Patent application number | Description | Published |
20120292487 | POSITIVE RESIST COMPOSITION AND METHOD FOR PRODUCING MICROLENS - There is provided a resist composition suitable for forming a microlens which is excellent in transparency, heat resistance, and sensitivity characteristics, excellent in solubility in a developer, and as the result thereof has high resolution. A positive resist composition comprising; a component (A): an alkali-soluble polymer; a component (B): a compound having an organic group to be photolyzed to generate an alkali-soluble group; a component (C): a crosslinkable compound of Formula (1): | 11-22-2012 |
20120295199 | LONG-CHAIN ALKYLENE-CONTAINING CURABLE EPOXY RESIN COMPOSITION - A curable composition that maintains good handleability in the liquid form and that can be photo- or heat-cured to form a cured product having physical properties including both high transparency and high flexural strength. A curable composition includes, an epoxy compound of (1): | 11-22-2012 |
20130172522 | EPOXY COMPOUND WITH NITROGEN-CONTAINING RING - There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof. An epoxy compound of Formula (1): | 07-04-2013 |
20130172525 | METHOD FOR PRODUCING EPOXY COMPOUND HAVING CYANURIC ACID SKELETON - There is provided an epoxy compound that provides properties of cured products combining high transparency with high flexural strength by being thermally cured while maintaining advantageous handling properties in a liquid state thereof; and a method for producing a composition by using the epoxy compound. A method for producing an epoxy compound of Formula (1): | 07-04-2013 |
20130177849 | EPOXY RESIN COMPOSITION HAVING MONOCYCLIC ALIPHATIC HYDROCARBON RING - There is provided a curable composition having a low viscosity and high cationic curability. A curable composition including an epoxy compound of Formula (1): | 07-11-2013 |
20130274433 | POLYFUNCTIONAL EPOXY COMPOUND - There is provided an epoxy resin composition having low viscosity and a high cationic curing property. An epoxy compound of Formula (1): | 10-17-2013 |
20140235746 | PHOTO-CURABLE RESIN COMPOSITION - There is provided a curable resin composition that exhibits high adhesive properties to materials such as glass, copper, aluminum, PET, and PC, which have been regarded as poor adherends relative to photo-curable compositions, and high adhesive properties also between adherends different from each other. A curable resin composition including a polyene compound of Formula (1): | 08-21-2014 |