Patent application number | Description | Published |
20100007429 | PRINTED CIRCUIT BOARD - A printed circuit board includes a plurality of differential pairs arranged thereon side-by-side. Each differential pair includes two transmission lines. Each transmission line includes a plurality of sections of equal length. Every two adjacent sections in each transmission line meet at an angle, and all angles are equal. The length of each section is determined by dividing the distance between two corresponding angles of the two transmission lines of each differential pair by the cosine of half of the angle. | 01-14-2010 |
20100012363 | PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board coupling includes a first layout layer, a second layout layer, a pair of connecting portions, a first component and a second component. The first layout layer has a pair of first conducting portions which is disposed thereon to couple with a control chip. The second layout layer has a pair of second conducting portions, third conducting portions, and fourth conducting portions all of which are sequentially disposed thereon. The connecting portions are coupled with the first conducting portions and the third conducting portions. In a first coupling mode, an electronic device is coupled with the second conducting portions, and first and second components are coupled with the third and fourth conducting portions. In a second coupling mode, the electronic device is coupled with the fourth conducting portions, and the first and the second components are coupled with the second and third conducting portions. | 01-21-2010 |
20100269080 | COMPUTER-AIDED DESIGN SYSTEM AND METHOD FOR SIMULATING PCB SPECIFICATIONS - A computer-aided design system and method are provided. The computer-aided design method reads PCB design data from a storage system, obtains a plurality of circuit signals from the PCB design data, and groups the differential signals into a plurality of differential signal pairs. The computer-aided design method further sets a signal design standard for each of the differential signal pairs according to the electrical characteristics of the differential signal pair, and compiles each of the signal design standards into an instruction set. In addition, the computer-aided design method generates a PCB design specification by integrating each of the instruction sets and the PCB design data, and stores the PCB design specification into the storage system. | 10-21-2010 |
20100277198 | SYSTEM AND METHOD FOR TESTING A CHARACTERISTIC IMPEDANCE OF AN ELECTRONIC COMPONENT - A method for testing a characteristic impedance of an electronic component includes sending a positioning command to a control computer through a switch, so as to drive a probe holder of a mechanical arm to position probes of a time domain reflectometer (TDR) on a position of the electronic component. The method further receives measured data collected by the TDR, and compares the measured data with preset standard values to determine if the measured data is acceptable. | 11-04-2010 |
20100307806 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a power layer. A differential pair with two transmission lines is set on the signal layer. A cross-trench portion is formed in the power layer. A first width of each transmission line which is not located above the cross-trench portion is less than a second width of the transmission line which is located above the cross-trench portion. A first distance between the two transmission lines which are not located above the cross-trench portion is greater than a second distance between the two transmission lines which are located above the cross-trench portion. | 12-09-2010 |
20100332169 | SYSTEM AND METHOD FOR TESTING A CHARACTERISTIC IMPEDANCE OF A SIGNAL PATH ROUTING OF A PRINTED CIRCUIT BOARD - A method for testing a characteristic impedance of a signal path routing of a printed circuit board (PCB) controls the test device to test a characteristic impedance of the signal path routing of the PCB to get test data of the signal path routing of the PCB. The method further analyzes the test data of the signal path routing of the PCB get analysis results, generate a test report for storing the test data of each signal path routing of the PCB and the analysis results if all signal path routings of the PCB have been tested. | 12-30-2010 |
20110025355 | APPARATUS FOR ADJUSTING DIFFERENTIAL PROBE - An apparatus for adjusting a differential probe includes a regulator arranged therein capable of adjusting a distance between two tips of the probe. The probe is supported on the apparatus. The apparatus includes a rotatable shaft and a rotatable disk. The rotatable shaft engages with the regulator of the probe. The rotatable disk is mounted surrounding the rotatable shaft and rotatable together with the rotatable shaft. An angular ruler or a radian ruler is described on an outer surface of the rotatable disk to indicate a rotation angle or a rotation radian of the rotatable shaft, therefore the distance between the two tips of the probe are accurately adjusted. | 02-03-2011 |
20110035178 | SYSTEM AND METHOD FOR GENERATING A TEST FILE OF A PRINTED CIRCUIT BOARD - A system and method generates a test file of a print circuit board (PCB). The system and method loads trace information of the PCB into a storage system of a test computer, searches the storage system for the trace information matching keywords received and selects traces to test from the searched results. The system and method further acquires length and test points of each selected trace, and sets test parameters of each test item. In addition, the system and method generates a test file of the PCB according to the test parameters, the length, and the test points of each selected trace. | 02-10-2011 |
