Patent application number | Description | Published |
20090277931 | WIRELESS SPOUT AND SYSTEM FOR FREE-AND PRE-MEASURED DISPENSING - The present invention is related to a pouring device for a container for the dosing of liquid, said pouring device comprising: a) a housing; b) a passage for the liquid within the housing; c) an electrical operated opening/closing mechanism for opening or closing the passage in order to dosing of a predetermined or registerable amount of liquid, characterized in that the passage comprising a silicone tube, and the opening/closing mechanism is to block the silicone tube by squeezing the silicone tube in order to close the passage. The silicone tube inside the spout is the only path for the liquid to go through from the bottle, meanwhile the rest components are protected from liquid. This guaranties a quick and controlled flow of the liquid and avoids any air bubbles to influence the pour precision. | 11-12-2009 |
20120211516 | WIRELESS SPOUT AND SYSTEM FOR DISPENSING - Embodiments of the present invention provide a pouring device for a container for the dosing of liquid. The pouring device has various features intended to ease use, including an improved removal and attachment system and a system to identify and visually illustrate selected pour sizes. In a specific embodiment, the pouring device has a colored light or LED indicator system that allows the user to quickly and easily confirm the selected pour size. Embodiments may also include one or more features that ease attachment and removal of the pouring device to a liquid container, such as a replaceable cork system. | 08-23-2012 |
20130056502 | AIR VALVES FOR A WIRELESS SPOUT AND SYSTEM FOR DISPENSING - Embodiments of the present invention provide a pouring device for a container for the dosing of liquid. The pouring device has an improved air valve system that works via cooperation between a weighted magnetic component and a metal ball in order to control opening and closing of the air valve inlet. | 03-07-2013 |
20140299634 | Air Valves for a Wireless Spout and System for Dispensing - Embodiments of the present invention provide a pouring device for a container for the dosing of liquid. The pouring device has an improved air valve system that works via cooperation between a weighted magnetic component and a metal ball in order to control opening and closing of the air valve inlet. | 10-09-2014 |
20140367411 | WIRELESS SPOUT AND DISPENSING SYSTEM - The present invention is related to a pouring device for a container for the dosing of liquid, said pouring device comprising: a) a housing b) a passage for the liquid within the housing; c) an electrical operated opening/closing mechanism for opening or closing the passage in order to dosing of a predetermined or registerable amount of liquid, characterized in that the passage comprising a silicone tube, and the opening/closing mechanism is to block the silicone tube by squeezing the silicone tube in order to close the passage. The silicone tube inside the spout is the only path for the liquid to go through from the bottle, meanwhile the rest components are protected from liquid. This guaranties a quick and controlled flow of the liquid and avoids any air bubbles to influence the pour precision. | 12-18-2014 |
Patent application number | Description | Published |
20110297329 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 12-08-2011 |
20120080052 | DEVICES FOR METHODOLOGIES FOR HANDLING WAFERS - Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed. | 04-05-2012 |
20120080132 | SECURING MECHANISM AND METHOD FOR WAFER BONDER - Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer. | 04-05-2012 |
20120080150 | FIXTURES AND METHODS FOR UNBONDING WAFERS BY SHEAR FORCE - Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed. | 04-05-2012 |
20120080832 | DEVICES FOR METHODOLOGIES RELATED TO WAFER CARRIERS - Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed. | 04-05-2012 |
20140182762 | SECURING MECHANISM AND METHOD FOR WAFER BONDER - Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer. | 07-03-2014 |
20140262053 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 09-18-2014 |