMBER WITH A SHAFT BY MEANS OF LASER - A connection structure applied to a fan for connecting a metal member with a shaft by means of laser. The connection structure includes a metal member and a shaft. The metal member has an opening, a first side and a second side. The opening is formed through a center of the metal member. The shaft is inserted in the opening. An outer circumference of the shaft is welded with a circumference of the opening on the first side to form at least one first welding section between the contact sections of the outer circumference of the shaft and the circumference of the opening on the first side. The first welding section is connected between the outer circumference of the shaft and the circumference of the opening on the first side to integrally connect the metal member with the shaft. The connection structure applied to the fan can lower cost. | 12-04-2014 |
20140353008 | ASSEMBLING STRUCTURE OF HEAT DISSIPATION DEVICE - An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board. | 12-04-2014 |
20140352126 | METHOD FOR COMBINING BEARING AND SLEEVE - A method for combining a sleeve and bearings, comprising the steps of: providing a base having a sleeve; disposing at least one bearing in the sleeve; and providing a laser beam to illuminate and melt a contact place between the perimeter of the bearing and the sleeve such that the bearing and the sleeve is combined firmly. Therefore, the effects of securing the bearings, reinforcing the structure thereof, and increasing the lifetimes of the bearings and the sleeve can be achieved. | 12-04-2014 |
20140338194 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a first chamber defining a first cavity, a second chamber defining a second cavity, and multiple connection members each defining a passageway. First and second ends of the connection members are respectively connected with the first and second chambers in communication with the first and second cavities through the passageways. A working fluid is contained in the first cavity. When the working fluid is heated, the working fluid is evaporated into vapor. The vapor passes through the passageways into the second cavity. After reaching the second cavity, the vapor is condensed into liquid state. Then, the liquid goes back into the first cavity through the passageways to complete a working cycle and achieve heat dissipation effect. | 11-20-2014 |
20140318745 | THERMAL MODULE - A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module. | 10-30-2014 |
20140318744 | THERMAL MODULE - A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module. | 10-30-2014 |
20140265669 | Centrifugal Heat Dissipation Device and Motor Using Same - A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance. | 09-18-2014 |
20140248080 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140248079 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140248078 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140246996 | CONTROL CIRCUIT FOR SPEED AND ROTATIONAL DIRECTION OF FAN - The present invention provides a control circuit for speed and rotational direction of a fan, including a signal conversion unit, a processing unit, and a drive unit. The signal conversion unit converts the received input signal into a DC level signal. The processing unit determines to generate a plurality of control signals for the fan based on the received DC level signal and at least one preset voltage therein to drive the drive unit, further controlling the rotational speed or clockwise/counter-clockwise rotation of the fan, whereby to reduce the cost and increase the layout space. | 09-04-2014 |
20140246176 | HEAT DISSIPATION STRUCTURE - A heat dissipation structure includes a main body. The main body has a chamber. The chamber has an evaporation section, a condensation section, a first backflow section and a second backflow section. The evaporation section and the condensation section and the first and second backflow sections communicate with each other. A junction between the first and second backflow sections is coated with a heat insulation coating. A working fluid is filled in the chamber. By means of the heat insulation coating, the heat leakage between the evaporation section and the condensation section can be avoided. In this case, the vapor-liquid circulation of the working fluid in the heat dissipation structure can be continuously successfully performed. | 09-04-2014 |
20140237823 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components. | 08-28-2014 |
20140237822 | HEAT DISSIPATION UNIT AND MANUFACTURING METHOD THEREOF AND THERMAL MODULE THEREOF - A heat dissipation unit and a manufacturing method thereof and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency. | 08-28-2014 |
20140232221 | Centrifugal Heat Dissipation Device and Motor Using Same - A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance. | 08-21-2014 |
20140216691 | VAPOR CHAMBER STRUCTURE - An improvement to a vapor chamber structure comprises a first body, a second body, and a working fluid. The first body has a plurality of first channels and a plurality of second channels, the first and second channels communicating with one another. The second body has a third channel, the first and second bodies and the first, second, and third channels communicate with one another and has a wick structure and are filled with a working fluid. By means of such a design of the present invention, the first body has the effect of uniform heat dissipation and the remote heat dissipation can be achieved through the second body. Consequently, the whole heat dissipation can be considerably improved. | 08-07-2014 |
20140204282 | TOUCH DISPLAY DEVICE - A touch display device includes a case, a liquid crystal display unit and a frame body. The case has a receiving space. The liquid crystal display unit is disposed in the receiving space of the case. The liquid crystal display unit has a display surface. At least one printed circuit layer is disposed on the display surface. Multiple transmitters and multiple receivers are electrically connected on the printed circuit layer. The frame body is mounted on the case to cover the printed circuit layer. The printed circuit layer is directly formed on the display surface of the liquid crystal display unit so that the cost for the circuit boards is saved. In this case, the manufacturing cost of the touch display device is lowered. Moreover, the total thickness of the touch display device is reduced and the installation is facilitated. | 07-24-2014 |
20140202666 | THERMAL MODULE - A thermal module for assembling with multiple heat sources includes at least one heat dissipation base seat, at least one first heat pipe and at least one first radiating fin assembly. The base seat has first insertion sections and a second insertion section in communication with each other. The heat sources are mated with the first insertion sections and the first heat pipe is mated with the second insertion section. Two ends of the first heat pipe respectively extend to the first insertion sections to attach to the heat sources. The first radiating fin assembly is attached to the first heat pipe. A second radiating fin assembly is further attached to the first heat pipe. The second radiating fin assembly extends to connect and assemble with the first radiating fin assembly. The thermal module can dissipate the heat of the multiple heat sources at the same time. | 07-24-2014 |
20140201990 | MANUFACTURING METHOD OF TOUCH DISPLAY DEVICE - A manufacturing method of touch display device includes steps of: providing a liquid crystal display unit and disposing at least one printed circuit layer on a display surface of the liquid crystal display unit; electrically connecting multiple transmitters and multiple receivers onto the printed circuit layer; positioning the liquid crystal display unit in a receiving space of a case; and providing a frame body and mounting the frame body onto the case to cover the printed circuit layer. The printed circuit layer is directly formed on the display surface of the liquid crystal display unit so that the cost for the circuit boards is saved. In this case, the manufacturing cost of the touch display device is lowered. Moreover, the total thickness of the touch display device is reduced and the installation is facilitated. | 07-24-2014 |
20140193258 | SWING FAN STRUCTURE - A swing fan structure includes a main body and multiple blades. The main body has an upper face and a lower face. The main body also has a long side and a short side. The blades are side by side disposed on the upper face of the main body in parallel to each other. The blades define therebetween a flow way. The blades are drivable by the main body to reciprocally move along the long side to create an air volume. The swing fan structure has a greatly minified volume. Also, the swing fan structure overcomes the shortcoming of unstable operation of the conventional fan caused by deflection of the blades in rotation. | 07-10-2014 |
20140182820 | VAPOR CHAMBER STRUCTURE - A vapor chamber structure includes a main body internally defining a sealed chamber and having a plurality of radiating fins externally provided thereon. The radiating fins are integrally formed on and outward extended from one side of the main body in a direction opposite to the chamber; and the chamber is internally provided with a wick structure and filled with a working fluid. By integrally forming the radiating fins and the chamber with one another, the vapor chamber structure can be manufactured with reduced labor cost and shortened manufacturing time. | 07-03-2014 |
20140182819 | HEAT DISSIPATING DEVICE - A heat dissipating device comprises a first body, a second body, and a working fluid, the first body having a first plate and a second plate combining with each other to together define a first chamber, the second body connecting the first body and having a second chamber communicating with the first chamber correspondingly, the working fluid filled in the first chamber and the second chamber. By means of the design of the structure of the present invention and through the circulation of the working fluid between the first chamber and the second chamber, the heat dissipating device of the present invention can achieve the effect of remote heat dissipation. | 07-03-2014 |
20140182132 | METHOD OF MANUFACTURING A VAPOR CHAMBER STRUCTURE - A vapor chamber structure includes an integrally formed main body defining a chamber and having radiating fins. The radiating fins are outward extended from one side of the main body in a direction opposite to the chamber; the chamber is internally provided with a wick structure and filled with a working fluid. A method of manufacturing a vapor chamber structure is also disclosed, which includes the steps of using an extrusion process to manufacture a main body having a plurality of radiating fins and a chamber; forming at least one wick structure on inner walls of the chamber after the main body has been manufactured; and sealing two ends of the main body, and evacuating the chamber before filling it with a working fluid. With the method, the vapor chamber structure can be manufactured with reduced material and labor costs and shortened manufacturing time. | 07-03-2014 |
