Patent application number | Description | Published |
20110044509 | Bridge structural safety monitoring system and method thereof - The present invention discloses a bridge structural safety monitoring system and a bridge structural safety monitoring method. The method includes the steps of capturing an image of a monitoring area of a bridge to create a standard image of the bridge operated at normal conditions, capturing images of the monitoring area of the bridge continuously to obtain monitoring images, comparing the standard image with the monitoring image to obtain a displacement correlation coefficient of the monitoring area of the bridge, and transmitting the displacement correlation coefficient to a central console, such that the central console can determine the using condition of the bridge according to the displacement correlation coefficient. | 02-24-2011 |
20120307003 | IMAGE SEARCHING AND CAPTURING SYSTEM AND CONTROL METHOD THEREOF - The present invention discloses an image searching and capturing system and a control method thereof. The system comprises a first capture device, a second capture device, a control module and a processing module. The first capture device captures a plurality of multi-spectral panoramic images with panorama. The control module controls the second capture device to search and target an azimuth of target object according to the plurality of multi-spectral panoramic images; the control module controls that the second capture device rotates a rotation module to capture a high-resolution image of a target object. The control module controls a rotation angle and a rotation direction of the rotation module according to attitude information, position information, and azimuth of the target object. The invention is applied to environmental monitoring and disaster monitoring, and has automatic search for targets, calibration targets and achieve high-resolution images and other effects. | 12-06-2012 |
20130176793 | FLASH MEMORY APPARATUS - A flash memory apparatus is provided. The flash memory apparatus includes a plurality of memory cells and a plurality of programming voltage control generators. Each of the memory cells receives a programming control voltage through a control end thereof, and executes data programming operation according to the programming control voltages. Each of the programming voltage control generators includes a pre-charge voltage transmitter and a pumping capacitor. The pre-charge voltage transmitter provides pre-charge voltage to the end of each of the corresponding memory cells according to pre-charge enable signal during a first period. A pumping voltage is provided to the pumping capacitor during a second period, and the programming control voltage is generated at the control end of each of the memory cells. | 07-11-2013 |
20140111649 | MULTI-IMAGE CAPTURE DEVICE CAPTURING IMAGES BY MEANS OF CIRCULAR MOTION - A multi-image capture device capturing images by means of circular motion controls the shift movement, along a semi-circular measuring rod, of a moving mechanism by a location control device. Furthermore, a rotary control device is used to control the positioning and image-capturing angle of a second image capture device fixed on the rotary mechanism. Thereby, a first image capture device and the second image capture device are of a co-circle configuration where the optical axis of the first image capture device and the second image capture device overlap to form a center of the co-circle. Such a configuration can broaden the visual range of the image capture device, and allows quick calibration of the image capture device according to positioning of shift movement and image-capturing angles. | 04-24-2014 |
20140111810 | SYSTEM OF COMPUTING SURFACE RECONSTRUCTION, IN-PLANE AND OUT-OF-PLANE DISPLACEMENTS AND STRAIN DISTRIBUTION - A system of computing surface reconstruction, in-plane and out-of-plane displacements and strain distribution utilizes the optical switching element to switch the reference beam to analyze the images of the test object before and after deformation, to measure the topography, in-plane and out-of-plane displacements and surface two-dimensional strain distribution on the test surface of the test object, and thus to increase the measurement range on the test surface of the test object with the use of image registration. Thereby, the complexity and error of scanning the test object can be reduced. Such a system need not to move the image capturing device or test object to generate relative displacement for reaching the measurement effect of the test surface of the test object in three-dimensional coordinates. | 04-24-2014 |
Patent application number | Description | Published |
20090134504 | Semiconductor package and packaging method for balancing top and bottom mold flows from window - A window-type semiconductor package to balance top and bottom moldflows and its method are revealed. The package primarily comprises a substrate having a slot, a chip, and an encapsulant. After die attaching, an input opening and an output opening are formed and exposed from both ends of the slot. The slot is off-center designed so that the dimension of the input opening is smaller than the one of the output opening. The encapsulant has a top molding portion formed on the top surface of the substrate and a smaller bottom molding portion formed on the bottom surface of the substrate. The mold-flowing speeds between the top molding portion and the bottom molding portion are balanced to eliminate trapped air bubbles in the top mold and to avoid the flooding of the molding compound in the bottom mold. | 05-28-2009 |
20090166891 | Cutting and molding in small windows to fabricate semiconductor packages - A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced. Additionally, the encapsulnat on the window molding areas is cut when singulating the substrate units so that the adhesion area of the encapsulant to the substrate strip is increased to prevent the delamination of traces and solder mask of the substrate units. | 07-02-2009 |
