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| 20130058139 | ENERGY GENERATION SYSTEM AND ITS ANTI ISLANDING PROTECTING METHOD - A new and renewable energy generation system includes: an inverter for converting a DC voltage into an AC voltage; a three-phase/two-phase transformer for transforming an output of the inverter into a three-phase/two-phase stationary coordinate system; a phase locked loop for calculating the phase and frequency of an output voltage of the inverter; a phase shifter for generating a current phase reference value; a current reference coordinate transformer for transforming the current phase reference value and the current amplitude reference value into a two-phase stationary coordinate system; a current phase calculator for outputting a current phase calculation value; a current phase calculator for outputting a current amplitude calculation value; a current adjuster for generating a current adjustment signal; an output three-phase transformer for transforming the current adjustment signal into a current adjustment signal in a three-phase stationary coordinate system; and a PWM controller for outputting a PWM control signal. | 03-07-2013 |
| 20130076151 | PHOTOVOLTAIC GENERATION SYSTEM USING PARALLEL INVERTER CONNECTED GRID - A photovoltaic generation system using grid-connected parallel inverters comprises a plurality of photovoltaic generation devices connected in parallel with each other, and a transformer configured to transform and transfer output voltages of the photovoltaic generation devices to a grid, wherein the photovoltaic generation device includes: a photovoltaic module configured to convert photovoltaic energy into DC electrical energy; an inverter configured to convert the DC electrical energy outputted from the photovoltaic module into AC electrical energy; an LC filter configured to remove noise included in the AC electrical energy which is outputted from the inverter; and a Y-connected capacitor group which is connected between one terminal of a reactor in the LC filter and one terminal of the photovoltaic module and is configured to reduce stray current. | 03-28-2013 |
| 20130077366 | SOLAR ENERGY GENERATION SYSTEM TRACKING ADAPTIVE MAXIMUM POWER POINT AND ITS METHOD - Provided are a solar energy generation system having an adaptive maximum power point tracking function and a method thereof. The solar energy generation system includes: a minimum maintenance voltage determination unit configured to output a minimum maintenance voltage which enables the inverter to maintain an operation thereof corresponding to a grid voltage of the grid; a maximum power point tracking controller configured to determine a maximum power point tracking voltage at a maximum power point of the photovoltaic module, using the minimum maintenance voltage and an output voltage and output current of the photovoltaic module, and to output a reference voltage to track the maximum power point; a voltage calculator configured to calculate a difference between the reference voltage and the output voltage of the photovoltaic module; and a voltage adjuster configured to generate a reference current value using an output of the voltage calculator. | 03-28-2013 |
| 20140119069 | HIGH POWER CONTROL SYSTEM AND CONTROL METHOD THEREOF - A high power control system includes: a single energy source; an energy source management unit configured to manage the energy source; a controller configured to output a PWM control signal under control of the energy source management unit; a plurality of inverters configured to convert a direct current into an alternating current under control of the PWM control signal of the controller; a plurality of filters coupled to output terminals of the inverters; and a plurality of switches configured to regulate connections between the filters and a load under control of a regulation control signal of the controller. | 05-01-2014 |
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| 20090273076 | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same - Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component. | 11-05-2009 |
| 20100001392 | Semiconductor package - Provided is a semiconductor package including a substrate and a semiconductor chip formed on the substrate. The semiconductor chip may include a chip alignment mark on a surface of the semiconductor chip, and wiring patterns formed on a surface of the substrate, wherein the chip alignment mark is bonded to the wiring patterns. Accordingly, the surface area of the semiconductor chip may be reduced. | 01-07-2010 |
| 20110143625 | TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATING MEMBER, AND ELECTRONIC APPARATUS INCLUDING THE SAME - Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component. | 06-16-2011 |