20110035713 | CIRCUIT BOARD DESIGN SYSTEM AND METHOD - A method and system for designing a circuit board designs wiring of the circuit board, and determines electronic rules and physical rules of the wiring design. The method and system creates a board file by designating a file name, outputs the electronic rules into the board file, and outputs the physical rules into the board file according to a preset output format. The method and system further generates a circuit diagram according to preset initial parameters, and applies the electronic rules and the physical rules to the circuit diagram according to the board file. | 02-10-2011 |
20110043302 | RADIO FREQUENCY FILTER AND FILTERING UNIT THEREOF - Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions moving to two slots of an insulation portion, to detach the filter. | 02-24-2011 |
20110047524 | SYSTEM AND METHOD FOR INSPECTING LAYOUT OF A PRINTED CIRCUIT BOARD - A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard. | 02-24-2011 |
20110050361 | RADIO FREQUENCY FILTER - Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions move to two slots of a resisting portion, to detach the filter. | 03-03-2011 |
20110050362 | RADIO FREQUENCY FILTER AND FILTERING UNIT THEREOF - Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, thickness of a dielectric layer, and thickness of an insulation tube can be changed. When any component needs to be replaced, each cover is rotated, with connection partitions move to two slots of an insulation portion, to detach the filter. | 03-03-2011 |
20110094334 | REVERSING TRANSMISSION - The REVERSING TRANSMISSION includes a shaft, a retainer, a spacing collar, a plurality of reversing members, two gears and two covers. The holder is sleeved on the shaft with spaced sliding notches formed thereon. The spacing collar is mounted on an outer surface of the retainer. The reversing members each includes two spaced swing plates with two reversed spiral teeth dented on two diagonal half surfaces of the two spaced swing plate. The reversing members slide into the sliding notches of the holder with two swing plates distributed at different side of the spacing collar. Each of the gears has a group of spiral teeth formed on the inner side for engaging with the group of spiral teeth of the reversing members, and cogs formed on the outer circumference surface. The covers are mounted on two opposite ends of the holder to keep the reversing member in position. | 04-28-2011 |
20110102103 | RADIO FREQUENCY FILTER - Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, and thickness of each of dielectric layers can be changed. When any component needs to be replaced, the filter can be detached as needed. | 05-05-2011 |
20110106481 | SYSTEM AND METHOD FOR CHECKING GROUND VIAS OF A CONTROLLER CHIP OF A PRINTED CIRCUIT BOARD - A system and method for checking a ground via of control chips of a printed circuit board (PCB) provides a graphical user interface (GUI) displaying a layout of the PCB. The control chip has a plurality of ground pins. The computer searches for signal path routing of each ground pin and ground vias along each signal path routing of each ground pin. If there are any ground vias having the same absolute coordinates, the computer determines that the ground vias are shared by more than one ground pin. | 05-05-2011 |
20110114379 | PRINTED CIRCUIT BOARD - A printed circuit board can support different connectors by selectively setting connection components on the printed circuit board without changing wiring of transmission lines or making new vias in the printed circuit board. | 05-19-2011 |
20110140332 | TESTING APPARATUS - A testing apparatus is for testing products on an assembly line and includes a worktable, a positioning device, and a testing member. The worktable includes a number of wheels pivotably attached to a bottom thereof, and a number of retractable feet attached to the bottom thereof. The positioning device is attached to the worktable and includes a number of clamping members to position a product to be test. The testing member is attached to the worktable and operated by a control box to move a robot arm with a testing head to test the product. | 06-16-2011 |
20110161026 | SYSTEM AND METHOD FOR MEASURING PIN VOLTAGES OF ELECTRONIC COMPONENTS - A system and method uses a measurement control device and a measurement machine to measure pin voltages of electronic components installed in an electronic device. The measurement control device controls a mechanical arm of the measurement machine to move to the pins of the electronic components according to coordinates of the pins. A voltage probe installed on the end of the mechanical arm can measure voltages of the pins automatically. | 06-30-2011 |
20110168437 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment. | 07-14-2011 |
20110192246 | ROBOT ARM - A robot arm includes a circular rack, an elongated first mounting member attached to the rack, and a second mounting member attached to the first mounting member. The first mounting member extends in a radius direction of the rack and moves in a circular trace along the rack. The second mounting member slides relative to the first mounting member along the radius direction, thereby defining a polar coordinate system in a plane defined by the rack to allow the second mounting member to flexibly locate at any desired positions in the plane. | 08-11-2011 |