20090302446 | SEMICONDUCTOR PACKAGE FABRICATED BY CUTTING AND MOLDING IN SMALL WINDOWS - A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced. Additionally, the encapsulant on the window molding areas is cut when singulating the substrate units so that the adhesion area of the encapsulant to the substrate strip is increased to prevent the delamination of traces and solder mask of the substrate units. | 12-10-2009 |
20100219521 | WINDOW TYPE SEMICONDUCTOR PACKAGE - A window-type semiconductor package is revealed, primarily comprising a substrate with an interconnection channel, a chip on the substrate, a die-attach adhesive between the chip and the substrate, and an encapsulant filling the interconnection channel. A first solder mask formed on the top surface of the substrate has a specific pattern. The die-attach adhesive bonds the active surface of the chip to the first solder mask with the bonding pads of the chip aligned inside the interconnection channel. The first solder mask has an opening to expose the interconnection channel and further to form an indentation from the interconnection channel to expose the top surface to prevent damaging of the active surface of the chip adjacent to the edges of the interconnection channel to ensure the integrity and yield of the final products. | 09-02-2010 |
20120077312 | FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL - Disclosed is a flip-chip bonding method to reduce voids in underfill material. A substrate with connecting pads is provided. At least a chip with a plurality of bumps is bonded on the substrate and then an underfill material is formed between the chip and the substrate. Finally, the substrate is placed in a pressure oven in which a positive pressure greater than one atm is provided, meanwhile, the underfill material is thermally cured with exerted pressures to reduce bubbles or voids trapped inside the underfill material to avoid popcorn issues due to CTE mismatch between the chip and the substrate. In one embodiment, another underfill material is further formed between a plurality of chips and bubbles or voids trapped between the chips are also reduced by the pressurized curing. | 03-29-2012 |
20120115277 | MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS - A multi-chip stacking method to reduce voids between stacked chips is revealed. A first chip is disposed on a substrate, and a plurality of first bonding wires are formed by wire bonding to electrically connect the first chip and the substrate. A second chip is disposed on an active surface of the first chip where a FOW (film over wire) adhesive is formed on a back surface of the second chip. The FOW adhesive partially encapsulates the first bonding wires and adheres to the active surface of the first chip. Then, the substrate is placed in a pressure oven to provide a positive pressure greater than one atm during thermally curing the FOW adhesive with exerted pressures. Accordingly, voids can be reduced inside the FOW adhesive during the multi-chip stacked processes where issues of poor adhesion and popcorn between chips can be avoided. | 05-10-2012 |
20120187598 | METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLDING COMPOUNDS OF SEMICONDUCTOR PACKAGES - Disclosed are a method and an apparatus of compression molding to reduce voids in molding compounds of semiconductor packages. A compression mold jig set including a top mold and a bottom mold is provided and disposed inside a pressure chamber. A substrate disposed with chips is loaded on the top mold. An encapsulating material is filled in the cavity of the bottom mold. When heating the bottom mold to melt the encapsulating material, a positive air pressure more than 1 atm is provided in the pressure chamber in order to expel or reduce any bubbles trapped inside the encapsulating material. Then, the top mold is pressed downward to clamp with the bottom mold under the heating and high-pressure condition until the encapsulating material is pre-cured to transform a molding compound adhered to the substrate. Therefore, potential bubble trapped inside the molding compound can be eliminated or reduced to improve production yield, reliability and life time. | 07-26-2012 |
20120264257 | MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES - Disclosed is a mold array process (MAP) method to prevent exposure of peripheries of substrate units where the major characteristic is to implement two kinds of encapsulating materials in the MAP method in mass production. A first encapsulating material for encapsulating chips is formed on a substrate strip by molding to continuously encapsulate the substrate units and the scribe lines between adjacent substrate units. Prior to forming a second encapsulating material, a plurality of cut grooves are formed along the scribing lines by pre-cutting processes to penetrate through the substrate strip but without penetrating through the first encapsulating material and have such a width that a plurality of peripheries of the substrate units are exposed outside the scribing lines. Then, the second encapsulating material is filled into the cut grooves. Accordingly, the peripheries of the substrate units are still encapsulated with the remains of the second encapsulating material after singulation processes where the substrate units are singulated into individual semiconductor packages to prevent exposure of the peripheries of the substrate units. | 10-18-2012 |
20120267782 | PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE - Disclosed is a package-on-package semiconductor device comprising a bottom package, a top package thereon and a ACA (Anisotropic Conductive Adhesive) layer. A plurality of ball pads are disposed on the peripheries of an upper surface of the substrate of the bottom package. A plurality of solder balls are disposed at the peripheries of the lower surface of the substrate of the top package. The ACA layer having a central opening is interposed between the bottom package and the top package where the ACA layer contains a plurality of conductive particles. Therein, the size of the central opening and the thickness of the ACA layer are selected such that the anisotropic conductive adhesive layer adheres the peripheries of the upper surface of the bottom package to the peripheries of the lower surface of the top package and the solder balls are encapsulated inside the anisotropic conductive adhesive layer. The solder balls encapsulate some of the conductive particles to mechanically joint and electrically connect to the ball pads. Thereby, the bonding strength of the solder balls can be improved and the warpage of the substrate of the bottom package is effectively reduced to avoid failure of electrical connections between both packages caused by the breaking of soldering joints. | 10-25-2012 |