20140178240 | BEARING FORMING METHOD - A bearing forming method in which different properties of powder materials are compressed and molded in batches and then the materials are together sintered to form an integrated porous bearing. By means of the bearing forming method, the necessary material properties of a part of the bearing are enhanced. Moreover, the material cost and the manufacturing cost are greatly lowered. | 06-26-2014 |
20140178184 | FAN AND MOTOR BEARING HEAT DISSIPATION STRUCTURE THEREOF - A motor bearing heat dissipation structure includes a metal base, a heat conducting element connected to the metal base and including a wall portion and an extended portion, and a plastic bearing cup located around an outer side of the wall portion of the heat conducting element and fixed to the metal base. The plastic bearing cup internally defines a bearing receiving hole. The extended portion is horizontally extended from an upper end of the wall portion toward a center of the plastic bearing cup. A bearing is received in the bearing receiving hole and seated on the extended portion, so that heat produced by the bearing when it rotates along with a rotary shaft of a motor is transferred from the extended portion of the heat conducting element to the metal base for dissipation. A fan using such motor bearing heat dissipation structure is also disclosed. | 06-26-2014 |
20140175954 | BASE STRUCTURE FOR COOLING FAN - A base structure for cooling fan includes a seat, a circuit board and a motor assembly. The seat has an inner side served as a supporting surface. The circuit board has a first side attached to a top of the supporting surface and an opposite second side having a plurality of electronic elements provided thereon. The motor assembly includes a plurality of stacked silicon steel plates located on the circuit board and above the electronic elements. With the first side of the circuit board being attached to the supporting surface of the seat and the electronic elements on the second side of the circuit board being located in spaces between the motor assembly and the circuit board, more silicon steel plates can be stacked in the motor assembly to enable upgraded motor working efficiency and reduced electric current needed by the cooling fan to operate. | 06-26-2014 |
20140175923 | WATERPROOF MOTOR STATOR STRUCTURE - A waterproof motor stator structure includes a circuit board; a stator mounted on one face of the circuit board; a lower shell forming an open-topped annular recess for receiving the circuit board therein and having an central opening communicable with the annular recess; an upper shell fitted around an outer side of the stator; and a protective layer formed in the annular recess of the lower shell to encapsulate the circuit board and an open lower end of the upper shell, so that the lower shell and the upper shell are joined into an integral unit. With these arrangements, the stator located in between the lower and upper shells can be effectively protected against external moisture and salt spray with reduced time, labor and material costs while enabling extended service life a fan using same. | 06-26-2014 |
20140174704 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered. | 06-26-2014 |
20140165402 | VAPOR CHAMBER AND METHOD OF MANUFACTURING SAME - A vapor chamber and a method of manufacturing same are disclosed. The vapor chamber includes a main body internally defining a chamber. The chamber internally has a plurality of flow guides and contains a working fluid; and at least one flow passage is formed between any two adjacent flow guides, such that the flow guides and the flow passages together define a flow guiding zone in the main body. The flow guiding zone has two opposite ends respectively connecting with a first convection zone and a second convection zone, such that the flow passages and the first and second convection zones communicate with one another. With the main body and the internal flow passages for a vapor chamber being integrally formed by aluminum extrusion, the time, labor and material costs for the vapor chamber can be largely reduced. | 06-19-2014 |
20140165401 | THIN HEAT PIPE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber and a working fluid. At least one first channel and at least one second channel are formed on an inner wall face of the chamber. The first and second channels extend to intersect each other. The mesh body is attached to the inner wall face of the chamber. The thin heat pipe structure is able to transfer heat in both axial direction and radial direction. By means of the manufacturing method, the heat pipe can be slimmed and the ratio of good products can be greatly increased. | 06-19-2014 |
20140165400 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base, at least one heat pipe, and a locating structure. The base has a first face, on which at least one channel is provided. A coupling section is formed on the first face at joints between the at least one channel and the first face. The heat pipe is set in the channel, and the locating structure is correspondingly fitted in the coupling section. In a method of manufacturing the heat-dissipation unit, the locating structure is molded between the at least one heat pipe and the base through a mechanical process, so that the at least one heat pipe is firmly held to the base in a highly efficient assembling manner with largely reduced time and labor to thereby enable reduced manufacturing cost. | 06-19-2014 |
20140150263 | MANUFACTURING METHOD OF THIN HEAT PIPE - A manufacturing method of thin heat pipe includes steps of: providing a hollow tubular body and a mesh capillary structure; placing the mesh capillary structure into the tubular body; providing a tool and placing the tool into the mesh capillary structure; sintering the tubular body to make the mesh capillary structure sintered on an inner wall face of the tubular body and then taking out the tool; vacuuming the tubular body and filling a working fluid into the tubular body; sealing the tubular body; and pressing and flattening the tubular body into a flat form by means of mechanical processing. According to the manufacturing method of thin heat pipe, the mesh capillary structure can fully tightly attach to the inner wall face of the tubular body to keep the completeness of the tubular body and the completeness of the vapor-liquid circulation passageways in the heat pipe. | 06-05-2014 |
20140144019 | Heat Dissipation Device and Method of Manufacturing Same - A heat dissipation device includes a heat dissipation element and a ceramic main body. The heat dissipation element includes a heat transfer section and a heat dissipation section located on one side of the heat transfer section; and the ceramic main body is directly connected to another side of the heat transfer section opposite to the heat dissipation section by way of welding or a direct bonding copper process, so as to overcome the problem of crack at an interface between the heat dissipation device and a heat source due to thermal fatigue. A method of manufacturing the above-described heat dissipation device is also disclosed. | 05-29-2014 |
20140138061 | Heat-Dissipation Unit with Heat-Dissipation Microstructure and Method of Manufacturing Same - A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body internally defining a chamber; a wick structure formed on an inner surface of the chamber; and at least a SiO | 05-22-2014 |
20140137410 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered. | 05-22-2014 |
20140127029 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub having multiple blades. The blades extend from a circumference of the hub in a direction away from the hub. Each two adjacent blades define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation. | 05-08-2014 |
20140127024 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub and a blade body set. The hub has an extension section. The blade body set has multiple blade bodies. The blade bodies outward extend from the extension section of the hub. Each two adjacent blade bodies define therebetween a flow way, an air outlet and an air inlet. The air outlet and the air inlet are respectively positioned at two ends of the flow way in communication with the flow way. The air outlets are arranged at unequal intervals so as to greatly reduce noise in operation. | 05-08-2014 |
20140127016 | BAND-TYPE FAN STRUCTURE - A band-type fan structure includes a transmission band body and multiple blades. The transmission band body has a lengthwise direction and a widthwise direction. The blades are side by side disposed on the transmission band body in parallel to each other and arranged in the lengthwise direction of the transmission band body. Each two adjacent blades define therebetween a flow way. The transmission band body is movable in the lengthwise direction, whereby the blades are driven by the transmission band body to transversely move to create an air volume. The band-type fan structure has a greatly minified volume. Also, the band-type fan structure overcomes the shortcoming of unstable operation of the conventional fan caused by deflection of the blades. | 05-08-2014 |
20140123491 | FAN IMPELLER BALANCE CALIBRATING METHOD - A fan impeller balance calibrating method includes steps of: placing a fan impeller onto a balance measurement unit and activating the fan impeller to rotate; using a detector of the balance measurement unit to detect the amount of unbalance and phase of the fan impeller in rotation and generate a detection signal according to the amount of unbalance and phase of the fan impeller; and providing a counterweighing unit, which receives the detection signal to find at least one hole of the fan impeller according to the detection signal, which is to be counterweighed and counterweighs the hole with a counterweight. By means of the fan impeller balance calibrating method, the measurement and counterweighing of the fan impeller are automated. Therefore, the working time is shortened and the manufacturing cost is lowered. | 05-08-2014 |
20140117800 | LASER-WELDED JOINT STRUCTURE BETWEEN INSULATION FRAME AND BEARING CUP OF FAN AND METHOD OF FORMING SAME - A laser-welded joint structure between insulation frame and bearing cup of fan includes a base having a bearing cup and a stator having at least one insulation frame. The insulation frame includes a sleeve portion defining a bore axially extending therethrough. The sleeve portion is provided on an inner wall surface with at least one pressing section that radially projects into the bore to press a lower side against an upper end of the bearing cup and a bearing received therein. A portion of at least one lateral side of each pressing section that is in contact with the upper end of the bearing cup is melted by laser beam to form a laser-welded joint, so that the insulation frame and the bearing cup are integrally connected together at reduced manufacturing cost and have increased structural strength. A method of forming the laser-welded joint structure is also disclosed. | 05-01-2014 |
