Patent application number | Description | Published |
20140025821 | METHOD AND APPARATUS FOR MANAGING MAC ADDRESS GENERATION FOR VIRTUALIZED ENVIRONMENTS - MAC addresses are flexibly and dynamically allocated across groups of devices that need MAC addresses. MAC address pools are defined for the groups by non-overlapping ranges of MAC addresses. The range of MAC addresses defined for any pool may be shrunk to support an expansion of the range of MAC addresses of another pool. The maximum number of universally-administered MAC addresses that can be defined for any MAC address pool is greater than 2 | 01-23-2014 |
20150277951 | AUTO-SCALING VIRTUAL SWITCHES - A port is dynamically added to and removed from a virtual switch. The new port may be allocated when there is sufficient free memory in a pool of memory associated with the virtual switch. When an existing port is deallocated, the portion of the pool of memory allocated to that existing port is freed up. As a result, a virtual machine that requires one or more ports on the virtual switch may be provisioned on a host so long as the pool of memory is sized properly and memory usage on the host is not excessive. | 10-01-2015 |
20160055019 | METHOD AND SYSTEM FOR MIGRATING VIRTUAL MACHINES IN VIRTUAL INFRASTRUCTURE - A method of migrating a data compute node (DCN) in a datacenter comprising a plurality of host physical computing devices, a compute manager, and a network manager is provided. The method by the network manager configures a plurality of logical networks and provides a read-only configuration construct of at least one of the plurality of logical networks to the virtualization software of each host. The construct of each logical network includes a unique identification of the logical network. The method by the compute manager obtains the unique identification of one or more of the logical networks, determining that a particular logical network is available on first and second hosts based on the unique identification of the particular logical network, and configures a first DCN to move from the first host to the second host based on the determination that the first and second hosts are on the particular logical network. | 02-25-2016 |
20160057005 | ENABLING UNIFORM SWITCH MANAGEMENT IN VIRTUAL INFRASTRUCTURE - A method of configuring a logical network in a datacenter is provided. The datacenter includes a plurality of host physical computing devices, a compute manager to configure one or more data compute nodes (DCNs) on virtualization software of each host, and a network manager. The method configures, by the network manager, a logical network. the method provides, by the network manager, a read-only configuration construct of the logical network to the virtualization software of a set of hosts in the plurality of hosts. The method obtains, by the compute manager, the read-only configuration construct of the logical network from the virtualization software of the set of hosts. The method configures, by the compute manager, a plurality of DCNs to connect to the logical network using the read only configuration construct of the logical network. | 02-25-2016 |
20160057006 | METHOD AND SYSTEM OF PROVISIONING LOGICAL NETWORKS ON A HOST MACHINE - A physical computing device is provided that includes a set of processing units and a set of machine readable media (CRM) for execution by the set of processing units. The CRM stores a plurality of data compute nodes (DCNs) deployed by a compute manager of a datacenter, virtualization software, and a network manager agent. The network manager receives a read-only configuration construct for each of a set of logical networks from a network manager of the datacenter, the logical networks configured and managed by the network manager. the agent provisions the set of logical networks on the physical computing device for use by the virtualization software. The agent provides a copy of the read-only construct of each logical network to the compute manager to allow the compute manager to connect one or more DCNs to each of the logical networks. | 02-25-2016 |
20160057014 | ENABLING VIRTUAL MACHINES ACCESS TO SWITCHES CONFIGURED BY DIFFERENT MANAGEMENT ENTITIES - A method of configuring a plurality of logical forwarding elements (LFEs) on a physical computing device comprising virtualization software and a plurality of data compute nodes (DCNs) is provided. The method provisions a first LFE configured and managed by a network manager of a datacenter on the physical computing device, the first LFE for performing OSI L | 02-25-2016 |
Patent application number | Description | Published |
