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Yusuke Tanaka, Tokyo JP

Yusuke Tanaka, Tokyo JP

Patent application numberDescriptionPublished
20110006383THREE-DIMENSIONAL STRUCTURE AND ITS MANUFACTURING METHOD - A plurality of three-dimensional structure configuring devices, each including an elastic body in which micro three-dimensional structure elements fixed to a substrate member are placed so as to be covered therewith and which is fixed to the substrate member, are placed within a film-like elastic body with the substrate members thereof spaced apart from one another so as to configure a three-dimensional structure. Thereby, the plurality of three-dimensional structure configuring devices can be placed with desired intervals of arrangement and in desired positions within the film-like elastic body and so that various specifications can be addressed.01-13-2011
20110117034ULTRAVIOLET ABSORBER WATER-DISPERSED COMPOSITION - Disclosed is an ultraviolet absorber water-dispersed composition, comprising the following components (A) and (B); 05-19-2011
20130205049SIGNAL PROCESSING DEVICE - A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.08-08-2013
20130289187RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE - A resin composition for encapsulation according to the present invention includes: a phenol resin-based curing agent (A) essentially containing a polymer component (A-1) in which a biphenylene group-containing structural unit bonds a monovalent hydroxyphenylene structural unit and a polyvalent hydroxyphenylene structural unit together and a polymer component (A-2) in which the biphenylene group-containing structural unit bonds the polyvalent hydroxyphenylene structural units together; an epoxy resin (B); and an inorganic filler (C). This makes it possible to economically obtain a resin composition for encapsulation having soldering resistance, flame resistance, continuous moldability, flowability and high temperature storage stability in an excellent balanced manner, and an electronic component device produced by encapsulating an element with a cured product thereof and having high reliability.10-31-2013
20140013914SURFACE-COATED CUTTING TOOL - A surface-coated cutting tool having excellent fracture resistance and wear resistance is provided. In the surface-coated cutting tool having at least a hard coating layer made of an (Al, Cr)N layer with a layer thickness of 0.5 μm to 10 μm formed to coat on the surface of a cutting tool body made of a WC cemented carbide, pores and droplets are dispersed and distributed in the (Al, Cr)N layer, the occupied area ratio of the pores and the occupied area ratio of the droplets in a cross-section of the (Al, Cr)N layer are 0.5 to 1 area % and 2 to 4 area % respectively, and, furthermore, out of the droplets, Al-rich droplets having a higher Al content ratio than the average Al content ratio of the (Al, Cr)N layer occupy 20 area % or more of the total droplet area.01-16-2014
20140372207PROFIT INDEX VALUE GENERATION SYSTEM AND PROFIT INDEX VALUE GENERATION METHOD - A profit index value generation system includes a profit index value calculating unit. The profit index value calculating unit calculates a profit index value related to a link destination web page in accordance with (i) a selection probability value that indicates a probability of selection of link information, the link information being posted on a link source web page displayed on a display screen of a terminal and being linked to the link destination web page on which advertisement information is posted, and (ii) an expected profit value that indicates an amount of profit which is expected to be generated as a result of the advertisement information being displayed on the display screen together with the link destination web page.12-18-2014
20140372212RELEVANCE INDEX CORRECTION APPARATUS AND RELEVANCE INDEX CORRECTION METHOD - A relevance index correction apparatus includes an attribute information obtainer, a relevance index generator, and a specific relevance index calculator. The attribute information obtainer obtains, in response to selection of a specific piece of advertisement information that is to be posted on a web page, attribute information related to the specific piece of advertisement information. The relevance index generator generates an apparent relevance index and a mean relevance index. The apparent relevance index indicates an apparent degree of relevance of the attribute information with respect to the specific piece of advertisement information. The mean relevance index indicates a mean degree of relevance of the attribute information with respect to all of a plurality of pieces of advertisement information. The specific relevance index calculator calculates a specific relevance index that indicates a true degree of relevance of the attribute information with respect to the specific piece of advertisement information.12-18-2014
20150030401SURFACE COATING CUTTING TOOL - A surface-coated cutting tool with a body and hard coating layer is provided. (a) The hard coating layer is made of a complex nitride layer of Al and Cr. (b) The hard coating layer deposited on a region from a cutting edge to a location 100 μm from the cutting edge toward an opposite side thereof has a granular crystal structure. The average grain size of granular crystals on a surface of the hard coating layer on the region is 0.2-0.5 μm. The average grain size of granular crystals at an interface between the cutting tool body and the hard coating layer on the region is smaller than the average grain size on the surface the hard coating layer in an extent of 0.02-0.1 μm. The crystal grain size length ratio of crystal grains whose size is 0.15-20% or less.01-29-2015
20150054180RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC DEVICE USING THE SAME - The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.02-26-2015

Patent applications by Yusuke Tanaka, Tokyo JP

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