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Patent application title: RESIN COMPOSITION CONTAINING ETHYLENE-VINYL ALCOHOL COPOLYMER, MOLDED PRODUCT, AND MULTILAYER STRUCTURE

Inventors:
IPC8 Class: AC08F21606FI
USPC Class: 1 1
Class name:
Publication date: 2018-05-31
Patent application number: 20180148528



Abstract:

A resin composition according to an aspect of the present invention comprises: an ethylene-vinyl alcohol copolymer (A); and a block copolymer (B) having a block (b1) that includes a vinyl aromatic monomer unit, and a block (b2) that includes an isobutylene unit, wherein the ethylene-vinyl alcohol copolymer (A) and the block copolymer (B) form a co-continuous phase structure; and a DSC curve obtained following heating the resin composition up to a melting point and cooling at a rate of 50.degree. C./min in a differential scanning calorimetry analysis shows two peaks, with a higher peak top temperature falling within a range of 130.degree. C. or greater and 170.degree. C. or less, and a lower peak top temperature falling within a range of 100.degree. C. or greater and less than 130.degree. C. A resin composition may thus be obtained that is able to give a molded article that is superior in balance between gas barrier properties and flexibility.

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