20110235956 | BEARING - A bearing includes a main body, a plurality of first magnetic members, a plurality of second magnetic members, and a plurality of friction members. The main body defines a pivot hole, and a plurality of first receiving portions and a plurality of second receiving portions around the pivot hole. Each of the second receiving portions defines a cutout. The first magnetic members are received in the first receiving portions. The second magnetic members together with the friction members are received in the second receiving portions, thus generating a repelling force between the first magnetic members and the second magnetic members to impel the friction members to partially extend out of the cutouts. | 09-29-2011 |
20110271025 | COMPUTER MOTHERBOARD - A computer motherboard includes a printed circuit board which includes a central processing unit (CPU) socket and a group of memory slots. The group of memory slots includes an in-line type memory slot and a surface mounted device (SMD) type memory slot. The in-line type memory slot includes a number of plated through holes. The SMD type memory slot is set between the in-line type memory slot and the CPU socket. The through holes of the in-line type memory slot are connected to the CPU socket through traces, pads of the SMD type memory slot are connected to corresponding through holes of the in-line type memory slot having the same pin definition. | 11-03-2011 |
20110284279 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer, a dielectric layer, and a reference layer. The signal layer includes a pair of differential signal lines. The dielectric layer is sandwiched between the signal layer and the reference layer. A first void is defined in the reference layer between projections of the pair of differential signal lines. Two second voids are defined in the reference layer at opposite sides of the projections of the pair of differential signal lines. | 11-24-2011 |
20120016620 | SYSTEM AND METHOD FOR TESTING AN OBJECT USING A MECHANICAL ARM - A system and method for testing objects using a mechanical arm includes establishing coordinate system based on a work area of the mechanical arm, and obtaining test parameters from a storage system. The method further includes controlling the mechanical arm to get an object and position the object to the position of a test platform according to the test parameters, controlling the mechanical arm to get test tool from a tool shelf and position the test tool to a position of test point on the object to test the object according to the test parameters. The method also includes controlling the mechanical arm to get the object from the test platform and position the object to the location reserved for the object according to the test parameters. | 01-19-2012 |
20120032385 | CLAMPING MECHANISM - A clamping mechanism for holding a workpiece includes an end executor, a driving member, and a contact member detachably mounted on the end executor. The end executor includes a plurality of claws arranged in matrix. The contact member includes a mounting board and a plurality of contact sleeves corresponding to the claws. The driving member is capable of driving the mounting board, moving the contact sleeves to extend the claws, and hold the workpiece. | 02-09-2012 |
20120066655 | ELECTRONIC DEVICE AND METHOD FOR INSPECTING ELECTRICAL RULES OF CIRCUIT BOARDS - An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output. | 03-15-2012 |
20120125679 | PRINTED CIRCUIT BOARD HAVING DIFFERENTIAL VIAS - A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads. | 05-24-2012 |
20120138344 | PRINTED CIRCUIT BOARD - A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line. | 06-07-2012 |
20120140426 | PRINTED CIRCUIT BOARD - A printed circuit board includes a top layer. A memory controller, a first dual-channel architecture, and a second dual-channel architecture are located on the top layer. A distance between the memory modules of the first dual-channel architecture and the memory controller is equal to a distance between the memory modules of the second dual-channel architecture and the memory controller. | 06-07-2012 |
20120145448 | PRINTED CIRCUIT BOARD WITH COMPOUND VIA - A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon. | 06-14-2012 |
20120147579 | PRINTED CIRCUIT BOARD - A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors. | 06-14-2012 |
20120152602 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a top layer, a memory controller, a gap, and a connector. The memory controller is located on the top layer. A number of first golden fingers are set on the top layer near the gap and electrically connected to the memory controller. A connector includes a first slot to hold the first golden fingers and a second slot to hold a number of second golden fingers of a memory chip. The first slot is electrically connected to the second slot. The memory chip and the PCB are coplanar. | 06-21-2012 |
20120152607 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers. First and second pairs of signal transmission lines are respectively laid out on the first and second signal layers. The first pair of signal transmission lines includes first positive and negative differential signal transmission lines. The second pair of signal transmission lines includes second positive and negative differential signal transmission lines. The first positive differential signal transmission line is electrically connected to the second negative differential signal transmission line by a first vertical interconnect access (via). The first negative differential signal transmission line is electrically connected to the second positive differential signal transmission line by a second via. An angle between a centerline of each of the first via and second via and a surface of the PCB is an acute angle. | 06-21-2012 |