20140112810 | FAN AND BEARING COOLING STRUCTURE THEREOF - A bearing cooling structure includes a metal base seat and a plastic bearing cup. The metal base seat has a raised section and an extension section. The plastic bearing cup encloses the raised section and has an inner circumference defining a bearing hole. The extension section horizontally extends from the raised section toward a center of the plastic bearing cup. The extension section has a free end and an upper surface positioned in the bearing hole. A bearing is received in the bearing hole and disposed on the extension section. A bottom face of the bearing is in contact with the upper surface of the extension section. Accordingly, the heat of the bearing can be transferred (conducted) through the extension section to the metal base seat to be dissipated. A fan with the bearing cooling structure is also disclosed. | 04-24-2014 |
20140112807 | MOTOR PROTECTION STRUCTURE - A motor protection structure includes a stator assembly, a casing and a filling material. The stator assembly is coated with a coating and fitted on one side of the casing. The casing has a receiving space for receiving a circuit board. The filling material is filled in the receiving space to enclose the circuit board. The filling material is connected to the coating to fully seal the stator assembly and the casing so as to lower manufacturing cost and shorten working time. | 04-24-2014 |
20140090795 | LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink. | 04-03-2014 |
20140082943 | THIN HEAT PIPE STRUCTURE AND METHOD OF MANUFACTURING SAME - A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost. | 03-27-2014 |
20140072434 | FAN IMPELLER STRUCTURE OF CENTRIFUGAL FAN - A fan impeller structure of centrifugal fan includes a hub, a first blade body set and a second blade body set. The hub has an extension section having a first side and a second side. The first blade body set is disposed on the first side, while the second blade body set is disposed on the second side. The first blade body set defines multiple first air inlets and multiple first air outlets. The second blade body set defines multiple second air inlets and multiple second air outlets. The first air outlets of the first blade body set or the second air outlets of the second blade body set are selectively arranged at unequal intervals so as to effectively reduce noise. | 03-13-2014 |
20140070926 | PORTABLE ELECTRONIC DEVICE BASED USER-DEFINABLE REMOTE-CONTROL INTERFACE SYSTEM AND OPERATING METHOD THEREOF - A portable electronic device based user-definable remote-control interface system and operating method thereof is disclosed. The system integrates remote control information of a variety of remotely controllable devices into one single interface allocation information map, which is stored in and can be shown on a portable electronic device. To operate the user-definable remote-control interface, first show the interface allocation information map on the portable electronic device and define at least an object and a button in the map. Then, search a network platform for a built-in remote-control code that corresponds to the button, or receive a learning signal from a remote controller of a device to be remotely controlled with the button to generate a learnt remote-control code corresponding to the button. Finally, store the built-in or the learnt remote-control code in a storage unit of the portable electronic device and relate the remote-control code to its corresponding button. | 03-13-2014 |
20140069614 | HEAT DISSIPAION DEVICE AND THERMAL MODULE USING SAME - A heat dissipation device and a thermal module using same are disclosed. The heat dissipation device includes at least one water block, a heat exchanger, a first metal tube and a second metal tube, and the water block and the heat exchanger are connected to one another by the first and second metal tubes. The thermal module includes, in addition to the heat dissipation device, a pump unit connected to the heat exchanger of the heat dissipation device, and a cooling fluid filled in the heat dissipation device and the pump unit. By connecting the water block to the heat exchanger via the first and second metal tubes, it is able to effectively prevent the problem of cooling fluid leakage. | 03-13-2014 |
20140068941 | RADIATING FIN, THERMAL MODULE FORMED WITH THE SAME, AND METHOD OF MANUFACTURING THE SAME - A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe. | 03-13-2014 |
20140059858 | Heat-Dissipating Device and Method for Manufacturing the Same - The present invention provides a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a heat sink and a heat pipe. The heat sink has an end surface provided with a groove. The heat pipe is received in the groove. The heat pipe has a heat-absorbing surface and a heat-conducting surface. The heat-conducting surface is adhered to the inner edge of the groove. The heat-absorbing surface is in flush with the end surface. With this arrangement, heat resistance of the heat-dissipating device is reduced to improve the heat-dissipating effect thereof. | 03-06-2014 |
20140055954 | HEAT PIPE STRUCTURE, AND THERMAL MODULE AND ELECTRONIC DEVICE USING SAME - An electronic device has a heat source and a thermal module. The thermal module includes a plurality of radiating fins respectively provided with a through hole, and a heat pipe structure having a pipe body. The pipe body has a vaporizing section in contact with the heat source and a condensing section extended through the radiating fins via the through holes thereon. The vaporizing section has a first pipe thickness and is internally provided with a first wick structure to define a first flow channel. The condensing section has a second pipe thickness smaller than the first pipe thickness, and is internally provided along part of its length with at least one second wick structure to define at least one second flow channel communicating with the first flow channel. | 02-27-2014 |
20140034280 | HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased. | 02-06-2014 |
20140034279 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. | 02-06-2014 |
20140034278 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body. | 02-06-2014 |
20140034277 | HEAT SINK STRUCTURE AND METHOD OF MANUFACTURING SAME - A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body. | 02-06-2014 |
20140020248 | Thermal Module and Manufacturing Method Thereof - A thermal module and a manufacturing method thereof. The thermal module includes a retainer member and at least one heat conduction member. The retainer has a first clamping arm and a second clamping arm opposite to the first clamping arm. The heat conduction member is disposed and fixedly clamped between the first and second clamping arms. The retainer member is formed by means of punching and integrally connected with the heat conduction member also by means of punching so that the manufacturing cost of the thermal module is lowered and the heat dissipation efficiency of the thermal module is enhanced. | 01-23-2014 |
20140017075 | FAN STRUCTURE - A fan structure includes an upper cover, a fan frame body, a bearing cup, a bearing, a stator assembly, a hub and a shaft rod. The upper cover is mated with the fan frame body to together define a receiving space in which the bearing cup is disposed. The bearing cup has an open end and a closed end. The bearing is disposed in the bearing cup. The stator assembly is fitted around the bearing cup. The hub has multiple outward extending blades spaced from the upper cover by a first distance. The shaft rod has a connection end connected with the hub and a protruding end passing through the shaft hole and protruding from the bearing to abut against the closed end of the bearing cup and define a second distance. The first distance is smaller than the second distance to avoid deflection of the shaft rod. | 01-16-2014 |
20130343903 | FAN ROTOR PROTECTION STRUCTURE - A fan rotor protection structure includes a fan wheel and an annular member. The fan wheel has a hub and a plurality of blades. The hub has a top portion and a side wall portion, which together define a receiving space in the hub. The annular member has one side aligned with and connected to an end surface of the side wall portion opposite to the top portion, and defines an opening communicable with the receiving space in the hub. With the annular member, foreign matters are stopped from entering into and accumulating in the fan rotor, enabling largely increased fan service life and more stable flow field around the fan. | 12-26-2013 |
20130340987 | HEAT-DISSIPATING BASE - A heat-dissipating base includes a main body. The main body has a basic portion. Four corners of the basic portion are respectively connected to a first extending arm, a second extending arm, a third extending arm and a fourth extending arm. Both sides of the first, second, third, and fourth extending arms are respectively provided with a first bending portion, a second bending portion, a third bending portion and a fourth bending portion. An end of the first, second, third, and fourth extending arms opposite to the basic portion is respectively formed with at least one positioning hole. The first, second, third and fourth bending portions are configured to increase the structural strength of the first, second, third and fourth extending arms respectively. | 12-26-2013 |
20130337169 | Heat-Dissipation Unit Coated with Oxidation-Resistant Nano Thin Film and Method of Depositing the Oxidation-Resistant Nano Thin Film Thereof - A heat-dissipation unit coated with oxidation-resistant nano thin film includes a metal main body having a heat-absorbing portion and a heat-dissipating portion, both of which are coated with at least a nano metal compound thin film. To form the nano metal compound thin film on the heat-dissipation unit, first form at least a nano compound coating on an outer surface of the heat-dissipation unit, and then supply a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating thereof, and finally, a nano metal compound thin film is formed on the surface of the heat-dissipation unit after completion of the heat treatment and the reduction process. With the nano metal compound thin film, the heat-dissipation unit is protected against formation of oxide on its surface and accordingly against occurrence of increased thermal resistance thereof. | 12-19-2013 |
