Patent application number | Description | Published |
20090039261 | Pattern Inspection Method and Pattern Inspection System - A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern. From two or more backscattered electron images formed by detecting backscattered electrons at two or more different spatial positions, pattern contour data contained in the backscattered electron images may be obtained. | 02-12-2009 |
20090105990 | METHOD FOR ANALYZING DEFECT DATA AND INSPECTION APPARATUS AND REVIEW SYSTEM - The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process. | 04-23-2009 |
20100195896 | METHOD AND APPARATUS FOR DETECTING PATTERN DEFECTS - With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects. | 08-05-2010 |
20100310180 | Pattern Inspection Method and Pattern Inspection System - A pattern data examination method and system capable of accurately and speedily examining a circuit pattern without failing to extract pattern contour data are provided. While pattern comparison is ordinarily made by using a secondary electron image, a contour of a pattern element is extracted by using a backscattered electron image said to be suitable for observation and examination of a three dimensional configuration of a pattern element, and pattern inspection is executed by using the extracted contour of the pattern element. More specifically, pattern inspection is executed by comparing a contour of a pattern element with design data such as CAD data to measure a difference between the contour and the data, and by computing, for example, the size of the circuit pattern element from the contour of a pattern. From two or more backscattered electron images formed by detecting backscattered electrons at two or more different spatial positions, pattern contour data contained in the backscattered electron images may be obtained. | 12-09-2010 |
20110013825 | Method and Apparatus for Analyzing Defect Data and a Review System - In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects. | 01-20-2011 |
20110164809 | Method And Apparatus For Detecting Pattern Defects - With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects. | 07-07-2011 |
20120093392 | REVIEWED DEFECT SELECTION PROCESSING METHOD, DEFECT REVIEW METHOD, REVIEWED DEFECT SELECTION PROCESSING TOOL, AND DEFECT REVIEW TOOL - The present invention relates to semiconductor inspection and provides a technology capable of efficiently detecting a systematic defect. In the present system, with regard to the process (S | 04-19-2012 |
20120131529 | SEMICONDUCTOR DEFECT CLASSIFYING METHOD, SEMICONDUCTOR DEFECT CLASSIFYING APPARATUS, AND SEMICONDUCTOR DEFECT CLASSIFYING PROGRAM - A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified. | 05-24-2012 |
20120257041 | METHOD FOR DEFECT INSPECTION AND APPARATUS FOR DEFECT INSPECTION - Provided is a technique for a wafer inspection conducted by simple operation, which is useful even when the inspection covers a variety of items and the inspection items are changed frequently with time like in a start-up period of a semi-conductor process. According to the technique, inspection images are collected, and then a template is prepared from the inspection images. A plurality of regions are defined on the template, and inspection methods and output indexes are registered in correspondence with the respective regions. In the inspection, by reference to the template images corresponding to the derived inspection images, the inspection is conducted based on the inspection information registered therein and the quantitative output levels are calculated. | 10-11-2012 |
20130070078 | METHOD AND DEVICE FOR TESTING DEFECT USING SEM - In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large. | 03-21-2013 |
20130120551 | Pattern Dimension Measurement Method, Pattern Dimension Measurement Device, Program for Causing Computer to Execute Pattern Dimension Measurement Method, and Recording Medium Having Same Recorded Thereon - A technique for calculating the angle from an auxiliary dot sequence indicating the track of a pattern and for performing pattern measurement is provided, thereby enabling achievement of high-accuracy pattern measurement with reduced influence of the roughness of pattern edges. | 05-16-2013 |
20130191807 | METHOD OF EVALUATING SYSTEMATIC DEFECT, AND APPARATUS THEREFOR - In order to enable an evaluation of systematic defects, a method of evaluating systematic defects was configured so as to sample a circuit pattern of a specific layer of a semiconductor device, evaluate the state of superimposition between the sampled circuit pattern and circuit patterns of layers other than the specific layer, using design data, classify the state of superimposition, calculate the ratio thereof as a reference ratio, evaluate the state of superimposition between a pattern in design data corresponding to a defect of the specific layer detected by another inspection apparatus and patterns at positions corresponding to the defects in layers other than the specific layer, classify the evaluated state of superimposition, calculate the ratio of the classification as inspection-result ratio, compare the calculated reference ratio and the calculated inspection-result ratio, and evaluate systematic defects by the comparison between the calculated reference ratio and the calculated inspection-result ratio. | 07-25-2013 |
