Patent application number | Description | Published |
20130009740 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other. | 01-10-2013 |
20130015935 | COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAMEAANM CHANG; YU CHIAAACI TAICHUNG CITYAACO TWAAGP CHANG; YU CHIA TAICHUNG CITY TWAANM LIN; CHI LONGAACI HSINCHU COUNTYAACO TWAAGP LIN; CHI LONG HSINCHU COUNTY TWAANM WANG; CHENG YIAACI NEW TAIPEI CITYAACO TWAAGP WANG; CHENG YI NEW TAIPEI CITY TWAANM TAI; SHIN MINAACI TAOYUAN COUNTYAACO TWAAGP TAI; SHIN MIN TAOYUAN COUNTY TW - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, and a fourth coil connected in series with the second coil. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. | 01-17-2013 |
20130076456 | COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers. | 03-28-2013 |
20130076474 | COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material. | 03-28-2013 |
20130244343 | METHOD FOR PREPARING A THIN FILM DEVICE AND METHOD FOR PREPARING A COMMON MODE FILTER USING THE SAME - One aspect of the present invention provides a method for preparing a thin film device with an insulation layer from a dry polyimide film and a method for preparing a common mode filter using the same. A method for preparing a thin film device according to this aspect of the present invention includes the steps of forming at least one first conductive pattern on a substrate; placing a dry polyimide film on the first conductive pattern; applying a force to the dry polyimide film such that the dry polyimide film fills spaces in the first conductive pattern; and forming at least one second conductive pattern on the dry polyimide film. | 09-19-2013 |
20140186526 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other. | 07-03-2014 |
20140217563 | MULTIFUNCTION SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes. Each lateral electrode is electrically connected to the corresponding first conductive layer and the corresponding conductive contact portion. | 08-07-2014 |
20140247575 | ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASING THE BONDING STRENGTH BETWEEN INSIDE AND OUTSIDE ELECTRODES - An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion. | 09-04-2014 |
20140264888 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package structure includes a chip unit, a package unit and an electrode unit. The chip unit includes at least one semiconductor chip. The semiconductor chip has an upper surface, a lower surface, and a surrounding peripheral surface connected between the upper and the lower surfaces, and the semiconductor chip has a first conductive pad and a second conductive pad disposed on the lower surface thereof. The package unit includes a package body covering the upper surface and the surrounding peripheral surface of the semiconductor chip. The package body has a first lateral portion and a second lateral portion respectively formed on two opposite lateral sides thereof. The electrode unit includes a first electrode structure covering the first lateral portion and a second electrode structure covering the second lateral portion. The first and the second electrode structures respectively electrically contact the first and the second conductive pads. | 09-18-2014 |
20140266504 | WIDE-BAND COMMON MODE FILTERING APPARATUS - A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand. | 09-18-2014 |
20140347772 | OVER-VOLTAGE PROTECTION DEVICE AND METHOD FOR PREPARING THE SAME - An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern. | 11-27-2014 |
20150015344 | COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral. | 01-15-2015 |
Patent application number | Description | Published |
20110309234 | IMAGE SENSING MODULE - The present invention provides an image sensing module including an image sensing device and a calculation device. The image sensing device includes a plurality of pixels for acquiring an operation image containing an object image. The calculation device stores a look-up table regarding a temperature related parameter and a position deviation of the object image at each pixel associated with the temperature related parameter, and selects a deformation error from the look-up table according to the temperature related parameter corresponding to the operation image so as to correct a current position of the object image in the operation image. | 12-22-2011 |
20120075253 | OPTICAL TOUCH SYSTEM AND OBJECT DETECTION METHOD THEREFOR - The present invention provides an optical touch system configured to determine an object region according to a brightness information acquired by a brightness sensing unit and to identify a block information of objects within the object region according to an image information acquired by an image sensing unit. The present invention further provides an objection detection method for an optical touch system. | 03-29-2012 |
20120092252 | CURSOR CONTROL METHOD - The present invention provides a cursor control method for adjusting a smoothness of a cursor motion shown on an image display according to a trace variation detected by a detection device. | 04-19-2012 |