20120154075 | PRINTED CIRCUIT BOARD - A printed circuit board includes a base, a signal layer lying on the base, and a number of pairs of differential signal traces positioned on the signal layer. The base is made of a grid of glass fiber bundles filled with epoxy resin. Each pair of differential signal traces includes a first signal trace and a second signal trace. Each of the first and second signal traces extends in a zigzag pattern. The first signal trace includes a number of wave crests and wave troughs. The wave crests define a reference straight line that connects all the wave crest of the first signal trace. The ratio of the distance from each wave crest to the reference straight line to the orthogonal distance between each wave crest and an adjacent wave trough along the reference straight line is 1:5. | 06-21-2012 |
20120155046 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a top layer, a memory controller, two gaps, and two connectors. The memory controller is located on the top layer. A number of golden fingers are respectively set on the top layer near each gap and electrically connected to the memory controller. Each connector includes a first slot to hold the gold fingers near a corresponding one of the gaps and a second slot to hold a number of gold fingers of a corresponding one of two memory chips. The first slot is electrically connected to the second slot. Each memory chip and the PCB are coplanar. | 06-21-2012 |
20120174054 | PRINTED CIRCUIT BOARD LAYOUT SYSTEM AND METHOD - A computing system includes a drawing unit and a layout unit. The computing system sets components parameters to components of a circuit diagram of a printed circuit board (PCB). The drawing unit draws the circuit diagram by using the components with the components parameters. If the drawing unit wants to use a component more than once, the computing system copies the component and the corresponding components parameters. The drawing unit uses the copied components and the corresponding parameters. If the circuit diagram has been drawn, the layout unit loads the circuit diagram and wires the PCB according to the components and the components parameters in the circuit diagram. | 07-05-2012 |
20120188737 | MOTHERBOARD AND MEMORY CONNECTOR THEREOF - A motherboard includes a printed circuit board (PCB) and a memory connector. The PCB includes top and bottom layers. A number of pads are set on the sides of the top and bottom layers and connected to a memory controller. A number of metal pins are set on a first sidewall of the memory connector. A socket slot is defined in a second sidewall opposite to the first sidewall. Top and bottom sidewalls bounding the socket slot define a number of grooves. First ends of the metal pins are soldered on the pads of the top layer and the bottom layer of the PCB. Second ends of the metal pins are extended to the socket slot through the memory connector and exposed through the grooves of the memory connector, to be electrically connected to the golden fingers of a memory when the memory is inserted in the socket slot. | 07-26-2012 |
20120190219 | MOTHERBOARD AND MEMORY CONNECTOR THEREOF - A motherboard includes a printed circuit board (PCB) and a memory connector. A number of golden fingers are set on corresponding sides of a top layer and a bottom layer of the PCB and connected to a memory controller. First and second socket slots are defined in two opposite sides of the memory connector. A number of grooves are defined in top and bottom sidewalls bounding the first and the second socket slots. A number of metal pins are exposed through the grooves of the first socket slot for connection to the golden fingers of the PCB. The metal pins are extended to the second socket slot to be exposed through the grooves of the second socket opening for connection to the golden fingers of a memory. | 07-26-2012 |
20120229993 | ANTISTATIC CIRCUIT BOARD AND ELECTRICAL DEVICE USING SAME - An exemplary antistatic circuit board includes a first outer layer, a second outer layer, a first ground layer, and a second ground layer. The first ground layer and the second ground layer are positioned between the first outer layer and the second outer layer. The first ground layer is adjacent to the first outer layer and the second ground layer is adjacent to the second outer layer. The antistatic circuit board defines two position holes each penetrating through the first ground layer and the second ground layer. Two circuit grounds are wired on the first ground layer and the second ground layer, respectively. The second ground layer further includes a chassis ground. Each of the position holes also penetrates through the chassis ground. | 09-13-2012 |
20120229997 | PRINTED CIRCUIT BOARD - A printed circuit board includes first and second transmission lines connected to a first high speed differential signal control chip, third and fourth transmission lines connected to a second high speed differential signal control chip, and fifth and sixth transmission lines connected to a connector pad. To have the first high speed differential signal control chip communicate with the connector pad, the first transmission line is connected to the fifth transmission line through a first connection component, and the second transmission line is connected to the sixth transmission line through a second connection component. To have the second speed differential signal control chip communicate with the connector pad, the third transmission line is connected to the fifth transmission line through the first connection component, and the fourth transmission line is connected to the sixth transmission line through the second connection component. | 09-13-2012 |