20130333864 | Heat-Dissipation Unit Coated with Oxidation-Resistant Nano Thin Film and Method of Depositing the Oxidation-Resistant Nano Thin Film Thereof - A heat-dissipation unit coated with oxidation-resistant nano thin film includes a metal main body having a heat-absorbing portion and a heat-dissipating portion, both of which are coated with at least a nano metal compound thin film. To form the nano metal compound thin film on the heat-dissipation unit, first form at least a nano compound coating on an outer surface of the heat-dissipation unit, and then supply a reduction gas into a high-temperature environment to perform a heat treatment and a reduction process on the heat-dissipation unit and the nano compound coating thereof, and finally, a nano metal compound thin film is formed on the surface of the heat-dissipation unit after completion of the heat treatment and the reduction process. With the nano metal compound thin film, the heat-dissipation unit is protected against formation of oxide on its surface and accordingly against occurrence of increased thermal resistance thereof. | 12-19-2013 |
20130315723 | RING-TYPE FAN AND IMPELLER STRUCTURE THEREOF - A ring-type fan includes a frame having a receiving space defined between an air inlet and an air outlet thereof and being provided along an inner side of the air outlet with an inward projected wall portion; an impeller assembly rotatably mounted in the receiving space and including spaced impellers outward extended from a hub, and a ring member connected to radially outer ends of the impellers and externally provided with a circle of stop section, which and the projected wall portion together define an air passage between them; and at least one pressure relief section defining an airflow guide on the frame to communicate with the receiving space and the air passage. Any backflow can be guided out of the frame via the air passage and the pressure relief section without interfering with the inflow of air, allowing the ring-type fan to have upgraded heat dissipation performance. | 11-28-2013 |
20130309531 | WATER-COOLING PLATE UNIT FOR BATTERY SET - A water-cooling plate unit for a battery set includes a first plate, a second plate and a channel assembly. The first plate is covered by the second plate. The channel assembly is formed by a stamping process to have a first separating piece and a second separating piece. The first separating piece and the second separating piece are provided between the first plate and the second plate in such a manner that a channel is formed there between. The channel formed by the stamping process can make the whole water-cooling plate unit to have a compact size and a reduced product cost by using fewer materials. Further, the water-cooling plate unit can be assembly with the battery set and exhibit an improved heat-dissipating efficiency to the battery set. | 11-21-2013 |
20130309083 | SERIAL FAN FRAME ASSEMBLY STRUCTURE - A serial fan frame assembly structure includes a first fan frame and a second fan frame. The first fan frame has a first and a second retainer, as well as a first and a second receiving slot; and the second fan frame has a first and a second receiving recess, as well as a first and a second post. The first and second retainer are configured for correspondingly engaging with the first and second recesses, while the first and second posts are configured for correspondingly engaging with the first and second receiving slots, so that the first and the second fan frame can be quickly assembled together in a manner capable of reducing vibration during the operation of a serial fan. | 11-21-2013 |
20130309064 | FAN WITH INTEGRATED VIBRATION ABSORBING STRUCTURE - A fan with integrated vibration absorbing structure includes a fan frame, a hub-blade assembly, and at least one vibration absorber. The fan frame includes a base and at least one side wall formed around the base, and the hub-blade assembly is arranged in the fan frame. The at least one vibration absorber is provided on the at least one side wall to project therefrom for absorbing vibration produced by the fan during the operation thereof. Therefore, with the vibration absorbers integrated into the fan frame, it is no longer necessary to provide any additional vibration-absorbing member while upgraded vibration-absorbing effect can be achieved. Meanwhile, the fan can be more conveniently mounted at reduced mounting cost. | 11-21-2013 |
20130307675 | WIRELESS CONTROL SYSTEM USABLE WITH PORTABLE ELECTRONIC DEVICE - A wireless control system usable with portable electronic device includes at least one controlled device, at least one portable electronic device, and a wireless control device. The portable electronic device is electrically connectable to the wireless control device, and has application software stored therein. The portable electronic device is capable of reading in an operating command to thereby execute the application software that corresponds to the controlled device and generate a remote-control signal. The wireless control device transmits the remote-control signal generated by the portable electronic device to the controlled device for the latter to execute an operation in response to the received remote-control signal. With the above arrangements, the wireless control system is very convenient for use. | 11-21-2013 |
20130306277 | THERMAL MODULE STRUCTURE - A thermal module structure includes a main body and at least one heat pipe. The main body has a base section and an extension section. Multiple radiating fins extend from a circumference of the extension section. The heat pipe is assembled with the main body. The heat pipe has a heat absorption end and a heat dissipation end. The thermal module structure has lower thermal resistance so that the heat dissipation effect of the thermal module structure is greatly enhanced. Moreover, the manufacturing cost of the thermal module structure is lowered and the manufacturing time of the thermal module structure is shortened. | 11-21-2013 |
20130228312 | HEAT DISSIPATION BASE AND METHOD OF MANUFACTURING SAME - A heat dissipation base includes a heat conducting element having a first surface and an opposite second surface; and a main body having a recess, a first side, and an opposite second side. The recess is communicable with the first and the second side, and the heat conducting element is set in the first side of the main body with the second surface being flush with the recess. The heat conducting element and the main body are integrally associated with each other by way of insert molding to achieve the purpose of lowered manufacturing cost and reduced overall weight of the heat dissipation base. A method of manufacturing the heat dissipation base is also disclosed. | 09-05-2013 |
20130228311 | HEAT-DISSIPATING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a heat-dissipating assembly and a method for manufacturing the same. The heat-dissipating assembly includes a base, at least one heat pipe, and a combining unit. The base is provided with an accommodating trough and at least one through-hole. The accommodating trough has at least one receiving hole penetrating the base. One end of the heat pipe is disposed through the through-hole on one side of the base into the receiving hole. The combining unit covers the accommodating trough and one end of the heat pipe. By this arrangement, the efficiency in assembly is increased and the working hours are decreased. Further, the production cost is reduced. | 09-05-2013 |
20130228310 | HEAT-DISSIPATING BASE STRUCTURE AND METHOD FOR MANUFACTURING SAME - The present invention relates to a heat-dissipating base structure and a method for manufacturing the same. The heat-dissipating base structure includes a base and at least one heat pipe. The base is made of polymeric materials. One side of the base is provided with at least one trough. The trough has an open side and a closed side. The heat pipe is fixed in the trough. One side of the heat pipe is in flush with the open side. By the inventive structure, since the base is made of polymeric materials, the weight and cost of the heat-dissipating base structure can be reduced. | 09-05-2013 |
20130202352 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 08-08-2013 |
20130195637 | FAN IMPELLER STRUCTURE AND MANUFACTURING METHOD THEREOF - A fan impeller structure and a manufacturing method thereof. The fan impeller structure includes a hub and multiple securing sections. The hub has a top section, an annular section and multiple recesses. The annular section axially extends from a circumference of the top section. The annular section and the top section together define a receiving space. The recesses are formed at a junction between the top section and the annular section. The securing sections are disposed in the receiving space and formed oppositely between the recesses. By means of the manufacturing method of the fan impeller structure, the manufacturing process is simplified. Moreover, by means of the securing sections, magnetic members can be quickly connected with and secured to inner circumference of the hub to save working time. | 08-01-2013 |
20130195622 | ANTI-VIBRATION SERIAL FAN STRUCTURE - An anti-vibration serial fan structure includes a first frame having a first assembling side and a second frame having a second assembling for connecting to the first assembling side. The first assembling side is provided with at least one mounting post or mounting hole and at least one male or female connector. The second assembling side is correspondingly provided with at least one mounting hole or mounting post and at least one female or male connector. The male connector has a certain degree of elasticity, so that the engaged male and female connectors provide a vibration-absorbing effect to save additional cushioning elements, enabling the serial fan structure to have lowered assembling cost and minimized defects in assembling. | 08-01-2013 |
20130170967 | FAN IMPELLER STRUCTURE - A fan impeller structure includes an annular body. The annular body has a top section and a receiving space. At least one first bending section is formed between the top section and the annular body. At least one recess is formed at the first bending section. At least one flow guide hole is formed between the first bending section and the recess in communication with the receiving space. In operation, the airflow conducted into the receiving space is increased. Moreover, no matter whether the fan impeller structure is clockwise rotated or counterclockwise rotated, the airflow can be conducted into the receiving space through the flow guide hole. Accordingly, the heat dissipation effect will not be affected by the rotational direction of the fan impeller structure. | 07-04-2013 |
20130168056 | HEAT-DISSIPATING DEVICE - A heat-dissipating device includes a base and a heat pipe. One side of the base is provided with an accommodating trough for accommodating the heat pipe. The heat pipe has a first heat-absorbing section, a second heat-absorbing section, a third heat-absorbing section provided between the first heat-absorbing section and the second heat-absorbing section, a first heat transfer section, and a second heat transfer section. The first, second and third heat-absorbing sections conduct the heat to the first and second heat transfer sections, and thus the heat-dissipating effect of the present invention is improved greatly. | 07-04-2013 |