Patent application number | Description | Published |
20080310292 | OPTICAL DISK, OPTICAL DISK RECORDING AND REPRODUCING APPARATUS, METHOD FOR RECORDING, REPRODUCING AND DELETING DATA ON OPTICAL DISK, AND INFORMATION PROCESSING SYSTEM - A recording type optical disk on which data is recordable includes a data recording and reproducing area for recording data therein and reproducing data therefrom, and a read-only disk identification information area for recording disk identification information for identifying the optical disk therein. In the optical disk, the disk identification information is formed by removing a reflection film that is formed on the optical disk in a strip shape. The disk identification information includes an inherent disk identifier for each optical disk, and the data recording and reproducing area includes an area for recording encrypted data therein. The encrypted data is encrypted by using information including the disk identification information for identifying the optical disk as a key. | 12-18-2008 |
20090034383 | DISK-SHAPED RECORD MEDIUM AND PRODUCING METHOD FOR SAME, DISK RECORDING METHOD AND DEVICE, AND DISK PLAYBACK METHOD AND DEVICE - To record specific information to a disk-shaped record medium and reproduce the recorded specific information without any influence on the error correction capability. Copy protection information (CPID) having an error correction code appended thereto, shuffled and otherwise treated is sent as a CPID bit block to an EDC rewrite circuit ( | 02-05-2009 |
20100131821 | DATA RECORDING METHOD, RECORDING MEDIUM AND REPRODUCTION APPARATUS - A recording medium for storing a data stream is comprised of first error correcting codes obtained by encoding first information, second error correcting codes obtained by encoding second information, and synchronization signals. In the data stream, the second error correcting codes and the synchronization signals alternatively interleave the first error correcting codes. The second error correcting codes have the same number of corrections as the first error correcting codes. A code length of the second error correcting codes is shorter than a code length of the first error correcting codes. | 05-27-2010 |
20100188721 | TWO-DIMENSIONAL ENCODER, HOLOGRAPHIC MEMORY DEVICE AND HOLOGRAPHIC MEMORY MEDIUM - A two-dimensional encoder stores data on a holographic memory. The encoder encodes data of k bits (where k is an integer and k≧3) into n pixels arranged two-dimensionally (where n is an integer and n≧6). The encoder includes a first processing section | 07-29-2010 |
20110004891 | INFORMATION RECORDING DEVICE, INFORMATION REPRODUCING DEVICE, AND INFORMATION RECORDING MEDIUM - The invention provides an information recording device, an information reproducing device, and an information recording medium capable of securely protecting copyright of main information, and preventing illegal access to the recorded main information. The information recording device ( | 01-06-2011 |
20110007616 | OPTICAL DISC RECORDING APPARATUS, OPTICAL DISC RECORDING CIRCUIT AND OPTICAL DISC - An optical disc recording apparatus ( | 01-13-2011 |
20110299371 | OPTICAL DISK DEVICE, OPTICAL DISK CONTROL METHOD, AND INTEGRATED CIRCUIT - To provide an optical disk device, an optical disk control method and an integrated circuit, which are capable of writing a recordable mark by changing the reflectance ratio of a reflective film formed on concave-convex pits without using an industrial special device or a high-power laser light source. A data reproduction controller ( | 12-08-2011 |
20120082018 | OPTICAL DISC RECORDING DEVICE AND RECORDING SIGNAL GENERATING DEVICE - Provided are an optical disc recording device and a recording signal generating device which enable to correct displacement between a reproducing position of a reproduction signal from a concave-convex mark preformed in an optical disc, and a recording position of second information to be recorded in synchronism with the reproduction signal, and stably and speedily record the second information. A digital signal processor ( | 04-05-2012 |
20120096326 | OPTICAL DISK REPRODUCTION APPARATUS, OPTICAL DISK REPRODUCTION METHOD, REPRODUCTION PROCESSING DEVICE AND REPRODUCTION PROCESSING METHOD - Provided is an optical disk reproduction apparatus capable of preventing information that is different from the original sub information from being subjected to error correction erroneously, and of stably reproducing the sub information. The optical disk reproduction apparatus ( | 04-19-2012 |
