Top Inventors for class "Metal fusion bonding" |
Rank | Inventor's name | Country | City/State | Last publication | # of patent apps in this class |
1 | Scott M. Packer | US | Alpine, UT | Jul 13, 2017 / 20170197274 - MECHANICAL FLOW JOINING OF HIGH MELTING TEMPERATURE MATERIALS | 19 |
2 | Russell J. Steel | US | Salem, UT | Dec 30, 2021 / 20210402509 - INSTRUMENTED TOOL HANDLER FOR FRICTION STIR WELDING | 18 |
3 | Peter A. Gruber | US | Mohegan Lake, NY | Nov 05, 2015 / 20150318251 - METAL CORED SOLDER DECAL STRUCTURE AND PROCESS | 17 |
4 | Jae-Woong Nah | US | Closter, NJ | Nov 11, 2021 / 20210351043 - Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Integrated Supercomputer | 13 |
5 | Jae-Woong Nah | US | New York, NY | Jul 13, 2017 / 20170199227 - TEST PROBE SUBSTRATE | 10 |
6 | Srikanth Chandrudu Kottilingam | US | Simpsonville, SC | Apr 19, 2018 / 20180104742 - METHOD AND SYSTEM FOR THERMOGRAPHIC INSPECTION OF ADDITIVE MANUFACTURED PARTS | 9 |
7 | Paul A. Lauro | US | Brewster, NY | Jun 09, 2016 / 20160163553 - METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS | 8 |
8 | Katsuhiko Tanno | JP | Ibi-Gun | Apr 05, 2012 / 20120080505 - Solder Ball Loading Mask, Apparatus and Associated Methodology | 8 |
9 | Israel Stol | US | Pittsburgh, PA | Mar 12, 2015 / 20150072170 - FUSION WELDABLE FILLER ALLOYS | 8 |
10 | Hideaki Sakaguchi | JP | Nagano-Shi | Dec 25, 2014 / 20140376189 - INTERPOSER, METHOD FOR MANUFACTURING INTERPOSER, AND SEMICONDUCTOR DEVICE | 8 |
11 | Da-Yuan Shih | US | Poughkeepsie, NY | Jul 10, 2014 / 20140191775 - REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELECTRICAL CONDUCTORS PROJECTING FROM A SUPPORT STRUCTURE | 7 |
12 | Kiyoaki Iida | JP | Nagano-Shi | Oct 23, 2014 / 20140313681 - CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME | 7 |
13 | Laurent Cretegny | US | Niskayuna, NY | Apr 03, 2014 / 20140093658 - METHODS AND SYSTEMS FOR JOINING MATERIALS | 7 |
14 | Yoshiharu Utsumi | JP | Itami-Shi | Jun 01, 2017 / 20170151625 - ROTARY TOOL AND JOINING METHOD | 7 |
15 | Jeremy Peterson | US | Cedar Hills, UT | Apr 09, 2015 / 20150097020 - MATERIAL SURFACE MODIFICATION USING FRICTION STIR WELDING HYBRID PROCESS | 7 |
16 | Kohei Seyama | JP | Tokyo | Aug 11, 2022 / 20220254751 - SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD | 7 |
17 | Jian Zhang | US | Brookline, MA | Jan 06, 2022 / 20220005720 - Fluxless gang die bonding arrangement | 7 |
18 | Jonathan A. Babb | US | West Jordan, UT | Apr 09, 2015 / 20150097020 - MATERIAL SURFACE MODIFICATION USING FRICTION STIR WELDING HYBRID PROCESS | 7 |
19 | Brian Lee Tollison | US | Honea Path, SC | Sep 14, 2017 / 20170259462 - ARTICLE AND METHOD OF FORMING AN ARTICLE | 7 |
20 | Mitsuo Fujimoto | JP | Kobe-Shi | Aug 20, 2015 / 20150231734 - FRICTION STIR SPOT WELDING DEVICE AND FRICTION STIR SPOT WELDING METHOD | 7 |
21 | Hideki Moriguchi | JP | Itami-Shi | Jul 30, 2015 / 20150209896 - COATED ROTARY TOOL AND METHOD FOR MANUFACTURING THE SAME | 7 |
22 | Orlando L. Valentin | US | Rancho Santa Margarita, CA | Jan 15, 2015 / 20150017878 - SYSTEMS AND METHODS FOR PROCESSING SOLAR SUBSTRATES | 6 |
23 | Michael P. Schmidt-Lange | US | North Wales, PA | Jan 07, 2016 / 20160005709 - METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES | 6 |