20150370020 | PARALLEL OPTICAL TRANSCEIVER WITH TOP AND BOTTOM LENSES - A parallel optical communications module includes a top lens and a bottom lens that are spaced from one another to inhibit mechanical forces acting upon the top lens from being transferred to the bottom lens, which is optically aligned with an opto-electronic light source or light detector. The top lens has a reflector portion configured to redirect the optical signals between the bottom lens and one or more optical fibers. | 12-24-2015 |
20150372757 | ALIGNING OPTICAL ELEMENTS OF AN OPTICAL TRANSCEIVER SYSTEM - In a method for making an optical communications module, elements in the optical signal path are aligned relative to a lens mounting frame. The frame is attached to the surface of a printed circuit board. The frame bears fiducial markings. An opto-electronic device is then aligned relative to the frame using the fiducial markings. One or more bottom lens devices are aligned relative to the lens mounting frame using the fiducial markings. Finally, a top lens device is attached to the lens mounting frame over the bottom lens devices. | 12-24-2015 |
20150373834 | MOUNTING BLOCK AND A MOUNTING ASSEMBLY THAT INCORPORATES THE MOUNTING BLOCK - A mounting block is provided that has a multi-level upper surface that is used to mount one or more IC chips and the printed circuit board (PCB) thereon at heights that allow the lengths of the bond wires interconnecting the chips with the PCB and/or with the other IC chips to be reduced. The distances between the levels of the multi-level surface are preselected based at least in part on the known height of the PCB and the known height of at least one of the IC chips such that when the chip and the PCB are mounted on the mounting block, the distance between the contact pads of the PCB and the contact pads of the IC chip is very small, thereby allowing the lengths of the bond wires to be kept very short. | 12-24-2015 |
20150381278 | LOW-PROFILE OPTICAL TRANSCEIVER SYSTEM WITH TOP AND BOTTOM LENSES - An optical communications module includes a module housing, a printed circuit board (PCB), a device mounting block, at least one opto-electronic device, at least one signal processing integrated circuit (IC), and a top lens device. The opto-electronic device is mounted on the device mounting block. An upper surface of the signal processing IC has a signal contact array in electrical contact with a corresponding signal pad array on the PCB lower surface. The top lens device has a fiber port configured to communicate optical signals with a fiber-optic cable at the forward end of the module housing, a device port configured to communicate the optical signals with the opto-electronic device, and a reflector portion configured to redirect the optical signals at a non-zero angle between the fiber port and the device port. | 12-31-2015 |
Patent application number | Description | Published |
20080230782 | PHOTOCONDUCTIVE DEVICES WITH ENHANCED EFFICIENCY FROM GROUP IV NANOPARTICLE MATERIALS AND METHODS THEREOF - A device for generating a plurality of electron-hole pairs from a photon is disclosed. The device includes a substrate, a first electrode formed above the substrate, and a first doped Group IV nanoparticle thin film deposited on the first electrode. The device further includes an intrinsic layer deposited on the first doped Group IV nanoparticle thin film, wherein the intrinsic layer includes a matrix material with a melting temperature T | 09-25-2008 |
20100018578 | PHOTOACTIVE MATERIALS CONTAINING GROUP IV NANOSTRUCTURES AND OPTOELECTRONIC DEVICES MADE THEREFROM - The present invention provides photoactive materials that include inorganic nanostructures comprising a Group IV semiconductor in combination with electron-transporting, conjugated small molecules, carbon nanostructures, or both. The carbon nanostructures or conjugated small molecules may be selected such that the inorganic nanostructures and the carbon nanostructures (and/or the small molecules) exhibit a type II band offset. The photovoltaic materials are well-suited for use as the active layer in photoactive devices, including photovoltaic devices, photoconductors, and photodetectors. | 01-28-2010 |
20110091731 | SEMICONDUCTOR THIN FILMS FORMED FROM GROUP IV NANOPARTICLES - Native Group IV semiconductor thin films formed from coating substrates using formulations of Group IV nanoparticles are described. Such native Group IV semiconductor thin films leverage the vast historical knowledge of Group IV semiconductor materials and at the same time exploit the advantages of Group IV semiconductor nanoparticles for producing novel thin films which may be readily integrated into a number of devices. | 04-21-2011 |
Patent application number | Description | Published |
