CMP groove processing positioning method and positioning device

Abstract

A CMP (chemical mechanical polishing) groove processing positioning method includes steps of: (S1) preparing a positioning ring device for positioning a substrate of a polishing pad; (S2) placing the positioning ring device on a processing platform of an engraving machine; (S3) putting the substrate of the polishing pad into a slot of the positioning ring device; (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad. In the present invention, the substrate is directly placed into the slot and vacuum-adsorbed onto the processing platform through the vacuum adsorption holes, thereby sufficiently fixing the substrate.

Description

CROSS REFERENCE OF RELATED APPLICATION

[0001] The present invention claims priority under 35 U.S.C. 119(a-d) to CN 201810875043.2, filed Aug. 3, 2018.

BACKGROUND OF THE PRESENT INVENTION

Field of Invention

[0002] The present invention relates to the field of chemical mechanical polishing (CMP), and more particularly to a CMP groove processing positioning method and to positioning device.

Description of Related Arts

[0003] Chemical mechanical polishing (CMP) is a micro-nano processing technology that combines mechanical grinding with chemical oxidation to remove the surface material of machined workpieces. The surface of the machined workpieces is ultra-flat and ultra-smooth through the CMP process, so that the CMP process is mainly used in the field of IC and MFMS manufacturing. During the CMP process, a rotating wafer is pressed onto a rotating polishing pad, and a polishing liquid containing abrasive particles and chemicals flows between the wafer and the polishing pad, so that the surface material of the wafer is continuously removed under the chemical action of the chemicals in the polishing liquid, and the mechanical action of the abrasive particles and the polishing pad. The polishing pad plays a very important role in the CMP process. A complete polishing pad from top to bottom comprises a substrate, a back-adhesive layer and a supporting base in sequence, wherein the substrate is in contact with the wafer and mainly for grinding and polishing, the back-adhesive layer bonds the substrate and the supporting base together, and the supporting base mainly serves as a support. In order to ensure that the polishing liquid has a sufficient action time on the substrate, a groove is usually engraved on the substrate to store the polishing liquid; at the same time, the pores of the substrate itself also store the polishing liquid, increasing the contact time and area of the polishing liquid with the wafer. The groove processing on the substrate of the polishing pad is an important part of CMP production. If there is a problem in engraving the groove, the polishing pad is scraped.

[0004] At present, the engraving process includes placing the substrate of the polishing pad processed in the previous process onto a processing platform of an engraving machine, positioning the substrate of the polishing pad relative to the engraving tool of the engraving machine through observing the position of the substrate of the polishing pad by the artificial naked eye, sticking the seal in the vacant part around the substrate of the polishing pad to form vacuum adsorption after the positioning is completed, rapidly rotating the processing platform, slowly descending the engraving tool from a position above and perpendicular to the substrate of the polishing pad, and engraving a groove with a certain depth on the substrate of the polishing pad through rotating the processing platform. However, there is often an error in the positioning of the artificial naked eye. If the positioning is not correct, the groove engraved on the substrate of the polishing pad may be incorrect, resulting in scrapping of the substrate of the polishing pad.

SUMMARY OF THE PRESENT INVENTION

[0005] An object of the present invention is to provide a CMP (chemical mechanical polishing) groove processing positioning method and positioning device, which solves problems that when a groove is engraved on a substrate of a polishing pad, there is an error in the artificial eye positioning, which causes engraving failure; and it is necessary to manually stick a seal in a vacant part to form vacuum adsorption during a positioning process, which is time consuming and laborious.

[0006] The present invention provides technical solutions as follows.

[0007] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0008] (S1) preparing a positioning ring device for positioning a substrate of a polishing pad;

[0009] (S2) placing the positioning ring device on a processing platform of an engraving machine;

[0010] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device;

[0011] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and

[0012] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad.

[0013] Preferably, the outer wall of the positioning ring device has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0014] Preferably, the slot is round and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is round, and an inner diameter of the round slot is as same as a diameter of the round substrate of the polishing pad.

[0015] Preferably, the inner diameter of the round slot is in a range of 550 mm to 700 mm.