24 | Chen-Hua Yu | TW | Hsin-Chu | Sep 14, 2017 / 20170263518 - Integrated Fan-Out Package Including Voltage Regulators and Methods Forming Same | 6 |
25 | Wolfgang Schmitt | DE | Rodgau | May 18, 2017 / 20170141074 - METAL PREPARATION FOR CONNECTING COMPONENTS | 6 |
26 | Simon E. Bray | GB | Derby | Jan 10, 2013 / 20130011681 - METHOD OF LINEAR FRICTION WELDING | 6 |
27 | Christoph B. Luechinger | US | Irvine, CA | Sep 17, 2020 / 20200290148 - ULTRASONIC WELDING SYSTEMS AND METHODS OF USING THE SAME | 6 |
28 | Chung-Shi Liu | TW | Hsin-Chu | Jun 01, 2017 / 20170154862 - Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof | 6 |
29 | John W. Cobes | US | Lower Burrell, PA | Jun 15, 2017 / 20170170439 - ENERGY STORAGE DEVICE AND RELATED METHODS | 6 |
30 | Hiroka Miyazaki | JP | Itami-Shi | Mar 27, 2014 / 20140084044 - COATED ROTARY TOOL | 6 |
31 | Yoshinori Kato | JP | Tokyo | Sep 14, 2017 / 20170259371 - FRICTION STIR WELDING TOOL, FRICTION STIR WELDING DEVICE, AND FRICTION STIR WELDING METHOD | 6 |
32 | Kim S. Ho | US | Richboro, PA | Apr 04, 2013 / 20130082095 - Flux Composition And Method Of Soldering | 5 |
33 | Marco Pacchione | DE | Hamburg | Oct 15, 2015 / 20150291273 - METHOD OF JOINING PANELS FOR AN AIRFRAME | 5 |
34 | Issaku Sato | JP | Tokyo | Oct 11, 2012 / 20120255987 - WAVE SOLDERING TANK | 5 |
35 | Dieter Stroh | DE | Wettenberg | Apr 28, 2016 / 20160116355 - METHOD FOR DETERMINING THE COMPRESSION LEVEL OF A NODE AFTER ULTRASONIC WELDING | 5 |
36 | Tadatomo Suga | JP | Tokyo | Feb 16, 2017 / 20170047225 - SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD | 5 |
37 | Chien Ling Hwang | TW | Hsin-Chu | May 26, 2016 / 20160148820 - PACKAGE-ON-PACKAGE STRUCTURES AND METHODS OF MANUFACTURE THEREOF | 5 |
38 | Mark R. Winkle | US | Lansdale, PA | Aug 21, 2014 / 20140235772 - ALKOXYLATED FLUOROALKYLPHOSPHATE COMPOSITION | 5 |
39 | Tetsuro Nishimura | JP | Osaka | Sep 22, 2022 / 20220297243 - SOLDER PASTE AND SOLDER BONDED BODY | 5 |
40 | David Fleming | US | Northborough, MA | Sep 17, 2020 / 20200296837 - PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME | 5 |
41 | Michael K. Gallagher | US | Hopkinton, MA | Jul 21, 2022 / 20220228282 - METHOD OF ENHANCING COPPER ELECTROPLATING | 5 |
42 | Takayoshi Matsumura | JP | Kawasaki | Sep 26, 2013 / 20130249087 - ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF | 5 |
43 | Mitsuru Sayama | JP | Wako-Shi | Dec 30, 2021 / 20210402508 - FRICTION STIR WELDING APPARATUS AND FRICTION STIR WELDING METHOD | 5 |
44 | Adrianus Jacobus Wittebrood | NL | Velserbroek | Sep 24, 2015 / 20150267969 - FIN STOCK MATERIAL | 5 |
45 | Toru Maeda | JP | Tokyo | Oct 15, 2015 / 20150293714 - STORAGE SYSTEM AND DATA BACKUP METHOD | 5 |
46 | Richard Erich Schuster | US | Milpitas, CA | Sep 14, 2017 / 20170259364 - Method For Manufacture Of A Multi-Layer Plate Device | 5 |
47 | Frank Balma | US | Los Gatos, CA | Sep 14, 2017 / 20170263486 - Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same | 5 |
48 | Bor-Ping Jang | TW | Chu-Bei | Apr 16, 2020 / 20200118969 - Methods for Controlling Warpage in Packaging | 5 |
49 | Avin V. Dhoble | US | Waltham, MA | Dec 24, 2015 / 20150371916 - PRE-APPLIED UNDERFILL | 5 |
50 | Kang-Wook Lee | US | Yorktown Heights, NY | Jun 22, 2017 / 20170173745 - NO CLEAN FLUX COMPOSITION AND METHODS FOR USE THEREOF | 5 |
51 | Xiang-Qian Liu | US | Collegeville, PA | Apr 04, 2013 / 20130082095 - Flux Composition And Method Of Soldering | 5 |