20080268635 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS - Embodiments of the invention described herein generally provide methods for forming cobalt silicide layers and metallic cobalt layers by using various deposition processes and annealing processes. In one embodiment, a method for forming a cobalt silicide material on a substrate is provided which includes treating the substrate with at least one preclean process to expose a silicon-containing surface, depositing a cobalt silicide material over the silicon-containing surface, and depositing a copper material over the cobalt silicide material. In another embodiment, a metallic cobalt material may be deposited over the cobalt silicide material prior to depositing the copper material. In one example, the copper material may be formed by depositing a copper seed layer and a copper bulk layer on the substrate. The copper seed layer may be deposited by a PVD process and the copper bulk layer may be deposited by an ECP process or an electroless deposition process. | 10-30-2008 |
20080268636 | DEPOSITION METHODS FOR BARRIER AND TUNGSTEN MATERIALS - Embodiments as described herein provide a method for depositing barrier layers and tungsten materials on substrates. In one embodiment, a method for depositing materials is provided which includes forming a barrier layer on a substrate, wherein the barrier layer contains a cobalt silicide layer and a metallic cobalt layer, exposing the barrier layer to a soak gas containing a reducing gas during a soak process, and forming a tungsten material over the barrier layer. In one example, the barrier layer may be formed by depositing a cobalt-containing material on a dielectric surface of the substrate and annealing the substrate to form the cobalt silicide layer from a lower portion of the cobalt-containing material and the metallic cobalt layer from an upper portion of the cobalt-containing material. | 10-30-2008 |
20090004850 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS - Embodiments of the invention described herein generally provide methods for forming cobalt silicide layers and metallic cobalt layers by using various deposition processes and annealing processes. In one embodiment, a method for forming a metallic silicide containing material on a substrate is provided which includes forming a metallic silicide material over a silicon-containing surface during a vapor deposition process by sequentially depositing a plurality of metallic silicide layers and silyl layers on the substrate, depositing a metallic capping layer over the metallic silicide material, heating the substrate during an annealing process, and depositing a metallic contact material over the barrier material. In one example, the metallic silicide layers and the metallic capping layer both contain cobalt. The cobalt silicide material may contain a silicon/cobalt atomic ratio of about 1.9 or greater, such as greater than about 2.0, or about 2.2 or greater. | 01-01-2009 |
20090269507 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES - Embodiments of the invention provide processes to selectively form a cobalt layer on a copper surface over exposed dielectric surfaces. In one embodiment, a method for capping a copper surface on a substrate is provided which includes positioning a substrate within a processing chamber, wherein the substrate contains a contaminated copper surface and a dielectric surface, exposing the contaminated copper surface to a reducing agent while forming a copper surface during a pre-treatment process, exposing the substrate to a cobalt precursor gas to selectively form a cobalt capping layer over the copper surface while leaving exposed the dielectric surface during a vapor deposition process, and depositing a dielectric barrier layer over the cobalt capping layer and the dielectric surface. In another embodiment, a deposition-treatment cycle includes performing the vapor deposition process and subsequently a post-treatment process, which deposition-treatment cycle may be repeated to form multiple cobalt capping layers. | 10-29-2009 |
20110086509 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS - Embodiments of the invention generally provide methods for forming cobalt silicide. In one embodiment, a method for forming a cobalt silicide material includes exposing a substrate having a silicon-containing material to either a wet etch solution or a pre-clean plasma during a first step and then to a hydrogen plasma during a second step of a pre-clean process. The method further includes depositing a cobalt metal layer on the silicon-containing material by a CVD process, heating the substrate to form a first cobalt silicide layer comprising CoSi at the interface of the cobalt metal layer and the silicon-containing material during a first annealing process, removing any unreacted cobalt metal from the substrate during an etch process, and heating the substrate to form a second cobalt silicide layer comprising CoSi | 04-14-2011 |