20130168055 | THERMAL MODULE - A thermal module includes a heat sink and a heat pipe. The heat sink has a heat absorption section and a heat dissipation section. The heat dissipation section has multiple radiating fins. The heat absorption section is formed with at least one receiving groove. The heat pipe is received in the receiving groove. The heat pipe has a first end, a second end, a middle section and at least one conduction section. The first and second ends and the middle section are arranged in adjacency to each other to together define a first section. The conduction section winds around the first section. | 07-04-2013 |
20130168054 | HEAT PIPE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a heat pipe and a method for manufacturing the same. The heat pipe includes a main body having a chamber. The chamber has at least one wick region and at least one flowing channel region. The wick region is positioned adjacent to the flowing channel region and both of them axially extend in the chamber. The wick region is provided on an inner wall of the chamber. An area occupied by the wick region is smaller than a half of the circumference of the inner wall of the chamber. A wick structure in the heat pipe can be prevented from suffering damage during its production and the yield of production is increased. | 07-04-2013 |
20130168053 | THIN HEAT PIPE STRUCTURE AND METHOD OF FORMING SAME - A thin heat pipe structure includes a pipe body and at least one wick structure. The pipe body has a vaporizing end internally defining a first chamber, and a condensing end internally defining a second chamber communicating with the first chamber. A space in the first chamber is smaller than that in the second chamber. The wick structure is provided in the first and the second chamber, such that at least one channel is defined in the pipe body by the wick structure and the first and second chambers. With the above arrangements, the pressure resistance in the pipe body at the condensing end is reduced to thereby enable upgraded vapor-liquid circulation efficiency of the working fluid in the pipe body and accordingly upgraded heat dissipation effect of the thin heat pipe structure. A method of forming the thin heat pipe structure is also disclosed. | 07-04-2013 |
20130149155 | ROTOR SHAFT AND COOLING FAN USING SAME - A rotor shaft includes a main body having a central portion and an extension portion. The extension portion has a plurality of extension sections radially outward extended from the central portion by different distances to together define a peripheral surface and a non-circular cross section of the main body. In a cooling fan using the rotor shaft, the main body of the rotor shaft is received in a shaft space internally defined by a bearing of the fan, and a lubricant is filled in a space left between the main body and the shaft space. With the non-circular cross section of the main body of the rotor shaft, the lubricant filled between the rotor shaft and the shaft space can have increased support pressure to thereby reduce the noise and vibration caused by frictional contact of the rotor shaft with the bearing during the operation of the cooling fan. | 06-13-2013 |
20130149140 | BEARING STRUCTURE AND COOLING FAN USING SAME - A bearing structure includes a main body internally defining a shaft space; the shaft space axially extends a full length of the main body and communicates with at least one extension space; and the extension space is radially outward extended from the shaft space and also axially extends a full length of the main body. The shaft space has a non-circular cross section. In a cooling fan using the bearing structure, a rotor shaft is inserted in the shaft space. With the shaft space having a non-circular cross section, it is possible to largely increase the support pressure of a lubricant filled between the rotor shaft and the shaft space and accordingly, reduce the frictional contact between the rotor shaft and the shaft space as well as the noise and vibration produced during the operation of the cooling fan. | 06-13-2013 |
20130129513 | CENTRIFUGAL FAN IMPELLER STRUCTURE - A centrifugal fan impeller structure includes a hub and a second annular body. The hub has an extension section. A first annular body is connected to a free end of the extension section. The first annular body has a first side and a second side. A first blade set is disposed on the first side. The second annular body has a third side and a fourth side. A second blade set is disposed on the third side. The fourth side is mated and connected with the second side. The centrifugal fan impeller structure is able to greatly increase air volume and wind pressure of the fan. Moreover, in operation, the centrifugal fan impeller structure makes less noise. | 05-23-2013 |
20130126133 | HEAT PIPE STRUCTURE - A heat pipe structure includes a tubular body. The tubular body has a chamber, a working fluid and a first capillary structure. The chamber is defined with at least one first section, a second section and a third section. The first, second and third sections are connected with each other. The first capillary structure is disposed in the second section. By means of the above arrangement, the pressure impedance of the chamber of the heat pipe is lowered to greatly increase vapor-liquid circulation efficiency of the working fluid in the chamber. | 05-23-2013 |
20130118012 | Flat Plate Heat Pipe and Method for Manufacturing the Same - The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained. | 05-16-2013 |
20130118011 | Plate-Type Heat Pipe Sealing Structure and Manufacturing Method Thereof - A plate-type heat pipe sealing structure and a manufacturing method thereof are disclosed. The plate-type heat pipe includes a main body and a tube body. A notch is formed at one of two ends of the main body or one of four corners of the main body as a sealed section thereof. The tube body is disposed in the notch and connected with the main body. The main body of the plate-type heat pipe is cut by means of a mechanical processing method such as punching to form the notch. The notch of the main body is sealed by means of high frequency wave or copper welding. The tube body is positioned within the notch without protruding from the main body of the plate-type heat pipe. Accordingly, when assembled with a heat sink unit, the sealed section of the plate-type heat pipe will not interfere with the heat sink unit. | 05-16-2013 |
20130112757 | SMART CARD CAPABLE OF INDEPENDENTLY DISPLAYING INFORMATION - A smart card capable of independently displaying information is wirelessly connectable to an external interface. The smart card includes a main body, an antenna module, an electronic paper, a drive member and a radio frequency identification chip isolated from the drive member. The antenna module includes a first antenna for receiving first electromagnetic wave and a second antenna for receiving/transmitting second electromagnetic wave. The first and second antennas are respectively connected to the drive member and the radio frequency identification chip. The information can be independently displayed on the smart card to ensure confidence of the data. Moreover, the smart card can be more conveniently used. | 05-09-2013 |
20130098592 | HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF - A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components. | 04-25-2013 |
20130092353 | VAPOR CHAMBER STRUCTURE AND METHOD OF MANUFACTURING SAME - A vapor chamber structure includes a main body formed from a first plate and a second plate, which are correspondingly closed to each other to define at least one open area on the main body and a chamber in the main body. The chamber is internally provided with at least one wick structure, a supporting structure, and a working fluid. The open area correspondingly extends through the first plate, the second plate and the chamber. When the main body is positioned on a substrate to contact with a heat source, the at least one open area allows other electronic elements higher than the heat source to extend therethrough without interfering with the direct contact of the main body with the heat source. A method of manufacturing the above-described vapor chamber structure is also disclosed. | 04-18-2013 |
20130084187 | BLADE STRUCTURE FOR CENTRIFUGAL FAN - A blade structure for centrifugal fan includes a hub, a first blade unit, and a second blade unit. The hub has a connection section formed therearound and the connection section has a first side and an opposite second side. The first and the second blade unit are radially outward extended from the first and the second side, respectively, of the connection section. By providing the first and the second blade unit around the hub of a centrifugal fan, the air flows and air pressure produced by the centrifugal fan can be largely increased at effectively reduced noise. | 04-04-2013 |
20130058088 | LED LIGHTING STRUCTURE - An LED lighting structure includes a main body and a filling body. The main body has a first side and a second side. The first side has multiple raised sections. The second side has multiple light incidence sections corresponding to the raised sections respectively. At least one recessed channel section is formed on the second side around the light incidence sections. The filling body is disposed in the channel section. The filling body provides waterproof effect to prevent humidity and alien particles from infiltrating into the channel section. Also, multiple main bodies can be quickly serially connected. | 03-07-2013 |
20130056179 | THERMAL MODULE STRUCTURE - A thermal module structure includes a base and at least one locating member. The base has at least one channel formed thereon and the channel has a closed bottom portion and an open top portion. At least one first coupling section is formed on the base at a position corresponding to the open top portion of the channel. The locating member is provided on one side with at least one second coupling section corresponding to the first coupling section, and is fitted above the channel with the second coupling section engaged with the first coupling section. Therefore, with the locating member, a heat pipe set in the channel can be quickly and firmly held to the base at upgraded efficiency and reduced time and labor cost. | 03-07-2013 |
20130048252 | VAPOR CHAMBER STRUCTURE AND METHOD OF MANUFACTURING SAME - A vapor chamber structure and a method of manufacturing thereof are disclosed. The vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed each other to define a chamber therebetween; the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome. | 02-28-2013 |