| 20110210433 | SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND FILM - A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip. The connection surface includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip. A plurality of input pads of the set of input pads are adjacent the first edge, and are arranged in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads of the set of output pads are adjacent the second edge, and are arranged in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads of the set of output pads are located between the first row and the second row. The plurality of second output pads include at least first and second outermost pads located a certain distance from the respective third edge and fourth edge, and at least first and second inner pads located a greater distance from the respective third edge and fourth edge than the first and second outermost pads. | 09-01-2011 |
| 20120085383 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME - A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection. | 04-12-2012 |
| 20120085393 | SOLAR CELL MODULE AND METHOD OF MANUFACTURING THE SAME - A solar cell module includes a circuit board, a plurality of solar cells disposed on a first surface of the circuit board, a plurality of metal terminals formed on the first surface of the circuit board, and a plurality of wires electrically connecting the plurality of solar cells and the metal terminals. The circuit board has a second surface opposite to the first surface, the rear surface comprising openings corresponding to the metal terminals, the openings exposing the metal terminals to an exterior of the solar cell module, thus forming contact terminals for the solar cell module. | 04-12-2012 |
| 20140084430 | SEMICONDUCTOR CHIP AND FILM AND TAB PACKAGE COMPRISING THE CHIP AND FILM - A semiconductor chip for a TAB package includes a surface including a set of input pads connected to internal circuitry of the chip and for receiving external signals The surface includes output pads. A plurality of input pads are adjacent a first edge and are in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads are adjacent a second edge, and are in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads are located between the first row and the second row. The plurality of second output pads first and second outermost pads located a certain distance from a respective third edge and fourth edge, and first and second inner pads located a greater distance from the respective third edge and fourth edge. | 03-27-2014 |
| 20150318268 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surface and the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive. | 11-05-2015 |
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| 20090291228 | METHOD AND APPARATUS FOR FORMING COLLOIDAL PHOTONIC CRYSTALS - A method for forming colloidal photonic crystals comprises; surrounding an outer circumference of a cylinder with a flexible substrate, spacing the cylinder a predetermined distance from a panel coated with a colloidal solution, and rotating the cylinder to form colloidal photonic crystals on the flexible panel. | 11-26-2009 |
| 20110225927 | STEEL-CONCRETE COMPOSITE BEAM AND CONSTRUCTION METHOD USING SAME - A steel-concrete composite beam includes a long rectangular steel frame; concrete members installed at only both ends of the steel frame, excluding a center portion thereof; a prestressable reinforcement buried in the concrete member; and a stirrup reinforcement arranged to the concrete member with a regular gap thereto to surround a lower flange of the steel frame. | 09-22-2011 |
| 20110265422 | METHOD FOR MANUFACTURING A COMPOSITE BEAM USING T-TYPE STEEL AND METHOD FOR CONSTRUCTING A STRUCTURE USING THE SAME - A steel composite beam is manufactured by T-shaped steel, inverse T-shaped steels installed at opposite ends of the T-shaped steel, and vertical stiffeners installed on the inverse T-shaped steels. A method for manufacturing a composite beam using T-shaped steel and a method of constructing a structure using the same are capable of using less steel and minimizing dead weight of the composite beam compared to a steel composite beam having the same cross section and depth, and designing a cross section of the composite beam in an efficient and economical manner due to the pre-stress caused by tendons, providing easy connection with column members on the basis of length, providing efficient construction, easy management, and convenient construction for ceilings and finishing equipment due to light dead weight. | 11-03-2011 |
| 20150292312 | METHOD FOR PRODUCING SYNTHETIC GAS BY USING SOLID ACID - The present disclosure relates to a method for producing a synthesis gas using a solid acid, more particularly to a method for producing a synthesis gas using a solid acid capable of remarkably decreasing production of environmental pollutants such as carbon dioxide, which includes producing hydrogen by reacting a solid acid with water and producing a synthesis gas by reacting the produced hydrogen with a carbon compound. | 10-15-2015 |