20120214303 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN TUNGSTEN CONTACT APPLICATIONS - Embodiments of the invention generally provide methods for forming cobalt silicide. In one embodiment, a method for forming a cobalt silicide material includes exposing a substrate having a silicon-containing material to either a wet etch solution or a pre-clean plasma during a first step and then to a hydrogen plasma during a second step of a pre-clean process. The method further includes depositing a cobalt metal layer on the silicon-containing material by a CVD process, heating the substrate to form a first cobalt silicide layer comprising CoSi at the interface of the cobalt metal layer and the silicon-containing material during a first annealing process, removing any unreacted cobalt metal from the substrate during an etch process, and heating the substrate to form a second cobalt silicide layer comprising CoSi | 08-23-2012 |
Patent application number | Description | Published |
20130151842 | ENCRYPTION KEY TRANSMISSION WITH POWER ANALYIS ATTACK RESISTANCE - Methods and mechanisms for transmitting secure data. An apparatus includes a storage device configured to store data intended to be kept secure. Circuitry is configured to receive bits of the secure data from the storage device and invert the bits prior to transmission. The circuitry may invert the bits prior to conveyance if more than half of the bits are a binary one, set an inversion signal to indicate whether the one or more bits are inverted, and convey both the one or more bits and inversion signal. Embodiments also include a first source configured to transmit Q bits of the secure data on an interface on each of a plurality of clock cycles. The first source is also configured to generate one or more additional bits to be conveyed concurrent with the Q bits such that a number of binary ones transmitted each clock cycle is constant. | 06-13-2013 |
20130339592 | APPROACH TO VIRTUAL BANK MANAGEMENT IN DRAM CONTROLLERS - Banks within a dynamic random access memory (DRAM) are managed with virtual bank managers. A DRAM controller receives a new memory access request to DRAM including a plurality of banks. If the request accesses a location in DRAM where no virtual bank manager includes parameters for the corresponding DRAM page, then a virtual bank manager is allocated to the physical bank associated with the DRAM page. The bank manager is initialized to include parameters needed by the DRAM controller to access the DRAM page. The memory access request is then processed using the parameters associated with the virtual bank manager. One advantage of the disclosed technique is that the banks of a DRAM module are controlled with fewer bank managers than in previous DRAM controller designs. As a result, less surface area on the DRAM controller circuit is dedicated to bank managers. | 12-19-2013 |
20140068204 | Low Power, Area-Efficient Tracking Buffer - A tracking buffer apparatus is disclosed. A tracking buffer apparatus includes lookup logic configured to locate entries having a transaction identifier corresponding to a received request. The lookup logic is configured to determine which of the entries having the same transaction identifier has a highest priority and thus cause a corresponding entry from a data buffer to be provided. When information is written into the tracking buffer, write logic writes a corresponding transaction identifier to the first free entry. The write logic also writes priority information in the entry based on other entries having the same transaction identifier. The entry currently being written may be assigned a lower priority than all other entries having the same transaction identifier. The priority information for entries having a common transaction identifier with one currently being read are updated responsive to the read operation. | 03-06-2014 |
20140223049 | BRIDGE CIRCUIT FOR BUS PROTOCOL CONVERSION AND ERROR HANDLING - Embodiments of a bridge circuit and system are disclosed that may allow for converting transactions from one communication protocol to another. The bridge circuit may be coupled to a first bus employing a first communication protocol, and a second bus employing a second communication protocol. The bridge circuit may be configured to convert transactions from the first communication protocol to the second communication protocol, and convert transaction from the second communication protocol to the first communication protocol. In one embodiment, the bridge circuit may be further configured to flag transactions that cannot be converted from the second communication protocol to the first communication protocol. In a further embodiment, an error circuit coupled to the bridge circuit may be configured to detect flagged transactions. | 08-07-2014 |
