Patent application number | Description | Published |
20100279029 | Method for coating nanometer particles - There is disclosed a method for coating nanometer metal particles. The step includes three steps. At the first step, a substrate is provided. At the second step, the substrate is coated with a metal layer. At the third step, the metal layer is annealed so that the metal layer is transformed into nanometer metal particles. | 11-04-2010 |
20110024880 | NANO-PATTERNED SUBSTRATE AND EPITAXIAL STRUCTURE - A nano-patterned substrate includes a plurality of nano-particles or nanopillars on an upper surface thereof. A ratio of height to diameter of each of the nano-particles or each of the nanopillars is either greater than or equal to 1. Particularly, a ratio of height to diameter of the nanopillars is greater than or equal to 5. Each of the nano-particles or each of the nanopillars has an arc-shaped top surface. When an epitaxial growth process is applied onto the nano-patterned substrate to form an epitaxial layer, the epitaxial layer has very low defect density. Thus, a production yield of fabricating the subsequent device can be improved. | 02-03-2011 |
20130240831 | GROWING AN IMPROVED P-GAN LAYER OF AN LED THROUGH PRESSURE RAMPING - The present disclosure involves an apparatus. The apparatus includes a photonic die structure that includes a light-emitting diode (LED) die. The LED die is a vertical LED die in some embodiments. The LED die includes a substrate. A p-doped III-V compound layer and an n-doped III-V compound layer are each disposed over the substrate. A multiple quantum well (MQW) layer is disposed between the p-doped III-V compound layer and the n-doped III-V compound layer. The p-doped III-V compound layer includes a first region having a non-exponential doping concentration characteristic and a second region having an exponential doping concentration characteristic. In some embodiments, the second region is formed using a lower pressure than the first region. | 09-19-2013 |
20140077152 | III-V Group Compound Devices with Improved Efficiency and Droop Rate - The present disclosure involves an illumination apparatus. The illumination apparatus includes an n-doped semiconductor compound layer, a p-doped semiconductor compound layer spaced apart from the n-doped semiconductor compound layer, and a multiple-quantum-well (MQW) disposed between the first semiconductor compound layer and the second semiconductor compound layer. The MQW includes a plurality of alternating first and second layers. The first layers of the MQW have substantially uniform thicknesses. The second layers have graded thicknesses with respect to distances from the p-doped semiconductor compound layer. A subset of the second layers located most adjacent to the p-doped semiconductor compound layer is doped with a p-type dopant. The doped second layers have graded doping concentration levels that vary with respect to distances from the p-doped semiconductor layer. | 03-20-2014 |
20140077153 | Photonic Devices with Embedded Hole Injection Layer to Improve Efficiency and Droop Rate - The present disclosure involves a light-emitting device. The light-emitting device includes an n-doped gallium nitride (n-GaN) layer located over a substrate. A multiple quantum well (MQW) layer is located over the n-GaN layer. An electron-blocking layer is located over the MQW layer. A p-doped gallium nitride (p-GaN) layer is located over the electron-blocking layer. The light-emitting device includes a hole injection layer. In some embodiments, the hole injection layer includes a p-doped indium gallium nitride (p-InGaN) layer that is located in one of the three following locations: between the MQW layer and the electron-blocking layer; between the electron-blocking layer and the p-GaN layer; and inside the p-GaN layer. | 03-20-2014 |
20140077224 | Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate - The present disclosure involves an apparatus. The apparatus includes a substrate having a front side a back side opposite the front side. The substrate includes a plurality of openings formed from the back side of the substrate. The openings collectively define a pattern on the back side of the substrate from a planar view. In some embodiments, the substrate is a silicon substrate or a silicon carbide substrate. Portions of the silicon substrate vertically aligned with the openings have vertical dimensions that vary from about 100 microns to about 300 microns. A III-V group compound layer is formed over the front side of the silicon substrate. The III-V group compound layer is a component of one of: a light-emitting diode (LED), a laser diode (LD), and a high-electron mobility transistor (HEMT). | 03-20-2014 |
20140078757 | High Voltage LED with Improved Heat Dissipation and Light Extraction - The present disclosure involves a lighting apparatus. The lighting apparatus includes a polygon die. The polygon die includes a plurality of light-emitting diodes (LEDs). Each LED includes a plurality of epi-layers, the epi-layers containing a p-type layer, an n-type layer, and a multiple quantum well (MQW) disposed between the p-type layer and the n-type layer. Each LED includes a p-type electrode and an n-type electrode electrically coupled to the p-type layer and the n-type layer, respectively. The polygon die also includes a submount to which each of the LEDs is coupled. The p-type and the n-type electrodes are located between the submount and the epi-layers. The submount contains a plurality of conductive elements configured to electrically couple at least a portion of the plurality of LEDs in series. | 03-20-2014 |