20140111481 | OPTICAL TOUCH SYSTEM WITH BRIGHTNESS COMPENSATION AND BRIGHTNESS COMPENSATION METHOD THEREOF - There is provided an optical touch system including a touch surface, a plurality of image sensors and a plurality or compensation light sources, wherein each of the image sensors is adjacent to one of the compensation light sources. When one of the image sensors is capturing an image frame, the compensation light source not adjacent to and within a field of view of the image sensor which is capturing the image frame irradiates so as to compensate a brightness distribution of the image frame. | 04-24-2014 |
20150212652 | OPTICAL TOUCH SYSTEM AND OBJECT ANALYZATION METHOD THEREOF - The present disclosure provides an optical touch system and an object analyzation method thereof. The optical touch system includes a panel and an image sensing apparatus installed thereon. The object analyzation method includes the following steps: capturing a first image across a touch surface of the panel with an image sensing apparatus, wherein the first image has an object image formed corresponding to the position of a pointer on the touch surface; defining an image window that corresponds to the image position of the object image in the first image captured; determining whether the pointer is touching the touch surface or hovering over the touch surface by analyzing the brightness difference among the plurality of pixels in the image window. | 07-30-2015 |
20150253934 | OBJECT DETECTION METHOD AND CALIBRATION APPARATUS OF OPTICAL TOUCH SYSTEM - The present disclosure provides an object detection method including: pre-storing a lookup table of touch reference values, wherein the lookup table of touch reference values records a plurality of touch reference values associated with image positions of a plurality of calibration object images formed in calibration images captured by a first image sensor; capturing a first image, wherein the first image has at least an object image corresponding to a pointer formed therein; generating a first light distribution curve according to the first image; defining a first detection region in the first light distribution curve; obtaining at least one touch reference value associated with the object image using the lookup table of touch reference values; comparing at least one brightness value within the first detection region of the first light distribution curve with the at least one touch reference value obtained. | 09-10-2015 |
Patent application number | Description | Published |
20130050960 | PORTABLE ELECTRONIC DEVICE - A portable electronic device includes an integration unit and a main circuit. The integration unit includes a carrier and at least one electronic element disposed on the carrier. The electronic element includes an antenna unit, a button input unit or a sound transmission unit. The main circuit is electrically connected to the electronic element through a conducting wire. | 02-28-2013 |
20140210682 | ANTENNA - An antenna device is provided. The antenna includes a feeding end, a grounding end, a loop metal portion and a protruded metal portion. The grounding end is electrically connected to a ground plane. The loop metal portion extends from the feeding end to the grounding end to form a loop antenna structure. The protruded metal portion is electrically connected to the loop metal portion, wherein the distance between the protruded metal portion and the grounding end is shorter than the distance between the protruded metal portion and the feeding end. | 07-31-2014 |
20140253398 | TUNABLE ANTENNA - A tunable antenna includes a ground plane, a first radiation unit and a second radiation unit. The first radiation unit includes a feeding portion and a coupling portion. The feeding portion is electrically connected to a signal source. The second radiation unit surrounds a part of the coupling portion and includes a grounding end and a switch unit. The grounding end is electrically connected to the ground plane. The switch unit is electrically connected to the grounding end and the ground plane selectively. | 09-11-2014 |
20140323068 | MOBILE COMMUNICATION DEVICE WITH HUMAN BODY RECOGNITION FUNCTION - A mobile communication device with a human body recognition function includes sensing pad and a sensor. The sensing pad is electrically connected to the sensor. When a target object approaches the mobile communication device, an induction signal is generated between the sensing pad and the target object. The sensor receives the induction signal, and the sensor includes a first sensitivity and a second sensitivity. When no target object approaches the mobile communication device, the sensor is set at the first sensitivity. When the sensor receives the induction signal, the first sensitivity is switched to the second sensitivity. The induction signal is converted into a first signal and the first sensitivity is compared with a default value. If the first signal is greater than the default value, the target object is determined as a human body and a power adjustment unit is adjusted to reduce an output power. | 10-30-2014 |