[0016] Preferably, the slot is square and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot is as same as an edge of the square substrate of the polishing pad.

[0017] Preferably, the inner edge of the square slot is in a range of 400 mm to 600 mm.

[0018] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0019] Preferably, the positioning ring device is made from scraps left after preparing the substrate of the polishing pad.

[0020] Compared with the prior art, the present invention has some beneficially effects as follows.

[0021] (1) In the present invention, the substrate of the polishing pad is directly placed into the positioning ring device which is pre-placed on the processing platform of the engraving machine, such that the substrate of the polishing pad is vacuum-adsorbed onto the processing platform of the engraving machine through the vacuum adsorption holes in the processing platform of the engraving machine, thus the substrate of the polishing pad is accurately fixed.

[0022] (2) In the present invention, the substrate of the polishing pad is directly placed into the positioning ring device which is pre-placed on the processing platform of the engraving machine, such that there is no more vacant part around the substrate of the polishing pad, and no need to stick the seal in the vacant part, thereby reducing the positioning work steps.

[0023] (3) In the present invention, the slot in the positioning ring device is round or square, which is adapted to fix a corresponding substrate of the polishing pad.

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] FIG. 1 is a structurally schematic view of a round slot of a positioning ring device used in a CMP groove processing positioning method provided by the present invention.

[0025] FIG. 2 is a structurally schematic view of a square slot of a positioning ring device used in a CMP groove processing positioning method provided by the present invention.

[0026] In the drawings, 1: positioning ring device; 201: round slot; 202: square slot.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0027] All of the features disclosed in this specification, in addition to mutually exclusive features and/or steps, may be combined in any form.

[0028] The present invention is described in detail with FIGS. 1 and 2 as follows.

First Embodiment

[0029] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device I which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0030] Preferably, the positioning ring device I is made from scraps left after preparing the substrate of the polishing pad.

[0031] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0032] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0033] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0034] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0035] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0036] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0037] (S6) engraving a groove on the substrate of the polishing pad.

[0038] Preferably, the outer wall of the positioning ring device 1 has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0039] Preferably, the slot is a round slot 201 which is provided in a middle portion of the positioning ring device 1, the substrate of the polishing pad is round, and an inner diameter of the round slot 201 is as same as a diameter of the round substrate of the polishing pad.

[0040] Preferably, the inner diameter of the round slot 201 is in a range of 550 mm to 700 mm.

[0041] Preferably, the slot is a square slot 202 which is provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot 202 is as same as an edge of the square substrate of the polishing pad.

[0042] Preferably, the inner edge of the square slot 202 is in a range of 400 mm to 600 mm.

Second Embodiment

[0043] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device 1 which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0044] Preferably, the positioning ring device 1 is made from scraps left after preparing the substrate of the polishing pad.

[0045] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0046] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0047] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0048] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0049] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0050] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0051] (S6) engraving a groove on the substrate of the polishing pad.

[0052] Preferably, the outer wall of the positioning ring device 1 has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0053] Preferably, the slot is a round slot 201 which is provided in a middle portion of the positioning ring device 1, the substrate of the polishing pad is round, and an inner diameter of the round slot 201 is as same as a diameter of the round substrate of the polishing pad.

[0054] Preferably, the inner diameter of the round slot 201 is 550 mm.

Third Embodiment

[0055] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device 1 which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0056] Preferably, the positioning ring device 1 is made from scraps left after preparing the substrate of the polishing pad.

[0057] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0058] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0059] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0060] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0061] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0062] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0063] (S6) engraving a groove on the substrate of the polishing pad.

[0064] Preferably, the outer wall of the positioning ring device 1 has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0065] Preferably, the slot is a round slot 201 which is provided in a middle portion of the positioning ring device 1, the substrate of the polishing pad is round, and an inner diameter of the round slot 201 is as same as a diameter of the round substrate of the polishing pad.

[0066] Preferably, the inner diameter of the round slot 201 is 620 mm.

Fourth Embodiment

[0067] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device 1 which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0068] Preferably, the positioning ring device 1 is made from scraps left after preparing the substrate of the polishing pad.