20130044490 | HEAT DISSIPATION STRUCTURE FOR LED LIGHTING - A heat dissipation structure for LED lighting includes a light shade, at least one LED module, a wind guide member and a light seat. The light shade has a first opening and a second opening. The light shade further has at least one first extension section between the first and second openings. The LED module is inlaid in the first extension section. The light seat is connected with the light shade to form at least one perforation therebetween. The wind guide member serves to directly suck in airflow through the perforation to dissipate the heat generated by the LED module. The heat of the LED module is carried out of the first opening so as to lower the temperature of the LED module. Accordingly, the heat dissipation structure is free from any radiating fin assembly so that the total weight is reduced and the heat dissipation efficiency is enhanced. | 02-21-2013 |
20130043005 | HEAT DISSIPATION ELEMENT WITH MOUNTING STRUCTURE - A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage. | 02-21-2013 |
20130043000 | HEAT DISSIPATION UNIT WITH MOUNTING STRUCTURE - A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements. | 02-21-2013 |
20130042999 | HEAT DISSIPATION DEVICE WITH MOUNTING STRUCTURE - A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element. | 02-21-2013 |
20130039819 | VAPOR CHAMBER AND METHOD OF MANUFACTURING SAME - A vapor chamber and a method of manufacturing same are disclosed. The vapor chamber includes a main body internally defining a chamber. The chamber internally has a plurality of flow guides and contains a working fluid; and at least one flow passage is formed between any two adjacent flow guides, such that the flow guides and the flow passages together define a flow guiding zone in the main body. The flow guiding zone has two opposite ends respectively connecting with a first convection zone and a second convection zone, such that the flow passages and the first and second convection zones communicate with one another. With the main body and the internal flow passages for a vapor chamber being integrally formed by aluminum extrusion, the time, labor and material costs for the vapor chamber can be largely reduced. | 02-14-2013 |
20130039069 | LIGHT HEAD STRUCTURE WITH ADJUSTABLE FOCAL LENGTH AND LIGHTING DEVICE THEREOF - A light head structure with adjustable focal length and a lighting device thereof. The light head structure includes a base, a threaded collar and a soft lens. The threaded collar has an assembling section, a receiving space for receiving the base therein and a protrusion section formed on an inner circumference of the threaded collar. The base has a recess for receiving a light-emitting element therein and an outer connection section for movably assembling with the assembling section. The soft lens has a focusing section in alignment with the light-emitting element. The focusing section has an extension section. The protrusion section of the threaded collar abuts against the extension section to attach the extension section to the outer circumference of the base. The thickness of the soft lens is adjustable to change the focal length and enhance the illumination. The lighting device can be easily manufactured to lower manufacturing cost. | 02-14-2013 |
20130020055 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module structure includes a base and a heat pipe. The base has a first channel and a first recessed section in communication with the first channel. The heat pipe is correspondingly disposed in the first channel. According to the thermal module structure, the heat pipe can directly contact heat source and directly connect with the base without brazing. Therefore, the manufacturing cost is greatly lowered. | 01-24-2013 |
20130014842 | SYMMETRICAL SERIES FAN STRUCTUREAANM Liu; Wen-HaoAACI New Taipei CityAACO TWAAGP Liu; Wen-Hao New Taipei City TW - A symmetrical series fan structure includes multiple frame bodies made with single mold. Each frame body has a first through hole, a second through hole and a base having multiple connection members. The base is positioned in the second through hole on one side of the frame body and connected to the frame body via the connection members. The frame body has multiple fixing members and multiple fixing holes on the same side of the frame body as the base. The frame bodies are serially connected by means of inserting the fixing members into the fixing holes with the bases and the connection members of the frame bodies attached to each other. Accordingly, the frame bodies can be made with single mold and assembled to form the symmetrical series fan structure. In this case, the mold development cost is saved and the manufacturing cost is lowered. | 01-17-2013 |
20120315134 | FAN IMPELLER STRUCTURE - A fan impeller structure includes a frame body, a cover body and a hub. The frame body has a receiving space. The cover body has a wind inlet in communication with the receiving space. The hub is rotatably disposed in the receiving space and has multiple blades annularly arranged on a circumference of the hub. Each blade has a top end and a bottom end. The top end has a projection extending from the top end toward the cover body. An axial space is defined between the blades and the hub. The projections formed at the top ends of the blades are able to effectively prevent the air flowing within the receiving space from escaping. Accordingly, the wind pressure and wind intensity are enhanced to achieve an excellent heat dissipation effect. | 12-13-2012 |
20120314427 | LED HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a LED heat sink and a method for manufacturing the same. According to the inventive method, ends of heat-dissipating fins are melted and combined with heat-conducting body by point discharge, thereby forming the LED heat sink. The LED heat sink includes the heat-conducting body and the heat-dissipating fins. The heat-conducting body has a heated portion and a heat-conducting portion. The heat-conducting portion is connected to the heat-dissipating fins. By this method, a heat sink of a complicated structure can be manufactured with multiple materials. Further, the working hours and production cost are reduced greatly. | 12-13-2012 |
20120313469 | WATERPROOF AND SALT SPRAY-RESISTANT FAN MOTOR STRUCTURE - A waterproof and salt spray-resistant fan motor structure includes a base, a stator assembly, a case, and at least one circuit board. The base has a bearing cup vertically projected from one side thereof. The stator assembly is externally fitted around the bearing cup, and includes a plurality of silicon steel plates having windings mounted thereon. The case is arranged between the base and the stator assembly and internally defines a closed space, and the circuit board is located in the closed space. With these arrangements, the case protects the circuit board against corrosion by water and salt spray, enabling a fan to have largely extended service life. | 12-13-2012 |
20120305223 | THIN HEAT PIPE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thin heat pipe structure and a manufacturing method thereof. The thin heat pipe structure includes a tubular body and a support body. The tubular body has at least one receiving space in which a working fluid is contained. The support body is disposed in the receiving space to partition the receiving space into a first chamber and a second chamber. By means of the manufacturing method of the thin heat pipe structure, the thin heat pipe structure can be made with greatly enhanced heat transfer efficiency. In addition, in the manufacturing process, the ratio of good products is increased to lower the manufacturing cost. | 12-06-2012 |
20120305222 | HEAT SPREADER STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat spreader structure and a manufacturing method thereof. The heat spreader structure includes a main body. The main body includes a first board body and a second board body corresponding to the first board body. The second board body is mated with the first board body to form the main body. The main body has a circulation area and a connection area. The circulation area is connected with the connection area to together define a chamber in which a working fluid is contained. The circulation area has a first capillary structure, while the connection area has a second capillary structure. In manufacturing, the heat spreader structure can be freely bent and shaped without damaging the internal capillary structures. | 12-06-2012 |
20120300467 | OPTICAL LENS AND LIGHTING DEVICE - A lighting device includes a light source and an optical lens. The optical lens includes a light-source-side optical surface disposed proximate to the light source, and a lighting-side optical surface opposite to the light-source-side optical surface. At least one of the light-source-side optical surface and the lighting-side optical surface satisfies a bi-axial sag function. | 11-29-2012 |
20120287642 | HEAT DISSIPATION MECHANISM FOR LED LAMP - A heat dissipation mechanism for LED lamp includes an LED module, a lamp holder, a thermal module, a heat transfer member, and a lamp shade. The thermal module includes a heat sink and a fan; the fan is connected at one side to the heat sink and at another side to the lamp holder. The heat transfer member is arranged between the LED module and the heat sink. The lamp shade has an open end connected to an outer periphery of the lamp holder; and the LED module, the thermal module, and the heat transfer member are received in a space defined in the lamp shade. The heat transfer member absorbs heat generated by the LED module and uniformly spreads the absorbed heat to the heat sink for dissipating into ambient air, so that an excellent heat dissipation effect can be achieved. | 11-15-2012 |
20120267083 | INCLINED WAVED BOARD AND HEAT EXCHANGER THEREOF - An inclined waved board and a heat exchanger thereof. The inclined waved board includes a board body composed of continuous waved sections. The waved sections are respectively inclined from a first side to a second side, and a third side and from a fourth side to the second side of the board body. The waved sections define multiple raised sections and recessed sections on two faces of the board body. The heat exchanger is composed of multiple board bodies arranged adjacent to and in parallel to each other. Each two adjacent board bodies define therebetween a flow way. The inclined waved sections enhance turbulence intensity and guide the fluids to produce secondary flows along the cross-sections of the flow ways to form dynamic three-dimensional swirling flow structures which combine to augment heat transfer rates with reduced pressure-drop. | 10-25-2012 |
20120261105 | LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink. | 10-18-2012 |
