Patent application number | Description | Published |
20100065327 | Cable assembly with molded grounding bar and method of making same - A cable assembly ( | 03-18-2010 |
20100124395 | Cable assembly having enhanced mechanical interconnection means thereof - A cable assembly ( | 05-20-2010 |
20110255832 | Integrated and sealed opto-electronic device assembly - An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case. | 10-20-2011 |
20130266274 | OPTO-ELECTRONIC DEVICE ASSEMBLY - An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly. | 10-10-2013 |
20140056557 | OPTICAL MODULE FOR TRANSMITTING OPTICAL SIGNAL - An optical module comprises: a housing; a first incident surface mounted on the housing for receiving an optical signal converted from an electrical signal; a first output surface mounted on the housing for exporting the optical signal from the first incident surface; a second incident surface mounted on the housing for receiving another optical signal to be converted to another electrical signal; and a second output surface mounted on the housing for exporting the another optical signal from the second incident surface. An aperture of the first incident surface is smaller than an aperture of the second incident surface. | 02-27-2014 |
20140133809 | INTEGRATED AND SEALED OPTO-ELECTRONIC DEVICE ASSEMBLY - An opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface for coupling with an optical device and an electrical transmission interface, the electrical transmission interface having electrical pads. The electrical socket includes a plurality of BGA terminals, each terminal having a module-connecting end and a board-connecting end. The electrical transmission interface is removeably assembled in the electrical socket and the electrical pads contact the module-connecting ends of the electrical socket. | 05-15-2014 |
20140321819 | OPTICAL ASSEMBLY - An optical assembly ( | 10-30-2014 |
20140341513 | OPTO-ELECTRONIC DEVICE ASSEMBLY - An AOC assembly comprising two printed circuit boards (PCB) ( | 11-20-2014 |
20140357103 | CONNECTOR WITH DIFFERENTLY ARRANGED CONTACT MOUNTING PORTIONS AND CONNECTOR ASSEMBLY HAVE TWO SUCH CONNECTORS BELLY-TO-BELLY MOUNTED TO A CIRCUIT BOARD - A high speed card edge connector ( | 12-04-2014 |
20140369650 | OPTICAL MODULE HAVING ADDITIONAL PHOTODIODE LENS FOR DIFFERENT CONNECTION - An optical module ( | 12-18-2014 |