Yun Hee Cho
Yun Hee Cho, Gyunggi-Do KR
Patent application number | Description | Published |
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20110061910 | MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit. | 03-17-2011 |
20130176685 | MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME - There is provided a multi-layer ceramic circuit board. The multi-layer ceramic circuit board according to an aspect of the invention may include: a ceramic body having a plurality of ceramic green sheets stacked upon one another and an interlayer circuit having conductive vias and conductive patterns separately provided in the plurality of ceramic green sheets; a bump receiving portion provided in at least one surface ceramic green sheet adjacent to a surface of the plurality of ceramic green sheets, and having side walls inclined upward; and a bonding pad provided on the inclined side walls and a bottom surface of the bump receiving portion, and connected to the interlayer circuit. | 07-11-2013 |
Yun Hee Cho, Hwaseong KR
Patent application number | Description | Published |
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20100053908 | Electric device module - There is provided an electric device module including: a housing; a board member fixed to one inner side of the housing and including a plurality of connecting terminals; at least one board adhered to another inner side of the housing by a predetermined adhesive and including a plurality of terminals electrically connected to the plurality of connecting terminals; and a guider guiding a mounting position of the board. In the electric device module, a circuit board is prevented from changing in adhering position due to fluidity of an adhesive but can be adhered at a precise position. Also, an extra amount of the adhesive is prevented from flowing outside the circuit board to thereby enhance accuracy and reliability in terms of terminal connection. | 03-04-2010 |
20100102430 | SEMICONDUCTOR MULTI-CHIP PACKAGE - A semiconductor multichip package includes a substrate having a top surface on which a bonding pad is formed, and a bottom surface opposing the top surface, on which an external connection terminal electrically connected with the bonding pad is formed, a first semiconductor chip mounted on a region of the top surface of the substrate excluding the bonding pad, a ceramic spacer disposed on a top surface of the first semiconductor chip and including a passive device therein, and at least one second semiconductor chip disposed on a top surface of the ceramic spacer. The ceramic spacer includes an interlayer circuit for an electrical connection between the first and second semiconductor chips, and the passive device is electrically connected to at least one of the first and second semiconductor chips. Accordingly, a package with a more compact structure can be realized. | 04-29-2010 |
20110063174 | PATCH ANTENNA AND WIRELESS COMMUNICATIONS MODULE - There is provided a patch antenna. The patch antenna includes a high dielectric constant substrate having a cavity, a radiator disposed on a portion of one surface of the high dielectric constant substrate corresponding to the cavity, a feeder line disposed on the high dielectric constant substrate and supplying a signal to the radiator, and a ground part disposed on the high dielectric constant substrate. | 03-17-2011 |
Yun Hee Cho, Daejeon KR
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20090147747 | APPARATUS FOR SCHEDULING TRANSMISSION OF DATA UNIT IN BASE STATION - The present invention relates to a scheduling apparatus of a base station supporting Automatic Repeat reQuest (ARQ) method. In particular, the present invention discloses scheduling a data unit transmitted to a mobile station from a base station providing ARQ method for correcting an error in wireless data communication and generating a high rate frame. | 06-11-2009 |
20100273467 | METHOD FOR PROVIDING OF CALL TRANSFERRING SERVICE AND MOBILE TERMINAL USING THE SAME - A method of providing a call transfer service and a mobile terminal using the same are provided. When a call connection request signal transmitted to a mobile communication server through a PSTN is received, any one of previously stored phone numbers is selected and a service of transferring a call to the selected phone number according to the received call connection request signal is requested. Therefore, when call connection is requested, it is selected whether a call is to be transferred, when a call is transferred, a phone number to transfer a call can be dynamically selected according to a user situation, and thus user convenience according to call transfer can be improved. | 10-28-2010 |
Yun Hee Cho, Suwon KR
Patent application number | Description | Published |
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20080238553 | POWER AMPLIFYING DEVICE HAVING LINEARIZER - There is provided a power amplifying device having a linearizer in which a bias circuit has an initial impedance set when initially operated, then the impedance is varied according to a level of an input signal and the input signal is amplified in a broad range from a low level region to a high level region, thereby improving linearity of an output signal. The power amplifying device including: an amplifying unit receiving a bias power source and amplifying an input signal; a bias unit varying the bias power source according to a set impedance to provide to the amplifying unit; and an impedance setting unit setting the impedance of the bias unit in response to a preset control voltage when the bias unit is initially operated and re-setting the impedance of the bias unit according to a level of the input signal of the amplifying unit after initial operation of the bias unit. | 10-02-2008 |
20090184779 | WIRELESS COMMUNICATION MODULE - A wireless communication module includes a laminated substrate where a plurality of dielectric sheets are laminated, a band pass filter, a balun circuit, and first and second matching circuits. The band pass filter is formed in the laminated substrate. The balun circuit is formed in the laminated substrate, and includes an unbalanced element having one end connected to the band pass filter. The first and second matching circuits are formed in the laminated substrate, and each of them is connected to one end of each of balanced elements of the balun circuit. Herein, at least one of the band pass filter, the balun circuit, the first matching circuit, and the second matching circuit is formed between the dielectric sheets of the laminated substrate using a distributed element. | 07-23-2009 |