20120261096 | RADIATING FIN STRUCTUREAND THERMAL MODULE USING SAME - A radiating fin structure includes a main body being angularly upward extended from a first surface to form at least a first and a second ascending airflow-guiding section, so that a first and a second exterior angle are respectively contained between a line extended from an opposite second surface of the main body and the first and the second ascending airflow-guiding section. A thermal module using the radiating fin structure is also disclosed. The thermal module includes at least one heat pipe, a plurality of the above-described radiating fins sequentially extended through by an end of the heat pipe, and a base receiving another end of the heat pipe therein. An ascending airflow passage is defined between any two vertically adjacent first ascending airflow-guiding sections and any two vertically adjacent second ascending airflow-guiding sections to enhance natural convection and accordingly largely upgrades the natural cooling efficiency of the thermal module. | 10-18-2012 |
20120261095 | THERMAL MODULE STRUCTURE AND MANUFACTURING METHOD THEREOF - A thermal module structure and a manufacturing method thereof. The thermal module includes a plastic layer and at least one heat pipe. The plastic layer has at least one channel and multiple locking sections. The heat pipe is disposed in the channel. The locking sections are locked on a heat source to assemble the thermal module with the heat source. The heat pipe serves to conduct the heat generated by the heat source. Due to the plastic layer, the thermal module as a whole has a much lighter weight and is manufactured at lower material cost. | 10-18-2012 |
20120248907 | CENTRIFUGAL HEAT DISSIPATION DEVICE AND MOTOR USING SAME - A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance. | 10-04-2012 |
20120227948 | HEAT SINK FIN STRUCTURE - A heat sink fin structure includes a fin assembly and a protection unit. The fin assembly includes multiple radiating fins and an outside radiating fin. The outside radiating fin has a first main body. The protection unit has a second main body. | 09-13-2012 |
20120227942 | FLOW GUIDE STRUCTURE AND THERMAL MODULE THEREOF - A flow guide structure includes a support body including a hollow frame body. At least one first flow way and at least one flow guide assembly are disposed in the hollow frame body. The flow guide assembly has multiple flow guide plates arranged at intervals. At least one second flow way is formed between the flow guide plates. When a cooling fan creates airflow and blows the airflow to a heat sink and a circuit board, the flow guide plates of the flow guide assembly can also guide the airflow to those areas with high heat so as to lower the temperature of the electronic components in the areas. | 09-13-2012 |
20120227937 | HEAT DISSIPATION STRUCTURE FOR PHOTOVOLTAIC INVERTER - A heat dissipation structure for photovoltaic inverter includes a photovoltaic inverter, a thermal module and at least one heat pipe. The thermal module has a heat dissipation backboard formed with at least one groove. The heat pipe is inlaid in the groove. The heat pipe has a plane face and an arcuate face. The plane face of the heat pipe is flush with the heat dissipation backboard and attached to the photovoltaic inverter. The arcuate face of the heat pipe is snugly attached to a wall of the groove. The processing cost and material cost of the heat dissipation structure are lowered and the heat dissipation efficiency of the heat dissipation structure is enhanced. | 09-13-2012 |
20120216996 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module and a method of manufacturing same are disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module. | 08-30-2012 |
20120216995 | Motor water-cooling structure and manufacturing method thereof - A method for assembling a heat-dissipating module includes a step of mechanically pressing one time or multiple times a heat pipe into a trough of a metallic base, whereby at least one end of the heat pipe can be pressed into the trough of the metallic base and thus firmly combined with the metallic base. In this way, the time and the cost for assembly are reduced, and the yield is increased. | 08-30-2012 |
20120213578 | Mounting Rack Structure and Mounting Hole Adapter Thereof - A mounting rack structure includes a rack body having a plurality of downward extended supporting legs, each of which is provided near a distal end with an mounting hole; a plurality of mounting hole adapters; and a plurality of fastening elements. The mounting hole adapter includes at least one vertical extension portion with a first retaining flange and a central passage having at least one second retaining flange formed therearound; and is assembled to the mounting hole with the first retaining flange firmly pressed against one side of the supporting leg. The fastening element can be extended through the central passage of the mounting hole adapter to firmly lock the supporting leg and accordingly the rack body to a heat-generating unit. With the mounting hole adapter, the mounting rack structure can be used with different types of fastening elements to save the cost for making different molds. | 08-23-2012 |
20120211202 | LOW-PROFILE HEAT TRANSFER DEVICE - A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency. | 08-23-2012 |
20120193081 | HEAT-DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat-dissipation structure and a manufacturing method thereof are disclosed. The heat-dissipation structure includes a base having a main body and a tube. The tube has an inlet, an outlet, and a tube body; and the tube body is correspondingly embedded in the main body to serve as a flow passage while the inlet and the outlet are exposed from the main body. The heat-dissipation structure can be manufactured by pour molding or insert molding to embed the tube in the base for serving as a flow passage. With the manufacturing method, the heat-dissipation structure can be formed at reduced material, labor and time costs without the risk of water leakage. | 08-02-2012 |
20120186797 | MOTOR WATER-COOLING STRUCTURE AND MANUFACTURING METHOD THEREOF - A motor water-cooling structure and a manufacturing method thereof are disclosed. The motor water-cooling structure includes a motor case having a wall portion and a tube. The tube is embedded in the wall portion to serve as a flow passage. To manufacture the motor water-cooling structure, the tube is positioned in a mold cavity of a mold, and the motor case is formed in the mold by pour molding to embed the tube therein, so that the motor case and the tube form an integral body. With the manufacturing method, the motor water-cooling structure can be formed with reduced material, labor and time to save the manufacturing costs, and the risk of water leakage can be avoided. | 07-26-2012 |
20120186784 | MICRO VAPOR CHAMBER - A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly. | 07-26-2012 |
20120180995 | THIN HEAT PIPE STRUCTURE AND METHOD OF MANUFACTURING SAME - A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost. | 07-19-2012 |
20120180994 | HEAT PIPE STRUCTURE - A heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of first extended sections and a plurality of second extended sections. The first and the second extended sections are connected to and intersected with one another to thereby define a plurality of intersections and open spaces on the thin-sheet member. The bosses are provided on at least some of the intersections of the first and the second extended sections to enable increased supporting strength of the heat pipe structure as well as enhanced vapor-liquid circulation efficiency of the working fluid in the heat pipe structure. | 07-19-2012 |
20120171024 | BEARING HOLDING STRUCTURE AND FAN MODULE USING SAME - A fan module includes a frame; a fan wheel; and a bearing holding structure having a hollow bearing cup, an elastic member, and a bearing. The frame has a base, on a center of which the hollow bearing cup is formed. A portion of an inner wall surface of the hollow bearing cup is radially inward protruded, forming a shoulder portion between the inner wall surface and the protruded portion. The elastic member includes a first and a second section tightly bearing on the shoulder portion and the inner wall surface, respectively, and the bearing is tightly supported on the elastic member. The fan wheel has a shaft extended through the bearing and is therefore rotatably mounted on the base and located in the frame. With the elastic member, the bearing is tightly received in the hollow bearing cup without colliding therewith, and stable operation of the bearing is ensured. | 07-05-2012 |
20120170882 | FAN BEARING RETAINING STRUCTURE - A fan bearing retaining structure includes a fan base, a bearing and at least one resilient member. The fan base has a bearing bushing perpendicularly extending from one face of the fan base. The bearing bushing is formed with a bushing bore in which the bearing is disposed. An annular groove is formed on an inner circumference of the bearing bushing. The resilient member is fitted around the outer circumference of the bearing and correspondingly received in the annular groove. The resilient member serves to eliminate the gap between the bearing and the bearing bushing so as to avoid vibration of the bearing. In this case, the fan can operate more stably and the lifetime of the fan can be prolonged. Moreover, the noise can be minified. | 07-05-2012 |
20120161553 | WATER-COOLING STRUCTURE FOR ELECTRIC MOTOR - A water-cooling structure for electric motor includes a motor main body, a heat-dissipation base, and a vortex-forming section. The motor main body is externally fitted around the heat-dissipation base. The heat-dissipation base is provided around an outer circumferential surface with at least one main flow passage. The vortex-forming section is provided in the main flow passage to create vortex effect on a type of cooling liquid flowing in the main flow passage, so as to enable an increased heat transfer efficiency of the water-cooling structure. | 06-28-2012 |
20120160454 | HEAT EXCHANGER - A heat exchanger includes an enclosure internally providing at least a first space and at least a second space; a first forced convection element and a cooling unit arranged in the first space; a second forced convection element and a vaporization unit arranged in the second space; and a heat transfer unit serially connecting the cooling unit and the vaporization unit to form a loop. The first and the second forced convection element work to enable forced convection of airflow, and the vaporization unit and the cooling unit together with the heat transfer unit form a convection unit. As a result, the heat exchanger has largely upgraded heat exchange efficiency. | 06-28-2012 |
20120156042 | FAN BLADE SYSTEM - A fan blade system includes a hub and a plurality of fan blades. The hub has a sidepiece and a plurality of protrusions alternately disposed along the sidepiece. Each of the fan blades corresponds to one of the protrusions and extends radially outwards from the sidepiece. Each protrusion is embedded in a corresponding fan blade and couples the fan blade to the hub. Both the hub and the plurality of protrusions are made of metallic material, while the plurality of fan blades is made of plastic material. The fan blade system provides consistent and mass-produceable fan blades with enhanced mechanical strength. | 06-21-2012 |