20140084238 | NANO-PATTERNED SUBSTRATE AND EPITAXIAL STRUCTURE CROSS-REFERENCE TO RELATED APPLICATION - A nano-patterned substrate includes a substrate and a plurality of nano-structures. The substrate has an upper surface and each of the plurality of nano-structures comprises a semiconductor buffer region and a buffer region formed on the upper surface of the substrate, wherein one of the pluralities of nano-structures has a ratio of height to diameter greater than 1, and an arc-shaped top surface. | 03-27-2014 |
20150311391 | LIGHTING DEVICE - A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series. | 10-29-2015 |
20150340553 | III-V Group Compound Devices with Improved Efficiency and Droop Rate - A photonic device includes: a first-type III-V group layer; a second-type III-V group layer formed on the first-type III-V group layer; and a multi-quantum well layer disposed between the first-type III-V group layer and the second-type III-V group layer; wherein: the multi-quantum well layer comprises a plurality of active layers interleaved with a plurality of barrier layers such that each barrier layer is separated from adjacent barrier layers by a respective one of the active layer; a material of each barrier layer comprises semiconductor compound devoid of Al element; the barrier layers comprises a first group layers between the first-type III-V group layer and the second-type III-V group layer and a second group layers between the second-type III-V group layer and the first group layers, and a thickness of each barrier layer of the first group layers is greater than that of each barrier layer of the second group layers; and the barrier layers of the first group layers comprise uniform thickness. | 11-26-2015 |
Patent application number | Description | Published |
20130048256 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged on a side portion of the air outlet, a second fin set arranged on a central portion of the air outlet and a third fin set. The first fin set includes a plurality of first fins with a first passage is defined between each two neighboring first fins. The second fin set includes a plurality of second fins with a second passage defined between each two neighboring second fins, a width of the second passage is less than that of the first passage. The third fin set includes a plurality of third fins. Each third fin is arranged between two neighboring first fins and divides an outer portion of the first passage away from the outlet of the fan into two third passages. | 02-28-2013 |
20130050941 | ELECTRONIC DEVICE WITH HEAT DISSIPATION MODULE - An electronic device includes a casing, a fan, and a heat sink. The casing defines a plurality of through holes therein. The fan defines air outlet at one side thereof facing the through holes of the casing. The air outlet includes a first portion and a second portion. Air pressure in the first portion is larger than air pressure of the second portion. The heat sink includes a first fin set arranged on the first portion and a second fin set arranged on the second portion. A first passage is defined between each two neighboring first fins. A second passage is defined between each two neighboring second fins. A width of the second passage is less than that of the first passage. | 02-28-2013 |
20130286588 | ELECTRONIC DEVICE - An exemplary electronic device includes a container, a fan assembly and a duct received in the container. The fan assembly includes a centrifugal fan and a fin group thermally contacting an electronic component in the container. An air passage is defined between each adjacent fins of the fin group. An inner side of the fin group is mounted on an outlet of the centrifugal fan. A bottom surface of the fin group and an inner surface of the container cooperatively define a first channel therebetween. The duct includes an inlet and a first outlet. Airflow guided by the centrifugal fan flows through the duct and the first channel to cool a bottom end of the fin group, then is absorbed into the centrifugal fan from an inlet of the centrifugal fan, and then flow through the air passages of the fin group to cool a central portion the fin group. | 10-31-2013 |
Patent application number | Description | Published |
20130048255 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a housing, a fan mounted within the housing, a fin assembly fixed to the housing and heat pipes attached on the fin assembly. The housing includes a panel and a sidewall extending upwardly from a periphery of the panel. The fin assembly includes first fins and second fins alternately arranged on the panel. The first fins and the second fins each include a plate, an upper flange and a lower flange extending from a top side and a bottom side of the plate, respectively. Each second fin defines a slot in a lateral side of the plate thereof adjacent to the fan. Every two adjacent first fin and second fin define a channel therebetween. Two adjacent channels communicate with each other at inlets thereof via the slot, and separated from each other at outlets thereof via a second fin. | 02-28-2013 |