20140053044 | DECODING DEVICE AND DECODING METHOD - A decoding device ( | 02-20-2014 |
20140126657 | DECODING SYSTEM AND DECODING METHOD - A decoding system includes: a modulator which modulates user data by using a modulation rule which converts the user data into a modulation pattern; a regenerator which generates a regenerative signal from a signal obtained by transmitting the user data after modulation through a transmission path; a transmission path decoder which generates signals as generation signals corresponding to the modulation pattern, and calculates k (k is a positive integer) distances between the regenerative signal and the k generation signals in an interval having a length fixedly or dynamically determined; and a demodulator which calculates reliability information for each bit of the user data, and estimates each bit of the user data based on the calculated reliability information. The demodulator calculates likelihood that each bit of the user data is 1 and each bit of the user data is 0 by Formula (A), and calculates the reliability information by Formula (B). | 05-08-2014 |
20140198629 | STORAGE DEVICE AND STORAGE METHOD - A storage device | 07-17-2014 |
20140334282 | DECODING DEVICE AND DECODING METHOD - A decoding device includes: an interference canceling circuit ( | 11-13-2014 |
Patent application number | Description | Published |
20090214102 | DEFECT INSPECTION METHOD AND APPARATUS - A method of inspecting patterns, including: adjusting a brightness of at least one of a first bright field image and a second bright field image detected from a specimen and directed to similar patterns on differing parts of the specimen, so as to more closely match a brightness; comparing the images which are adjusted in brightness to match with each other to detect dissimilarities indicative of a defect of the pattern, wherein in adjusting the brightness, the brightness between the first bright field image and the second bright field image is adjusted by performing a gradation conversion of at least one of the brightness between the first bright field image and the second bright field image; and wherein in the comparing, said defect of the pattern is detected by using information of a scattered diagram of brightness of the first bright field image and the second bright field image. | 08-27-2009 |
20110170765 | DEFECT INSPECTION METHOD AND APPARATUS - Arrangements for inspecting a specimen on which plural patterns are formed; capturing a first image of a first area; capturing a second image of a second area in which patterns which are essentially the same with the patterns formed in the first area; creating data relating to corresponding pixels of the first and second images, for each pixel; determining a threshold for each pixel for detecting defects directly in accordance with the first and second images; and detecting defects on the specimen by processing the first and second images by using the threshold for each pixel and information of a scattered diagram of brightness of the first and second images, wherein the threshold is determined by using information of brightness of a local region of at least one of the first and second images, with the local region including an aimed pixel and peripheral pixels of the aimed pixel. | 07-14-2011 |
20120128230 | DEFECT INSPECTION METHOD AND APPARATUS - An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer. | 05-24-2012 |
20130321610 | PATTERN MEASURING APPARATUS, PATTERN MEASURING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM ON WHICH A PATTERN MEASURING PROGRAM IS RECORDED - There is provided a technique to correctly select and measure a pattern to be measured even when contours of the pattern are close to each other in a sample including a plurality of patterns on a substantially same plane. | 12-05-2013 |
Patent application number | Description | Published |
20080236694 | Hose with Joint Fitting for Conveying Carbon Dioxide Refrigerant - A hose with a joint fitting for conveying a carbon dioxide refrigerant has a hose body and a joint fitting. The joint fitting is provided with an insert pipe inserted in an end portion of the hose body, and a socket fitting including a sleeve and a radially inwardly directed collar portion on an axial end of the sleeve. An axial blocking layer blocking an axial leakage path of the refrigerant is provided between an outer surface of the insert pipe and an inner surface of the hose body, and a radial blocking layer blocking a radial leakage path of the refrigerant is provided between an inner surface of the collar portion and an end surface of the hose body. | 10-02-2008 |
