20100043671 | Bonding material treatment using sonification - A method and system for treating a material to enhance its properties is disclosed, particularly in the context of filler material for adhesives. The method and system includes ultrasonic treatment of the material in a solution and vacuum processing the material thereafter. The resulting material has been shown to exhibit at least one of increased thermal conductivity (˜50% gain) and reduced viscosity (˜50% reduction) as compared to non-treated material. | 02-25-2010 |