20130056182 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a fan and a heat sink located at the air outlet of the fan. The heat sink includes a first fin set arranged at a central portion of the air outlet, and two second fin sets respectively arranged at a side portion of the air outlet. The first fin set includes a plurality of first fins with a first passage defined between each two neighboring first fins. Each of the second fin sets includes a plurality of second fins with a second passage defined between each two neighboring second fins. Each of the second fin sets defines an undercut near the air outlet of the fan. The first passages communicate with the central portion of the air outlet of the fan. Each of the undercuts of the second fin sets communicates with corresponding side portion and corresponding second passage. | 03-07-2013 |
20140063733 | ELECTRONIC DEVICE WITH FAN - An electronic device includes a mainboard and a fan mounted on the mainboard. The fan includes a stator and a rotor. The rotor includes a hub covering around a periphery of the stator, and a plurality of blades disposed at a periphery of the hub. The stator is directly fixed to and directly electrically connected to the mainboard. | 03-06-2014 |
Patent application number | Description | Published |
20140049915 | ELECTRONIC DEVICE - An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air. | 02-20-2014 |
20140071641 | VOLTAGE CONVERTER AND POWER SUPPLY DEVICE USING THE SAME - A power supply device includes a laptop battery and a voltage converter secured to the laptop battery. The laptop battery includes a first connecting portion and a first interface for outputting a first voltage. The voltage converter includes a housing, a second connecting portion formed in the housing and a circuit board secured to the housing. The circuit board includes a second interface, a first converting unit and a third interface. The first connecting portion is detachably coupled to the second portion to secure the voltage converter to the laptop battery. The second interface is electronically connected to the first interface so as to receive the first voltage when the first connecting portion is coupled to the second connecting portion. The first converting unit converts the first voltage to the second voltage and outputs the second voltage through the third interface. | 03-13-2014 |
20140202676 | FIXING ASSEMBLY FOR HEAT SINK - A fixing assembly includes a main body, a fixing member, and a limiting member secured to the main body. The limiting member angles with the main body to form a limited but resiliently deformable space for mounting of the fixing member, but then restores to hold the fixing member captive and avoid the displacement or loss of the fixing member at any time. A heat sink using the fixing assembly is also provided. | 07-24-2014 |
Patent application number | Description | Published |
20120188703 | LINKAGE MECHANISM AND ELECTRONIC DEVICE USING SAME - A linkage mechanism includes a fixing member, a rotary member, a support member and a sliding module. A first end of the rotary member is rotatably assembled to the fixing member. A first end of the support member is rotatably hinged to the second end of the rotary member, and the second end of the support member is hinged with the sliding module. The sliding module includes a sliding member and a sliding rod slidably assembled to the sliding member. The sliding member is slidably mounted to the fixing member, and further hinged to the second end of the support member. The sliding member defines a sliding hole. The sliding rod is rotatably assembled to the rotary member together with the fixing member, and further slidably passing through the sliding hole of the sliding member. An electronic device using the linkage mechanism is also provided. | 07-26-2012 |
20120194978 | HINGE MECHANISM AND ELECTRONIC DEVICE USING THE SAME - A hinge mechanism includes a fixing member, a rotary member, a rotary member, an adjusting member and a support member, all of which are interconnected. The rotary member is capable of being positioned in a preset manner to form an acute angle relative to the fixing member, the adjusting member is capable of being positioned in a preset manner to form an acute angle relative to the rotary member; and the support member is capable of being positioned in a preset manner to form an obtuse angle relative to the adjusting member. An electronic device using the hinge mechanism is also provided. | 08-02-2012 |
20120304516 | SUPPORT MECHANISM WITH MOUNTING MEMBER ROTATINGLY RECEIVED IN SUPPORT SEAT - A support mechanism includes a hinge assembly, a hollow support seat, a positioning member and a mounting member. The support seat includes a plurality of restricting portions and a plurality of support portions corresponding to the restricting portions, the restricting portions and the support portions cooperatively defining a receiving space therebetween. The support seat further defines a positioning hole in the circumferential wall thereof, the positioning hole communicating with the receiving space. The positioning member is received in the positioning hole. The mounting member is connected to the hinge assembly and includes a peripheral position portion, the position portion is capable of passing the restricting portions when inserted into the support seat and rotating within the receiving space to a predetermined position in which the positioning member is engagable with the position portion of the mounting member to fix the hinge assembly to the support seat. | 12-06-2012 |