52 | Alexander Veytser | US | Mountain View, CA | Sep 14, 2017 / 20170259364 - Method For Manufacture Of A Multi-Layer Plate Device | 5 |
53 | Trent A. Chontas | US | Braddock Hills, PA | Dec 27, 2012 / 20120325895 - ADVANCED MULTI-SHOULDERED FIXED BOBBIN TOOLS FOR SIMULTANEOUS FRICTION STIR WELDING OF MULTIPLE PARALLEL WALLS BETWEEN PARTS | 5 |
54 | Belgacem Haba | US | Saratoga, CA | Sep 15, 2022 / 20220293567 - DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS | 5 |
55 | Benjamin Paul Lacy | US | Greer, SC | Sep 14, 2017 / 20170260873 - SYSTEM AND METHOD FOR COOLING TRAILING EDGE AND/OR LEADING EDGE OF HOT GAS FLOW PATH COMPONENT | 5 |
56 | Hiroshi Ebihara | JP | Osaka | Jan 31, 2013 / 20130026211 - BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING BONDING TOOL | 5 |
57 | Wayne W. Cai | US | Troy, MI | Dec 31, 2015 / 20150375334 - ELIMINATION OF TOOL ADHESION IN AN ULTRASONIC WELDING PROCESS | 5 |
58 | Russell A. Budd | US | North Salem, NY | Sep 15, 2022 / 20220293845 - TRIMMABLE INDUCTORS FOR QUBIT FREQUENCY TUNING | 5 |
59 | Brent Donald Alfred Elliot | US | Cupertino, CA | Sep 14, 2017 / 20170263486 - Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same | 5 |
60 | Alfred Grant Elliot | US | Palo Alto, CA | Sep 14, 2017 / 20170259364 - Method For Manufacture Of A Multi-Layer Plate Device | 5 |
61 | Dennis George Rex | US | Williams, OR | Sep 14, 2017 / 20170259364 - Method For Manufacture Of A Multi-Layer Plate Device | 5 |
62 | Thomas E. Lombardi | US | Poughkeepsie, NY | Sep 12, 2019 / 20190281702 - METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CONNECTORS | 4 |
63 | Ingo Reinkensmeier | DE | Frondenberg | Aug 04, 2022 / 20220241904 - COATED ABRASIVE PARTICLES, COATING METHOD USING SAME, COATING SYSTEM AND SEALING SYSTEM | 4 |
64 | Tao Xu | US | Irvine, CA | Jan 15, 2015 / 20150017878 - SYSTEMS AND METHODS FOR PROCESSING SOLAR SUBSTRATES | 4 |
65 | Dason Cheung | US | Fremont, CA | Apr 28, 2016 / 20160114348 - MOTORIZED ADHESIVE DISPENSING MODULE | 4 |
66 | Hong P. Gao | US | Austin, TX | Mar 19, 2009 / 20090072009 - Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure | 4 |
67 | Hisashi Hori | JP | Shizuoka | Dec 30, 2021 / 20210402510 - JOINING METHOD | 4 |
68 | Wei Qin | US | Lansdale, PA | Jun 28, 2012 / 20120160902 - WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME | 4 |
69 | Shigeki Sawa | JP | Ibi-Gun | Apr 05, 2012 / 20120080505 - Solder Ball Loading Mask, Apparatus and Associated Methodology | 4 |
70 | Sung K. Kang | US | Chappaqua, NY | Apr 21, 2016 / 20160113119 - SUBSTRATE VIA FILLING | 4 |
71 | Katsuhiko Watanabe | JP | Osaka | Sep 02, 2010 / 20100219229 - BONDING TOOL AND ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD | 4 |
72 | Ka Shing Kwan | SG | Singapore | Jan 28, 2016 / 20160023298 - WIRE BONDING APPARATUS COMPRISING AN OSCILLATOR MECHANISM | 4 |
73 | Akio Igarashi | JP | Tokyo | Apr 09, 2015 / 20150097024 - ELECTRODE FORMING DEVICE, ELECTRODE FORMING SYSTEM AND ELECTRODE FORMING METHOD | 4 |
74 | Bhaswan Manjunath | IN | Bangalore | Sep 18, 2014 / 20140269156 - COMPACT DEVICE FOR ENHANCING THE MIXING OF GASEOUS SPECIES | 4 |
75 | Gregory Khosrov Arslanian | US | Pipersville, PA | Jul 16, 2015 / 20150196870 - SYSTEM AND METHOD FOR GAS RECOVERY AND REUSE | 4 |