20120134792 | WATERPROOF AND DUSTPROOF FAN MOTOR STRUCTURE AND FAN USING THE SAME - A waterproof and dustproof fan motor structure includes a base, an annular enclosure, and a stator assembly. The base has a vertically forward extended bearing cup; the annular enclosure internally defines a closed annular space and is externally fitted around the bearing cup; and the stator assembly is disposed in the closed annular space of the enclosure. The waterproof and dustproof fan motor structure can be assembled to a frame and a rotor assembly to complete a fan. With the stator assembly disposed in the closed annular space of the enclosure, the fan motor is protected against damage caused by moisture and dust, and the stator assembly can be easily removed from the closed annular space for necessary maintenance and repair to thereby reduce the bad yield and the manufacturing cost of fan and fan motor. | 05-31-2012 |
20120131798 | HEAT PIPE AND METHOD FOR FORMING THE SAME - A heat pipe and a method for forming the same are provided. The method includes: defining a closed end, a closed portion, and a contact section in sequence along a heat pipe to be processed; closing the opening of the closed end and the passage of the closed portion so as to finalize the heat pipe; and cutting axially the contact section into a plurality of equal parts, bending the equal parts outward to assume a divergent shape, thereby providing the contact section with an area for contact with a heat-generating source. Heat is directly transferred from the heat-generating source to the heat pipe via the contact section, thereby enhancing heat dissipation. | 05-31-2012 |
20120125591 | HEAT RADIATING FIN - A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked. | 05-24-2012 |
20120117804 | BOARD-SHAPED HEAT DISSIPATING METHOD OF MANUFACTURING - A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved. | 05-17-2012 |
20120081007 | TEMPERATURE CONTROLLING SYSTEM FOR LED MODULE - A temperature controlling system for a LED module includes at least one LED unit, at least one fan, at least one temperature sensor and a controlling device. The controlling device generates a driving signal for controlling the rotating speed of the fan based on a temperature detection signal transmitted from the temperature sensor, so that the fan can generate a compulsive airflow for dissipating the heat generated by the LED unit. According to the present invention, the working temperatures of the respective LED units can be kept the same, and a uniform heat-dissipating effect can be achieved. | 04-05-2012 |
20120061063 | HEAT EXCHANGER - A heat exchanger includes a body. Both sides of the body are provided with a first flowing path set and a second flowing path set. The first flowing path set and the second flowing path set are provided with a plurality of flow-disturbing portions on both sides of the body respectively. The body is provided with an inlet and an outlet in communication with the first flowing path set and the second flowing path set. A working fluid circulates in the first flowing path set and the second flowing path set. The flow-disturbing portions make the working fluid to generate separated eddies to increase the strength of turbulent flow and to improve the heat-conducting efficiency of the heat exchanger greatly. | 03-15-2012 |
20120039730 | CENTRAL TUBULAR STRUCTURE OF A SHAFT SEAT AND FAN DEVICE THEREOF - A central tubular structure of a shaft seat and a fan device thereof. The central tubular structure includes a base, a bushing connected with the base and a sealing member. The bushing has an outer tubular wall, an inner tubular wall and a top section interconnected between the outer and inner tubular walls to define a receiving space. The inner tubular wall defines a bearing hole. The bushing further has a reception space in adjacency to the base in communication with the receiving space and the bearing hole. The sealing member is fitted in the reception space to seal the same. The fan device is composed of the central tubular structure, a stator assembly, at least one bearing and a fan propeller. The stator assembly is arranged in the receiving space and has a substrate board. The substrate board is free from any perforation and received in the reception space. | 02-16-2012 |
20120031589 | RADIATING FIN, THERMAL MODULE FORMED WITH THE SAME, AND METHOD OF MANUFACTURING THE SAME - A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe. | 02-09-2012 |
20120024514 | PLATE COOLING FIN WITH SLOTTED PROJECTIONS - A plate cooling fin with slotted projections comprises a plate member and projection parts on the plate member with slots disposed at the periphery of the respective projection and spacing apart from each other for the cold airflow being guided to pass through the slots and turned into a turbulent flow with eddy currents at the periphery of the cooling fin to extend the stagnation time of the airflow. As a result, more heat can be carried outward the cooling fin to enhance the heat dissipation efficiency. | 02-02-2012 |
20120024499 | LOOP TYPE PRESSURE-GRADIENT-DRIEN LOW-PRESSURE THERMOSIPHON DEVICE - A loop type pressure-gradient-driven low-pressure thermosiphon device includes a case sealed by a cover to define a chamber with a vaporizing section. The vaporizing section includes a plurality of spaced flow-guiding members and first flow passages formed between adjacent flow-guiding members. The flow passages respectively have at least one free end communicating with a free zone in the chamber. A pipeline is connected at two ends to two opposite sides of the case, and has a second flow passage communicable with the vaporizing section. The pipeline extends through at least one heat-dissipating element, so that the pipeline and the heat-dissipating element together define a condensing section. In the thermosiphon device, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can be driven to circulate and transfer heat in the pipeline and the case without any wick structure. | 02-02-2012 |
20120018137 | HEAT-DISSIPATING ASSEMBLY - A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure. | 01-26-2012 |
20120018131 | PRESSURE DIFFERENCE DRIVEN HEAT SPREADER - A pressure difference driven heat spreader includes a chamber defined in a main body; a vaporizing section arranged in the chamber and including a plurality of first flow-guiding members spaced from one another to define first flow passages therebetween, the first flow passages each having at least one free end communicating with a free zone; a condensing section arranged in the chamber opposite to the vaporizing section and including a plurality of second flow-guiding members spaced from one another to define second flow passages therebetween; and an interconnecting section arranged between the vaporizing and condensing sections and having first and second communicating holes for communicating the vaporizing section with the condensing section. The condensing section functions as a low-pressure end, so that a pressure gradient is produced in the pressure difference driven heat spreader to drive steam-water circulation therein, and no wick structure is needed for driving the working fluid. | 01-26-2012 |
20120018130 | THERMAL SIPHON STRUCTURE - A thermal siphon structure includes a main body, a chamber disposed therein, an evaporation section, a condensation section and a connection section positioned between the evaporation section and condensation section. The evaporation section and condensation section are respectively arranged in the chamber on two sides thereof. The connection section has a set of first communication holes and a set of second communication holes in communication with the evaporation section and condensation section. The evaporation section and condensation section respectively have multiple first and second flow guide bodies, which are arranged at intervals to define therebetween first and second flow ways. Each of the first and second flow ways has a narrower end and a wider end. The first flow ways communicate with a free area. The condensation section is designed with a low-pressure end to create a pressure gradient for driving a working fluid to circulate without any capillary structure. | 01-26-2012 |
20120018128 | SLIM TYPE PRESSURE-GRADIENT-DRIVEN LOW-PRESSURE THERMOSIPHON PLATE - A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure. | 01-26-2012 |
20110315358 | FINNED AIR-GUIDING HEAT-DISSIPATING STRUCTURE AND HEAT-DISSIPATING MODULE HAVING THE SAME - A finned air-guiding heat-dissipating structure includes a heat sink having heat-dissipating fins arranged at intervals. At least one heat-dissipating channel is formed between the heat-dissipating fins. The heat-dissipating fins form an intake side and a first exhaust side and a second exhaust side in communication with the intake side through the heat-dissipating channels. The first exhaust side and the second exhaust side are located on both ends of the intake side and on both sides of the heat sink. A first exhaust trough and a second exhaust trough are provided on the other two sides of the heat sink and in communication with the intake side through the heat-dissipating channels. The heat sink is connected to a fan to form a heat-dissipating module. With this arrangement, the heat sink can guide airflow toward plural sides, so that the heat can be dissipated outside rapidly to achieve an excellent heat-dissipating effect. | 12-29-2011 |
20110315352 | THERMAL MODULE - A thermal module includes at least one heat pipe and a heat sink. The heat pipe has a heat absorption end and a heat-spreading end extending in a direction away from the heat absorption end. The heat sink has a heat-spreading face on which multiple radiating fins are disposed and a heat conduction face opposite to the heat-spreading face. The heat conduction face is formed with a reception channel. The heat-spreading end of the heat pipe is press-fitted in the reception channel to integrally connect the heat pipe and the heat sink with each other. The heat-spreading end is flush with the heat conduction face. The heat pipe and the heat sink are connected by means of press fit connection. Therefore, the thermal module can be easily assembled to save working time and lower manufacturing cost. Moreover, the thermal module is able to provide excellent heat dissipation effect. | 12-29-2011 |
20110314674 | METHOD FOR MANUFACTURING FLAT PLATE HEAT PIPE - The present invention relates to a method for manufacturing a flat plate heat pipe, which includes steps of: forming a wick structure layer and at least one wick structure post on the inner surface of a chamber of a pipe, pressing the pipe to become a flattened pipe with the wick structure post being connected therein, connecting a conduit to the chamber, sealing both sides of the flattened pipe, evacuating air inside the chamber through the conduit, filling a working fluid into the chamber, and sealing the conduit. According to this method, a flat plate heat pipe can be made in a simplified manner with increased yield and reduced cost. | 12-29-2011 |