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| 20160120392 | TAPE CLEANER - The disclosed tape cleaner is convenient to use and allows easy replacement of the tape, and prevents an adhesive tape roller from moving away from the tape cleaner during use. The tape cleaner comprises an adhesive tape roller, a support roller which is inserted and mounted into the adhesive tape roller and supports the adhesive tape roller, an upper cover which has both side ends coupled to both side ends of the support roller, respectively, and encloses a part of an outer circumferential surface of the adhesive tape roller, a rotary cover which has both side ends coupled to both side ends of the support roller, respectively, encloses a part of the outer circumferential surface of the adhesive tape roller inside the upper cover, and is rotatable about an axis in a longitudinal direction of the support roller, and a handle connected to the upper cover, in which the rotary cover includes a tape cutter part which is positioned at an edge portion thereof and cuts an adhesive tape of the adhesive tape roller, the upper cover includes a stopper part which is positioned on an inner circumferential surface of the upper cover and stops the rotary cover so that the rotary cover is not arbitrarily rotated when the adhesive tape is cut by the tape cutter part, both the adhesive tape roller and the support roller are rotatable about the axis in the longitudinal direction of the support roller, and all of the adhesive tape roller, the support roller, the upper cover, and the rotary cover are attachable and detachable. | 05-05-2016 |
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| 20130087192 | PHOTOVOLTAIC DEVICE - A photovoltaic device, and a method of fabricating the same are provided. Here, a base portion and an emitter portion are formed on a surface of a semiconductor substrate. An insulation layer is formed on the base portion and the emitter portion. The insulation layer has a plurality of vias to partially expose the base portion and the emitter portion. A first electrode is formed to contact a region of the emitter portion through at least one of the vias, and a second electrode is formed to contact a region of the base portion through at least another one of the vias. Then, a dicing line is set at a bus electrode portion of the second electrode, and the semiconductor substrate is split into at least two photovoltaic devices at the base portion along the dicing line. | 04-11-2013 |
| 20130092224 | PHOTOELECTRIC DEVICE - A photoelectric device includes a first semiconductor structure and a second semiconductor structure on a substrate, and the first semiconductor structure includes a different conductivity type from the second semiconductor structure. The photoelectric device also includes a first electrode on the first semiconductor structure and a second electrode on the second semiconductor structure, and an interlayer insulating structure adjacent to the second semiconductor structure. The interlayer insulating structure separates the first semiconductor structure from the second semiconductor structure and separates the first semiconductor structure from the second electrode. | 04-18-2013 |
| 20130104974 | SOLAR CELL AND MANUFACTURING METHOD THEREOF | 05-02-2013 |
| 20130112253 | SOLAR CELL - A solar cell including a first conductive type semiconductor substrate; a first intrinsic semiconductor layer on a front surface of the semiconductor substrate; a first conductive type first semiconductor layer on at least one surface of the first intrinsic semiconductor layer; a second conductive type second semiconductor layer on a back surface of the semiconductor substrate; a second intrinsic semiconductor layer between the second semiconductor layer and the semiconductor substrate; a first conductive type third semiconductor layer on the back surface of the semiconductor substrate, the third semiconductor layer being spaced apart from the second semiconductor layer; and a third intrinsic semiconductor layer between the third semiconductor layer and the semiconductor substrate. | 05-09-2013 |
| 20130125964 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - A solar cell including a crystalline semiconductor substrate having a first conductive type; a first doping layer on a front surface of the substrate and being doped with a first conductive type impurity; a front surface antireflection film on the front surface of the substrate; a back surface antireflection film on a back surface of the substrate; an intrinsic semiconductor layer, an emitter, and a first auxiliary electrode stacked on the back surface antireflection film and the substrate; a second doping layer on the back surface of the substrate and being doped with the first impurity; an insulating film on the substrate and including an opening overlying the second doping layer; a second auxiliary electrode in the opening and overlying the second doping layer; a first electrode on the first auxiliary electrode; and a second electrode on the second auxiliary electrode and being separated from the first electrode. | 05-23-2013 |