20150033061 | Harmonic Detector of Critical Path Monitors - A system for monitoring a clock input signal including a reference clock to be monitored, a flip-flop, a plurality of delay logic blocks, a sampling unit, and a comparison unit. The reference clock may have an expected maximum frequency. The flip-flop may be configured to generate a corresponding clock signal at a reduced frequency compared to the reference clock. The plurality of delay logic blocks may be configured to receive the reduced frequency clock signal and delay the signal for various amounts of time, each less than an expected period of the reference clock. The sampling unit may be configured to sample the signals output from the plurality of delay logic blocks. The comparison unit may be configured to receive the outputs of the flip-flop and the sampling unit and use these outputs to determine if the reference clock is running at an acceptable frequency compared to the expected frequency. | 01-29-2015 |
20150095535 | MULTI-CYCLE DELAY FOR COMMUNICATION BUSES - A system is disclosed that may compensate for bus timing that may vary over operating conditions of a bus. The system may include a communication bus, a first functional unit configured to transmit data via the communication bus, and a second functional unit configured to receive data via the bus. The first functional unit may transmit a first value via the communication bus to the second functional unit. The first functional unit may be further configured to assert a data valid signal responsive to a determination that a first time period has elapsed since the transmission of the first data value. The second functional unit may be configured to receive the first data value and sample the first data value dependent upon the data valid signal. | 04-02-2015 |
Patent application number | Description | Published |
20100281538 | Identification of Content by Metadata - Systems and methods for identifying content in electronic messages are provided. An electronic message may include certain content. The content is detected and analyzed to identify any metadata. The metadata may include a numerical signature characterizing the content. A thumbprint is generated based on the numerical signature. The thumbprint may then be compared to thumbprints of previously received messages. The comparison allows for classification of the electronic message as spam or not spam. | 11-04-2010 |
20100299752 | Identification of Content - Systems and methods for identifying content in electronic messages are provided. An electronic message may include certain content. The content is detected and analyzed to identify any metadata. The metadata may include a numerical signature characterizing the content. A thumbprint is generated based on the numerical signature. The thumbprint may then be compared to thumbprints of previously received messages. The comparison allows for classification of the electronic message as spam or not spam. | 11-25-2010 |
20140019568 | IDENTIFICATION OF CONTENT - Systems and methods for identifying content in electronic messages are provided. An electronic message may include certain content. The content is detected and analyzed to identify any metadata. The metadata may include a numerical signature characterizing the content. A thumbprint is generated based on the numerical signature. The thumbprint may then be compared to thumbprints of previously received messages. The comparison allows for classification of the electronic message as spam or not spam. | 01-16-2014 |
20140059049 | IDENTIFICATION OF CONTENT BY METADATA - Systems and methods for identifying content in electronic messages are provided. An electronic message may include certain content. The content is detected and analyzed to identify any metadata. The metadata may include a numerical signature characterizing the content. A thumbprint is generated based on the numerical signature. The thumbprint may then be compared to thumbprints of previously received messages. The comparison allows for classification of the electronic message as spam or not spam. | 02-27-2014 |
20150180670 | IDENTIFICATION OF CONTENT BY METADATA - Systems and methods for identifying content in electronic messages are provided. An electronic message may include certain content. The content is detected and analyzed to identify any metadata. The metadata may include a numerical signature characterizing the content. A thumbprint is generated based on the numerical signature. The thumbprint may then be compared to thumbprints of previously received messages. The comparison allows for classification of the electronic message as spam or not spam. | 06-25-2015 |
Patent application number | Description | Published |
