| Patent application number | Description | Published |
|---|
| 20140306246 | LIGHT SOURCE MODULE - A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances. | 10-16-2014 |
| 20150036128 | INSPECTION APPARATUS - An inspection apparatus is capable of inspecting a light-emitting diode (LED). The inspection apparatus includes a reflecting cover, a base plate, a light-collecting unit and at least one inspection light source. An enclosed space is defined by the base plate and the reflecting cover having an opening. The LED is disposed on the base plate and located in the enclosed space. The light-collecting unit is disposed above the LED and in the enclosed space. A vertical distance from the light-collecting unit to the LED is H, a width of the opening of the reflecting cover is W, and H/W=0.05 to 10. The inspection light source is in the enclosed space. An inspection light emitted from the inspection light source is reflected by the reflecting cover and then emitted into the LED. | 02-05-2015 |
| 20150036129 | INSPECTION APPARATUS - An inspection apparatus is capable for inspecting at least one light-emitting device. The inspection apparatus includes a working machine and an inspection light source. The inspection light source is disposed on the working machine and located above the light-emitting device. A dominant wavelength of the inspection light source is smaller than a dominant wavelength of the light-emitting device so as to excite the light-emitting device and get an optical property of the light-emitting device. | 02-05-2015 |
| 20150097206 | METHOD OF MANUFACTURING PACKAGE COMPONENT FOR LIGHT EMITTING DIODE AND PACKAGE STRUCTURE THEREOF - A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold. | 04-09-2015 |
| 20150102379 | LIGHT EMITTING DIODE STRUCTURE - A light emitting diode structure includes a substrate and a light emitting unit. The substrate has a protrusion portion and a light guiding portion. The protrusion portion and the light guiding portion have a seamless connection therebetween, and a horizontal projection area of the protrusion portion is smaller than that of the light guiding portion. The light emitting unit is disposed on the protrusion portion of the substrate. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding portion from the protrusion portion and emits from an upper surface of the light guiding portion uncovered by the protrusion portion. | 04-16-2015 |
| 20160043062 | LIGHT SOURCE DEVICE - A light source device including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. Each of the first LED chips includes a first chip substrate, a first semiconductor layer, and a plurality of first electrodes, and the first electrodes are disposed on the upper surface of the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. The second LED chip includes a second chip substrate, a second semiconductor layer, and a plurality of second electrodes. A thickness of the second chip substrate is different from than a thickness of the first chip substrate, and the second electrodes are disposed on the upper surface of the substrate. | 02-11-2016 |
| 20160043281 | METHOD OF FABRICATING A LIGHT EMITTING DIODE DEVICE - The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well. | 02-11-2016 |
| 20160049555 | LIGHT EMITTING DIODE DEVICE - The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well. | 02-18-2016 |