20080236695 | Low Gas-Permeable Hose - A low gas-permeable hose has an inner rubber layer, a reinforcing multilayer portion including a first reinforcing layer and a second reinforcing layer on an outer side of the inner rubber layer, an outer rubber layer on an outer side of the reinforcing multilayer portion, a resin layer defining an innermost layer; and a barrier layer on an inner side of the inner rubber layer and on an outer side of the resin layer. The barrier layer is a resin membrane of polyvinyl alcohol. The reinforcing multilayer portion has a cooperative reinforcing structure for ensuring the second reinforcing layer of reinforcement to the first reinforcing layer. | 10-02-2008 |
20080245434 | Composite Hose with a Corrugated Metal Tube and Method for Making the Same - A composite hose is constructed to have an outer peripheral portion and an inner peripheral portion. The outer peripheral portion includes an elastic layer and a reinforcing layer provided on an outer periphery of the elastic layer. The inner peripheral portion includes a corrugated metal tube which is provided with a corrugated portion formed with corrugation his and corrugation valleys. A distance between the reinforcing layer and tops of the corrugation hills of the corrugated metal tube is designed 0.27 mm or less. | 10-09-2008 |
20090165880 | REFRIGERANT TRANSPORTATION HOSE AND METHOD OF PRODUCING THE SAME - A refrigerant transportation hose includes an innermost layer primarily of a polyamide resin, a low-permeability layer provided on the outer periphery of the innermost layer and made of polyvinyl alcohol, and a rubber layer (including an inner rubber layer and an outer rubber layer) provided on the outer periphery of the low-permeability layer. The innermost layer is formed with a multiplicity of through holes each extending in a direction of thickness of the innermost layer. The refrigerant transportation hose is produced by: extruding a material of the inner layer in the form of a hose to form a hose element; pressing a roll with spikes mounted on the surface thereof against an outer peripheral surface of the hose element to form in the hose element the multiplicity of through holes each extending in a direction of thickness of the hose element; and forming the low-permeability layer and the rubber layer (including the inner rubber layer and the outer rubber layer) in sequential order on the outer periphery of the hose element. | 07-02-2009 |
20120240404 | Composite Hose with a Corrugated Metal Tube and Method for Making the Same - A composite hose is constructed to have an outer peripheral portion and an inner peripheral portion. The outer peripheral portion includes an elastic layer and a reinforcing layer provided on an outer periphery of the elastic layer. The inner peripheral portion includes a corrugated metal tube which is provided with a corrugated portion formed with corrugation hills and corrugation valleys. A distance between the reinforcing layer and tops of the corrugation hills of the corrugated metal tube is designed 0.27 mm or less. | 09-27-2012 |
Patent application number | Description | Published |
20140072204 | DEFECT CLASSIFICATION METHOD, AND DEFECT CLASSIFICATION SYSTEM - In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect. | 03-13-2014 |
20140198974 | SEMICONDUCTOR DEVICE DEFECT INSPECTION METHOD AND SYSTEM THEREOF - Provided are a semiconductor device defect inspection method and system thereof, with which predetermined hot spots are inspected using a SEM, and with which the frequency of defects occurring at the hot spot is estimated statistically and with reliability. An inspection point is designated in design data by the defect type. A plurality of pre-designated inspection points is selected by the defect type from the designated inspection points. The plurality of pre-designated inspection points by defect type thus selected are image captured by the inspection points. A defect ratio, which is a ratio of the plural inspection points which are image captured by the defect type to the plural defects detected, and a reliability interval of the defect ratio which is computed by the defect type is compared with a preset reference value. A defect type having a defect occurrence ratio which exceeds the reference value is derived. | 07-17-2014 |
20140331173 | GUI, CLASSIFICATION APPARATUS, CLASSIFICATION METHOD, PROGRAM, AND STORAGE MEDIUM STORING THE CLASSIFICATION PROGRAM - Provided is a GUI including: an unadded pane region that hierarchically displays folders which are sets of images having no class information added thereto; an image pane region that displays the images displayed in the unadded pane region, the displayed images having no classification added thereto; and a class pane region that displays images having classification added thereto, wherein by externally inputting class information for one image having the class information added thereto, the input class information is displayed. | 11-06-2014 |
20140375793 | METHOD FOR MEASURING OVERLAY AND MEASURING APPARATUS, SCANNING ELECTRON MICROSCOPE, AND GUI - A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step. | 12-25-2014 |