20100197068 | Hybrid Transparent Conductive Electrode - Methods and devices are provided for improved photovoltaic devices. In one embodiment, the transparent electrode of a thin-film solar cell is replaced in part by a sheet of nanowires. One technique for use in present invention comprises forming a solar cell having: a) a thinner than usual transparent top electrode of a conductive material having a reduced thickness and b) an interconnected network of nanowires in contact with and/or coated by the top electrode. In some embodiments, the top electrode and network of nanowires increases overall power output of the solar cell compared to an otherwise identical cell using only a) a top electrode layer of the material at a thickness and light transmission equal to a combined thickness and light transmission of the top electrode and the network of nanowires, or b) an interconnected network of nanowires of thickness equal to the combined thickness and light transmission. | 08-05-2010 |
20140211194 | COST-EFFECTIVE LIDAR SENSOR FOR MULTI-SIGNAL DETECTION, WEAK SIGNAL DETECTION AND SIGNAL DISAMBIGUATION AND METHOD OF USING SAME - A lidar-based apparatus and method are used for multi-signal detection, weak signal detection and signal disambiguation through waveform approximation utilizing a multi-channel time-to-digital converter (TDC) electronic circuit, with each TDC having an individually adjustable voltage threshold. This advanced TDC-based pulse width time-of-flight (ToF) approach achieves the low cost associated with the TDC-based pulse width ToF approach while solving the signal quality issues associated with the standard single-threshold TDC-based approach. | 07-31-2014 |
20150192677 | DISTRIBUTED LIDAR SENSING SYSTEM FOR WIDE FIELD OF VIEW THREE DIMENSIONAL MAPPING AND METHOD OF USING SAME - A three-dimensional mapping system comprising a moderate number (typically 2 to 4) of moderate-beam-count (typically 8-beam to 16-beam) lidar sensors is proposed to achieve low cost systems with wide fields of view. Secondary advantages include compact sensors and a small minimum range (possible by optimal placement of each of a plurality of sensors). | 07-09-2015 |
20150293224 | SOLID STATE OPTICAL PHASED ARRAY LIDAR AND METHOD OF USING SAME - A lidar-based apparatus and method are used for the solid state steering of laser beams using Photonic Integrated Circuits. Integrated optic design and fabrication micro- and nanotechnologies are used for the production of chip-scale optical splitters that distribute an optical signal from a laser essentially uniformly to an array of pixels, said pixels comprising tunable optical delay lines and optical antennas. Said antennas achieve out-of-plane coupling of light. | 10-15-2015 |
20160028075 | SILICON-EMBEDDED COPPER NANOSTRUCTURE NETWORK FOR HIGH ENERGY STORAGE - Provided herein are nanostructure networks having high energy storage, electrochemically active electrode materials including nanostructure networks having high energy storage, as well as electrodes and batteries including the nanostructure networks having high energy storage. According to various implementations, the nanostructure networks have high energy density as well as long cycle life. In some implementations, the nanostructure networks include a conductive network embedded with electrochemically active material. In some implementations, silicon is used as the electrochemically active material. The conductive network may be a metal network such as a copper nanostructure network. Methods of manufacturing the nanostructure networks and electrodes are provided. In some implementations, metal nanostructures can be synthesized in a solution that contains silicon powder to make a composite network structure that contains both. The metal nanostructure growth can nucleate in solution and on silicon nanostructure surfaces. | 01-28-2016 |
20160047901 | ROBUST LIDAR SENSOR FOR BROAD WEATHER, SHOCK AND VIBRATION CONDITIONS - An apparatus and method are used for real-time wide-field-of-view ranging with a time-of-flight lidar sensor having one or a plurality of laser emitters and one or a plurality of photodetectors. When a plurarity of laser emitters are used, they are preferably copackaged or are in the form of an integrated multi-emitter chip or emitting multi-chip module in a single package, and when a plurarity of photoreceivers are used, they are preferably copackaged or are in the form of an integrated multi-photoreceiver chip or photoreceiving multi-chip module in a single package. Furthermore, the apparatus comprises any combination of (a) no moving external parts in contact with the environment, (b) wireless energy and data transfer between the static and the moving parts of the lidar, and (c) protective body, sealant and/or damage-resistant tamper-resistant theft-resistant cage. | 02-18-2016 |