20120270368 | MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES - Disclosed is a mold array process (MAP) method to encapsulate cut edges of substrate units. A substrate strip includes a plurality of substrate units arranged in a matrix. Scribe lines are defined between adjacent substrate units and at the peripheries of the matrix where pre-cut grooves are formed along the scribe lines with a width greater than the width of the scribe lines. An encapsulant is formed on the matrix of the substrate strip to continuously encapsulate the substrate units and the scribe lines to enable the encapsulant to fill into the pre-cut grooves to further encapsulate the cut edges of the substrate units. The cut edges of the substrate units are still encapsulated by the encapsulant even after singulation processes where substrate units are singulated into individual semiconductor packages to prevent the exposure of the plated traces of the substrate units to enhance the moisture resistance capability of the semiconductor packages. | 10-25-2012 |
Patent application number | Description | Published |
20120106068 | PORTABLE ELECTRONIC DEVICE - A portable electronic device capable of signal or power transmission and standing on a surface in a vertical or near-vertical orientation at the same time is provided in the present invention. The portable electronic device includes a flat body having a front surface, a rear surface opposite to the front surface, and a through hole passing through the flat body, and the through hole extending from the front surface to the rear surface. Herein the through hole is adapted to couple with an external docking element for signal or power transmission. Thus, the portable electronic device is capable of signal or power transmission and standing on the supporting surface at the same time via the external docking element coupling with the through hole. | 05-03-2012 |
20120188693 | ELECTRONIC DEVICE - An electronic device is provided, which includes a display, a housing and a supporting structure. The display is disposed in the housing and a side of the housing opposite to the display has a storeroom. The supporting structure is disposed at the storeroom and has a flexible sheet, a first supporting-part and a second supporting-part. | 07-26-2012 |
20120188697 | DOCKING STATION AND ELECTRONIC APPARATUS USING THE SAME - An electronic apparatus including a portable device and a docking station is provided. The portable device has a display surface and a first restricting element. The docking station includes a base and a frame. The base has a supporting surface, wherein the portable device is adapted to be placed on the supporting surface. The frame is disposed around the base and has a second restricting element, wherein the frame is adapted to slide related to the base to drive the second restricting element to be aligned to the first restricting element of the portable device placed on the supporting surface, such that the portable device is fixed to the base by means of a magnetic attraction force between the first restricting element and the second restricting element. | 07-26-2012 |
20120188700 | DOCKING STATION AND ELECTRONIC APPARATUS USING THE SAME - An electronic apparatus including a portable device and a docking station is provided. The portable device has a display surface and the first restricting element. The docking station includes a base having a supporting surface and the second restricting element disposed on the supporting surface. The first restricting element is latched to the second restricting element when the portable device is attached to the supporting surface. Besides, the portable device is adapted to stand on the base by restricting the relative position of the portable device and the second restricting element. | 07-26-2012 |
20120188701 | DOCKING STATION AND ELECTRONIC APPARATUS USING THE SAME - A docking station, an electronic apparatus and a portable device are provided. The electronic apparatus comprises a portable device having a display surface and a docking station having a base and a connecting module. The base has a supporting surface. The portable device is adapted to be attached to the supporting surface. The connecting module has a first pivot and a second pivot. The first pivot is connected and pivoted to the base, and the second pivot is detachably pivoted to the portable device, such that the portable device is adapted to rotate relatively to the docking station. | 07-26-2012 |
20130016046 | CONTROL METHOD AND SYSTEM OF TOUCH PANELAANM Chou; Li-ChungAACI Taipei CityAACO TWAAGP Chou; Li-Chung Taipei City TWAANM Chen; Yung-HsiangAACI Taipei CityAACO TWAAGP Chen; Yung-Hsiang Taipei City TWAANM Li; Cheng-HaoAACI Taipei CityAACO TWAAGP Li; Cheng-Hao Taipei City TWAANM Tsai; LeonardAACI Taipei CityAACO TWAAGP Tsai; Leonard Taipei City TW - A control method and system of a touch panel are provided. In the present method, at least one active area on the touch panel is selected first, and the remaining area of the touch panel is defined as an inactive area of the touch panel. Then, the inactive area is disabled. Thereafter, a corresponding action is executed on an electronic device according to a touch operation performed on the at least one active area. As a result, the power consumption can be reduced by disabling the inactive area while the electronic device is controlled by the at least one active area of the touch panel. | 01-17-2013 |
