Patent application number | Description | Published |
20090120671 | FPCB SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer. | 05-14-2009 |
20090159317 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured. | 06-25-2009 |
20090159559 | METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD HAVING BURIED HOLES - A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board. The stacked electrically conductive layers and the insulation layers are laminated together to achieve a multilayer printed circuit board. | 06-25-2009 |
20090166063 | STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME - An exemplary stiffener includes at least one polyimide layer and at least one polyetherimide layer adhered to the at least one polyimide layer. The at least one polyetherimide layer is represented by the following general formula: | 07-02-2009 |
20090176080 | STIFFENER AND STRENGTHENED FLEXIBLE PRINTED CIRCUIT BOARD HAVING THE SAME - An exemplary stiffener includes at least one polyethylene naphthalate layer. The at least one polyethylene naphthalate layer is represented by the following formula: | 07-09-2009 |
20090205855 | STIFFENER SHEET AND FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME - A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: | 08-20-2009 |
20090217520 | METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE - In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed. | 09-03-2009 |
20120066903 | METHOD OF MANUFACTURING FPCB SUBSTRATE - A method for manufacturing a FPCB substrate includes the following steps. First, a FPCB material including an insulation layer and an electrically conductive layer formed on the insulation layer is provided. The electrically conductive layer has a first surface and an opposite second surface. The insulation layer has a third surface and an opposite fourth surface. The third surface comes into contact with the second surface. Secondly, a through hole extends from the first surface to the fourth surface is formed. The through hole includes a metal hole in the electrically conductive layer and an insulation hole in the insulation layer. Thirdly, the insulation hole is enlarged to expose a portion of the electrically conductive layer around the metal hole. Finally, the exposed portion is bent to form a hook which passes through the enlarged insulation hole and protrudes out from the fourth surface of the insulation layer. | 03-22-2012 |