[0069] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0070] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0071] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0072] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0073] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0074] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0075] (S6) engraving a groove on the substrate of the polishing pad.

[0076] Preferably, the outer wall of the positioning ring device 1 has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0077] Preferably, the slot is a round slot 201 which is provided in a middle portion of the positioning ring device 1, the substrate of the polishing pad is round, and an inner diameter of the round slot 201 is as same as a diameter of the round substrate of the polishing pad.

[0078] Preferably, the inner diameter of the round slot 201 is 700 mm.

Fifth Embodiment

[0079] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device 1 which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0080] Preferably, the positioning ring device 1 is made from scraps left after preparing the substrate of the polishing pad.

[0081] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0082] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0083] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0084] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0085] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0086] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0087] (S6) engraving a groove on the substrate of the polishing pad.

[0088] Preferably, the outer wall of the positioning ring device I has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0089] Preferably, the slot is a square slot 202 which is provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot 202 is as same as an edge of the square substrate of the polishing pad.

[0090] Preferably, the inner edge of the square slot 202 is 400 mm.

Sixth Embodiment

[0091] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device I which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0092] Preferably, the positioning ring device I is made from scraps left after preparing the substrate of the polishing pad,

[0093] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0094] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0095] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0096] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0097] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0098] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0099] (S6) engraving a groove on the substrate of the polishing pad.

[0100] Preferably, the outer wall of the positioning ring device I has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0101] Preferably, the slot is a square slot 202 which is provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot 202 is as same as an edge of the square substrate of the polishing pad.

[0102] Preferably, the inner edge of the square slot 202 is 560 mm.

Seventh Embodiment

[0103] A CMP (chemical mechanical polishing) groove processing positioning device is a positioning ring device l which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

[0104] Preferably, the positioning ring device l is made from scraps left after preparing the substrate of the polishing pad.

[0105] A CMP (chemical mechanical polishing) groove processing positioning method comprises steps of:

[0106] (S1) preparing a positioning ring device 1 for positioning a substrate of a polishing pad;

[0107] (S2) placing the positioning ring device 1 on a processing platform of an engraving machine;

[0108] (S3) putting the substrate of the polishing pad into a slot of the positioning ring device 1;

[0109] (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine;

[0110] (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine; and

[0111] (S6) engraving a groove on the substrate of the polishing pad.

[0112] Preferably, the outer wall of the positioning ring device 1 has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

[0113] Preferably, the slot is a square slot 202 which is provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot 202 is as same as an edge of the square substrate of the polishing pad.

[0114] Preferably, the inner edge of the square slot 202 is 600 mm.

Claims

1. A CMP (chemical mechanical polishing) groove processing positioning method comprising steps of: (S1) preparing a positioning ring device for positioning a substrate of a polishing pad; (S2) placing the positioning ring device on a processing platform of an engraving machine; (S3) putting the substrate of the polishing pad into a slot of the positioning ring device; (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad.

2. The CMP groove processing positioning method, as recited in claim 1, wherein: the outer wall of the positioning ring device has a same shape and size as the processing platform of the engraving machine, and is a circle, a square, a rectangle, a triangle, or a diamond.

3. The CMP groove processing positioning method, as recited in claim 1, wherein: the slot is round and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is round, and an inner diameter of the round slot is as same as a diameter of the round substrate of the polishing pad.

4. The CMP groove processing positioning method, as recited in claim 3, wherein: the inner diameter of the round slot is in a range of 550 mm to 700 mm.

5. The CMP groove processing positioning method, as recited in claim 1, wherein: the slot is square and provided in a middle portion of the positioning ring device, the substrate of the polishing pad is square, and an inner edge of the square slot is as same as an edge of the square substrate of the polishing pad.

6. The CMP groove processing positioning method, as recited in claim 5, wherein: the inner edge of the square slot is in a range of 400 mm to 600 mm.

7. A CMP (chemical mechanical polishing) groove processing positioning device, which is a positioning ring device which has a slot in a middle portion thereof for positioning a substrate of a polishing pad.

8. The CMP groove processing positioning device, as recited in claim 7, wherein: the positioning ring device is made from scraps left after preparing the substrate of the polishing pad.