76 | Mitsuo Zen | JP | Saitama | Nov 18, 2010 / 20100291399 - LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE | 4 |
77 | Stephen L. Buchwalter | US | Anthem, AZ | May 31, 2012 / 20120132694 - Micro-Fluidic Injection Molded Solder (IMS) | 4 |
78 | Hajime Kashiki | JP | Kobe-Shi | Aug 20, 2015 / 20150231734 - FRICTION STIR SPOT WELDING DEVICE AND FRICTION STIR SPOT WELDING METHOD | 4 |
79 | Daniel J. Rybicki | US | Kemah, TX | Jun 30, 2022 / 20220205550 - Pipe that is Friction Forge Bonded to a Ladder Support through a Stud and a Bracket | 4 |
80 | Yen-Lung Chen | US | Troy, MI | Jun 11, 2015 / 20150158113 - WELDING LIGHT METAL WORKPIECES BY REACTION METALLURGY | 4 |
81 | Isao Shiozawa | JP | Tokyo | Jan 26, 2012 / 20120018492 - FRICTION STIR WELDING METHOD | 4 |
82 | David Edward Schick | US | Greenville, SC | Sep 14, 2017 / 20170259462 - ARTICLE AND METHOD OF FORMING AN ARTICLE | 4 |
83 | Mathew A. Rybicki | US | Kemah, TX | Jun 30, 2022 / 20220205550 - Pipe that is Friction Forge Bonded to a Ladder Support through a Stud and a Bracket | 4 |
84 | Yi-Li Hsiao | TW | Hsin-Chu | May 19, 2016 / 20160143157 - Metal Post Bonding Using Pre-Fabricated Metal Posts | 4 |
85 | Vincent Kirchhoff | US | Morgan Hill, CA | Mar 19, 2009 / 20090072009 - Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure | 4 |
86 | Yue Zhang | SG | Singapore | May 19, 2016 / 20160138996 - SYSTEM AND METHOD FOR DETECTING LEAKAGE IN A GAS PIPELINE | 4 |
87 | Ernst Wandke | DE | Geretsried | Mar 11, 2010 / 20100059575 - DEVICE AND METHOD FOR SELECTIVE SOLDERING | 4 |
88 | Masahiko Kimbara | JP | Okazaki-Shi | May 22, 2014 / 20140140004 - HEAT SINK FOR POWER MODULE | 4 |
89 | Joseph M. Fridy | US | Pittsburgh, PA | Jun 15, 2017 / 20170170439 - ENERGY STORAGE DEVICE AND RELATED METHODS | 4 |
90 | Marcel E. Josephson | US | San Jose, CA | Mar 10, 2022 / 20220075396 - Gas-Pulsing-Based Shared Precursor Distribution System And Methods Of Use | 4 |
91 | Mark Crockett | US | Cupertino, CA | Mar 19, 2009 / 20090072009 - Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure | 4 |
92 | Steve W. Larsen | US | Payson, UT | Apr 09, 2015 / 20150097020 - MATERIAL SURFACE MODIFICATION USING FRICTION STIR WELDING HYBRID PROCESS | 4 |
93 | Akira Takaguchi | JP | Toyama | Sep 06, 2012 / 20120224837 - SOLDER BATH AND METHOD OF HEATING SOLDER CONTAINED IN THE SOLDER BATH | 4 |
94 | Lawrence J. Povse | US | Kemah, TX | Jun 30, 2022 / 20220205550 - Pipe that is Friction Forge Bonded to a Ladder Support through a Stud and a Bracket | 4 |
95 | Yong Sung Eom | KR | Daejeon | Mar 31, 2022 / 20220102603 - METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | 4 |
96 | Takeo Nakagawa | JP | Tokyo | Jan 26, 2012 / 20120018492 - FRICTION STIR WELDING METHOD | 4 |
97 | Robert T. Szymanski | US | St. Clair Township, MI | Apr 09, 2015 / 20150096961 - RESISTANCE SPOT WELDING STEEL AND ALUMINUM WORKPIECES USING INSERTABLE COVER | 4 |
98 | Paul T. Higgins | US | Provo, UT | Apr 09, 2015 / 20150097020 - MATERIAL SURFACE MODIFICATION USING FRICTION STIR WELDING HYBRID PROCESS | 4 |
99 | Kenneth R. Vejr | US | Kemah, TX | Jun 30, 2022 / 20220205550 - Pipe that is Friction Forge Bonded to a Ladder Support through a Stud and a Bracket | 4 |
100 | John M. Griffin | US | Kemah, TX | Jun 30, 2022 / 20220205550 - Pipe that is Friction Forge Bonded to a Ladder Support through a Stud and a Bracket | 4 |