Patent application number | Description | Published |
20130234998 | STYLUS - A stylus includes a conductive rod, a circuit board, and an antenna. The conductive rod has a first opening. The circuit board is disposed in the conductive rod and includes a ground portion, wherein the conductive rod is electrically connected to the ground portion. The antenna includes a radiating portion and a feeding portion. The feeding portion is electrically connected to the circuit board and extends to the outside of the conductive rod via the first opening. The radiating portion is disposed at the outside of the conductive rod and is electrically connected to the feeding portion. | 09-12-2013 |
20140111399 | DIRECTIONAL ANTENNA - A directional antenna including a ground plane, a feeding element and a radiating element is provided. The feeding element is adjacent to the ground plane and includes a feeding point. A coupling gap is formed between the radiating element and the feeding element, and the radiating element includes a coupling point. Both the coupling point of the radiating element and the feeding point of the feeding element are at the perpendicular line of a ground plane. Further, a distance between the coupling point and an open end of the radiating element is smaller than 0.16λ of a resonant frequency of the directional antenna. | 04-24-2014 |
20150145744 | TUNABLE ANTENNA - A tunable antenna including a first radiating element, a second radiating element, a connection circuit and a switch circuit is provided. The first radiating element includes a coupling portion and a first feeding portion. The second radiating element includes a second feeding portion, a grounding portion and a radiation portion. The grounding portion is electrically connected to a ground plane, and the radiation portion surrounds the coupling portion to form a first coupling gap and the second coupling gap. The connection circuit is electrically connected to the radiation portion and a state of the connection circuit is changed according to a control signal, so as to adjust a length of the resonant path of the radiation portion. A feeding signal is transmitted to the first feeding portion or the second feeding portion by the switch circuit. | 05-28-2015 |
Patent application number | Description | Published |
20140145307 | Seal Ring Structure with Metal-Insulator-Metal Capacitor - A seal ring structure of an integrated circuit includes a seal ring and a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes a top electrode, a bottom electrode disposed below the top electrode, and a first insulating layer disposed between the top electrode and the bottom electrode. The MIM capacitor is disposed within the seal ring and the MIM capacitor is insulated from the seal ring. | 05-29-2014 |
20140374899 | Package with Solder Regions Aligned to Recesses - A method includes forming a passivation layer over a portion of a metal pad, forming a polymer layer over the passivation layer, and exposing the polymer layer using a photolithography mask. The photolithography mask has an opaque portion, a transparent portion, and a partial transparent portion. The exposed polymer layer is developed to form an opening, wherein the metal pad is exposed through the opening. A Post-Passivation Interconnect (PPI) is formed over the polymer layer, wherein the PPI includes a portion extending into the opening to connect to the metal pad. | 12-25-2014 |
20150014846 | Self-alignment Structure for Wafer Level Chip Scale Package - A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure. | 01-15-2015 |
20150076689 | Hollow Metal Pillar Packaging Scheme - An integrated circuit includes a bottom substrate, a metal layer disposed over the bottom substrate and a hollow metal pillar disposed on the metal layer. The metal layer and the hollow metal pillar are electrically connected. | 03-19-2015 |
20150102459 | Metal Insulator Metal Capacitor and Method for Making the Same - A semiconductor device includes one or more metal-insulator-metal (MiM) capacitors. The semiconductor device includes a bottom electrode, a dielectric layer located above, and in physical contact with, the bottom electrode, a top electrode located above, and in physical contact with, the dielectric layer, a first top contact contacting the top electrode, a first bottom contact contacting the bottom electrode from a top electrode direction, a first metal bump connecting to the top contact, and a second metal bump connecting to the bottom contact. The top electrode has a smaller area than the bottom electrode. The bottom electrode, the dielectric layer, and the top electrode is a MiM capacitor. Top electrodes of a number of MiM capacitors and bottom electrodes of a number of MiM capacitors are daisy chained to allow testing of the conductivity of the electrodes. | 04-16-2015 |
20150228599 | SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE - A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure. | 08-13-2015 |