20130027872 | SUPPORTING ASSEMBLY FOR ASSEMBLED DETACHABLE ELECTRONIC DEVICE AND ASSEMBLED DETACHABLE ELECTRONIC DEVICE HAVING THE SAME - An assembled detachable electronic device includes a portable device having a display interface and a docking station is provided. The portable device includes at least one first sliding portion. The docking station includes a docking station main body and a supporting assembly assembled to the docking station main body to support the portable device. The supporting assembly includes a flexible element and a sliding element. The sliding element is wrapped by the flexible element. When the sliding element is slidably disposed to the first sliding portion, the flexible element provides a supporting force to support the portable device on the docking station main body. When the sliding element slides along the first sliding portion and the flexible element is bent, the portable device rotates relative to the docking station main body. | 01-31-2013 |
20130031289 | CONNECTING STRUCTURE FOR DETACHABLE ASSEMBLED ELECTRONIC DEVICE AND DETACHABLE ASSEMBLED ELECTRONIC DEVICE HAVING THE SAME - A detachable assembled electronic device includes a portable device having a display interface and a docking station. The docking station includes a docking station main body and a connecting structure. The connecting structure is assembled to the docking station main body to support the portable device, and includes a flexible element and a first section. The first section is wrapped by the flexible element. When the first section is attached to the portable device, the first section and the flexible element are adapted to support the portable device on the docking station main body, and the portable device is adapted to rotate relative to the docking station main body by the bending of the flexible element to form an operation angle. | 01-31-2013 |
20130170124 | FOLDABLE ELECTRONIC DEVICE - A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other. | 07-04-2013 |
20130201617 | ELECTRONIC DEVICE - An electronic device including a first body, an input module and a functional element is provided. The input module is movably disposed on the first body and adapted to be moved between a first position and a second position. The functional element is disposed on the input module. When the input module is located at the first position, the functional element is concealed in the first body. When the input module is located at the second position, the functional element is exposed outside the first body. | 08-08-2013 |
20130201649 | ELECTRONIC DEVICE - An electronic device includes a base, a rotating element and a sliding element. The rotating element is pivoted to the base. The sliding element is slidably disposed on the base. When the rotating element is rotated relative to the base and an included angle between the two is greater than a specific angle, the sliding element slides from a first position to a second position relative to the base. | 08-08-2013 |
20130301201 | PORTABLE ELECTRONIC DEVICE AND CRADLE - A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body. | 11-14-2013 |
20130314859 | ELECTRONIC DEVICE - An electronic device includes first and second bodies. The second body includes a display module and a supporting assembly. The supporting assembly includes a sliding component slidably disposed on the display module and a pivot component pivoted to the first body and the sliding component. When the second body expands from the first body through the rotation of the pivot component relative to the first body, the sliding component and the pivot component are adapted to rotate relative to each other so that a bottom side of the display module moves to a predetermined position on the first body. When the bottom side is located at the predetermined position, the sliding component and the display module are adapted to slide relative to each other so that the display module rotate around the bottom side, so as to change an included angle between the display module and the first body. | 11-28-2013 |
20130314860 | ELECTRONIC DEVICE AND OPERATING METHOD THEREOF - An electronic device including a first body, an input module and a second body is provided. The first body has a positioning structure. The input module is slidably disposed on the first body and positioned at a first position by the positioning structure. The second body is pivoted with the first body. When the second body is expanded relative to the first body to obtain a first included angle between the first body and the second body, the second body drives the positioning structure to release the input module, such that the input module is capable of sliding from the first position to a second position relative to the first body and separating from the positioning structure. | 11-28-2013 |
20130321434 | ELECTRONIC APPARATUS AND METHOD FOR SWITCHING DISPLAY MODE - An electronic apparatus and a method for switching a display mode are provided. The method includes: turning on the electronic apparatus to enter a full-screen display mode; switching the full-screen display mode to a block display mode when a mode-switching signal is triggered; and enabling a corresponding operation interface in the block display mode according to an execution state of an operation system of the electronic apparatus in the full-screen display mode and displaying the operation interface in the designated block of the display unit. | 12-05-2013 |
20140049147 | ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF - An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal. | 02-20-2014 |
20140355190 | ELECTRONIC DEVICE - An electronic device including a first body and a second body is provided. The first body has a first connection end. The second body has a second connection end, in which the second connection end has a first magnetic component and a first convex arc surface, and the second body is detachably connected to the first body through a magnetic attractive force between the first magnetic component and the first connection end. The first body and the second body are configured to rotate around a rotation axis relatively to each other, and the first convex arc surface faces the first connection end and extends along a direction parallel to the rotation axis. | 12-04-2014 |