| 20130133729 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - A solar cell includes a semiconductor substrate, a first intrinsic semiconductor layer and a second intrinsic semiconductor layer on the semiconductor substrate, the first intrinsic semiconductor layer and the second intrinsic semiconductor layer being spaced apart from each other, a first conductive semiconductor layer and a second conductive semiconductor layer respectively disposed on the first intrinsic semiconductor layer and the second intrinsic semiconductor layer, and a first electrode and a second electrode, each including a bottom layer on the first conductive semiconductor layer and the second conductive semiconductor layer, respectively, the bottom layer including a transparent conductive oxide, and an intermediate layer on the bottom layer, the intermediate layer being including copper. | 05-30-2013 |
| 20130267059 | METHOD OF MANUFACTURING PHOTOELECTRIC DEVICE - A method of manufacturing a photoelectric device, the method including: forming a first semiconductor layer on a semiconductor substrate through a first ion implantation; forming a second semiconductor layer having an inverted conductive type on a part of the first semiconductor layer through a second ion implantation; and performing thermal processing to restore lattice damage of the semiconductor substrate and activate a dopant into which ion implanted. | 10-10-2013 |
| 20140130854 | PHOTOELECTRIC DEVICE AND THE MANUFACTURING METHOD THEREOF - A photoelectric device includes: a semiconductor substrate including monocrystalline silicon and has first and second surfaces that are opposite to each other; a doping unit formed on the first surface of the semiconductor substrate; and an insulating layer that is formed between the doping unit and the second surface of the semiconductor substrate, wherein the doping unit includes: a first semiconductor layer including a first dopant doped in the monocrystalline silicon; and a second semiconductor layer including a second dopant doped in the monocrystalline silicon. | 05-15-2014 |
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| 20100123906 | FACSIMILE MACHINE WITH MULTIPLE LINES AND IMAGE FORMING APPARATUS COMPRISING THE SAME - An image forming apparatus is equipped with a facsimile machine having two or more lines, including a paper feeding unit; an image forming unit; and a discharging unit, wherein if first facsimile information is received through a first line of the two or more lines, the paper on which an image of the first facsimile information is formed is discharged passing through the paper feeding unit, a paper transporting path and the discharging unit in turn, and if second facsimile information is received through a second line of the two or more lines, the paper on which an image of the second facsimile information is formed is discharged passing through a paper returning path, the paper transporting path and the discharging unit in turn after the image of the second facsimile information has been formed. | 05-20-2010 |
| 20110194138 | CONTROL POINT, IMAGE FORMING APPARATUS, AND METHOD FOR SENDING FAX DATA USING FAX DATA TRANSMISSION FUNCTION OF THE IMAGE FORMING APPARATUS - An image forming apparatus is provided. The image forming apparatus is requested by a connectable control point to execute a fax job, and includes a communication interface which is requested by a connectable control point to execute a fax job, and receives content corresponding to the fax job; a TTI generation unit which generates a terminal identification (TTI) corresponding to the fax job; an image processor which generates a fax image using the generated TTI and the received content; and a fax unit which transmits the generated fax image | 08-11-2011 |
| 20140118794 | FAX MACHINE AND METHOD OF PERFORMING HANDSHAKING PROCESS BASED ON T.30 PROTOCOL - A method of performing handshaking between fax machines on the basis of T.30 protocol includes transmitting information on a first data rate selected to transmit a fax document to a receiving-side fax machine, transmitting a plurality of frames including bit strings predefined to test data transmission/reception at the first data rate prior to transmitting the fax document to the receiving-side fax machine, and receiving a message informing success or failure of the test. The transmitting of the frames includes determining a time duration of the transmitting the frames based on at least one of a TCF flag value and the first data rate. | 05-01-2014 |