20120268283 | CIRCUIT BOARD HAVING CURRENT BALANCE FUNCTION - A circuit board includes a current balancing unit that receives a number of current values from ammeters. A minimum current value between the current values is determined by the current balancing unit. Resistance of one or more variable resistors of the current balancing unit is adjusted by the current balancing unit to make the current value from one or more the ammeters serially connected to the one or more the variable resistors to be substantially equal to the minimum current value. | 10-25-2012 |
20120273258 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire. | 11-01-2012 |
20120304145 | ELECTRONIC DEVICE AND WIRING METHOD FOR CIRCUIT BOARDS - An electronic device includes a wiring unit. The wiring unit creates one or more circuit diagrams for a design of a first circuit board, and setting electrical rules for components of the first circuit board in each of the one or more diagrams. Based on the one or more diagrams having the electrical rules, the wiring unit generates a wiring diagram for the design of the first circuit board by executing a wiring application. If a second circuit board desires to use a circuit diagram of the first circuit board, the wiring unit copies the circuit diagram having the electrical rules into the wiring application. Then, based on the copied circuit diagram having the electrical rules and particular circuit diagrams of the second circuit board, and the wiring unit creates a wiring diagram for the design of the second circuit board by executing the wiring application. | 11-29-2012 |
20120320518 | SERIAL ADVANCED TECHNOLOGY ATTACHMENT DIMM - A serial advanced technology attachment (SATA) DIMM includes a board body. A control chip is arranged on the board body. An extending board extends from an end of the board body. A first edge connector is set on the extending board. A second edge connector is set on a bottom side of the board body. The first edge connector includes a number of signal pins connected to the control chip, and a number of ground pins. | 12-20-2012 |
20120327623 | PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A printed circuit board includes first and second layout layers, first and second components, and a pair of connecting portions. The first layout layer includes a pair of first conducting portions connected to a control chip. The second layout layer includes pairs of second to fourth conducting portions. The connecting portions connect the first and third conducting portions together. When an electronic device is connected to the second conducting portions, and the first and second components are connected to the third and fourth conducting portions to form a first route, signals generated by the control chip are transmitted to the electronic device through the first route. When the electronic device is connected to the fourth conducting portions, and the first and second components are connected to the second and third conducting portions to form a second route, the signals are transmitted to the electronic device through the second route. | 12-27-2012 |
20130016466 | MOTHERBOARD CAPABLE OF REDUCING ELECTROMAGNETIC INTERFERENCEAANM YEN; SHIN-TINGAACI Tu-ChengAACO TWAAGP YEN; SHIN-TING Tu-Cheng TWAANM CHEN; YUNG-CHIEHAACI Tu-ChengAACO TWAAGP CHEN; YUNG-CHIEH Tu-Cheng TWAANM HO; DUEN-YIAACI Tu-ChengAACO TWAAGP HO; DUEN-YI Tu-Cheng TW - A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads. | 01-17-2013 |
20130039025 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors. | 02-14-2013 |
20130054865 | MOUSE - A mouse includes a universal serial bus (USB) 3.0 port, a mouse control circuit, and a memory card port for connecting a memory card. The USB 3.0 port transmits data of the mouse from the mouse control circuit through a first to a fourth pins of the USB 3.0 port, and transmits data of the memory card through the first and a fifth to ninth pins of the USB 3.0 port. | 02-28-2013 |
20130067254 | HOST COMPUTER AND METHOD FOR TRANSMITTING DATA BETWEEN HOST COMPUTER AND SLAVE DEVICE - In a method for transmitting data between a host computer and a slave device, the host computer connects to a slave device through a data communication port. The slave device is equipped with a power supply that includes at least one capacitor. The power supply is charged through the host computer using the capacitor when the host computer is powered on. The method controls the host computer sends data to the slave device, and controls the capacitor to discharge to provide power to the slave device for a period of time when the host computer is powered off, and stores the data packet into the slave device during the period of time. The method further retrieves the data from the storage device when the host computer is powered on, and resends the data to the slave device through the data communication port. | 03-14-2013 |
20130070410 | SERIAL ADVANCED TECHNOLOGY ATTACHMENT DUAL IN-LINE MEMORY MODULE AND COMPUTER SYSTEM - A computer system includes a motherboard with first and second storage device interfaces and first to third memory slots, and first to third serial advanced technology attachment dual-in-line memory modules (SATA DIMMs). First and second extending boards are extended from two opposite ends of each SATA DIMM, arranged with first and second edge connectors, respectively. The first edge connector of the first SATA DIMM is connected to the first storage device interface. The second edge connector of the first SATA DIMM is connected to the first edge connector of the second SATA DIMM. The second edge connector of the second SATA DIMM is connected to the first edge connector of the third SATA DIMM. The second edge connector of the third SATA DIMM is connected to the second storage device interface. | 03-21-2013 |