Patent application number | Description | Published |
20090258193 | MULTILAYERED CERAMIC SUBSTRATE - There is provided a multilayered ceramic substrate where a groove is formed in a intermediate stack having a relatively big thermal expansion coefficient or a step is formed at an edge portion of the intermediate stack so that cracks occurring due to differences in the thermal expansion coefficient among stacks is prevented from spreading to the edge portion, thereby inhibiting occurrence of edge cracks. | 10-15-2009 |
20100003479 | LAMINATED CERAMIC SUBSTRATE - Provided is a laminated ceramic substrate. The laminated ceramic substrate includes a first ceramic layer, a second ceramic layer, and a third ceramic layer. The first ceramic layer is formed of a material with a first thermal expansion coefficient. The second ceramic layer is laminated on one side of the first ceramic layer. The second ceramic layer is formed of a material with a second thermal expansion coefficient different from the first thermal expansion coefficient. The third ceramic layer is laminated on the other side of the first ceramic layer. The third ceramic layer is formed of a material with the second thermal expansion coefficient. The third ceramic layer has a different thickness than the second ceramic layer. | 01-07-2010 |
20100284125 | Nanowire capacitor and method of manufacturing the same - Provided is a method of manufacturing a nanowire capacitor including forming a lower metal layer on a substrate; growing conductive nanowires on the lower metal layer, the conductive nanowires including metal and transparent electrodes; depositing a dielectric layer on the lower metal layer including the grown conductive nanowires; growing dielectric nanowires on the deposited dielectric layer; and depositing an upper metal layer on the dielectric layer including the grown dielectric nanowires. | 11-11-2010 |
20130088100 | LINEAR VIBRATOR - There is provided a linear vibrator, including: a fixed part providing an interior space having a predetermined size; at least one magnet disposed in the interior space and generating magnetic force; a vibration part including a coil facing the magnet and generating electromagnetic force through interaction with the magnet and a mass body; and an elastic member coupled to the fixed part and the vibration part to mediate vibrations of the vibration part and having a damping increasing portion attached to a predetermined region of a surface thereof. | 04-11-2013 |
20140061891 | SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a semiconductor chip package and a manufacturing method thereof. The manufacturing method of the semiconductor chip package includes: a) mounting a semiconductor chip on a printed circuit board (PCB); b) inserting a warpage suppressing reinforcement member into an inner ceiling of a mold manufactured in order to package the PCB having the semiconductor chip mounted thereon; c) combining the mold having the warpage suppressing reinforcement member inserted into the ceiling thereof with the upper surface of the PCB so as to surround the PCB having the semiconductor chip mounted thereon; d) injection-molding and filling a molding material in the mold, and hardening the molding material by applying heat, and e) hardening the molding material and then removing the mold to complete the semiconductor chip package. | 03-06-2014 |
20140145322 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component package and a method of manufacturing the same. The electronic component package includes: a substrate; a connection member provided on at least one surface of the substrate; an active element coupled to the substrate by the connection member; and a molding part covering an exposed surface of the active element, wherein the molding part is formed of a first material having a coefficient of thermal expansion of 8 to 15 ppm/° C. and thermal conductivity of 1 to 5 W/m° C. Therefore, warpage may be significantly decreased and heat radiation performance of the active element may be improved, as compared with the case of implementing the molding part using an EMC according to the related art. | 05-29-2014 |
20140146498 | ELECTRONIC COMPONENT PACKAGE - Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art. | 05-29-2014 |
20140338955 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board. According to a preferred embodiment of the present invention, the printed circuit board, includes: a base board; an upper build-up layer which is formed on the base board and includes an upper insulating layer and an upper circuit layer having at least one layer; and a lower build-up layer which is formed beneath the base board, has a different thickness from the upper build-up layer, and includes a lower insulating layer and a lower circuit layer having at least one layer. | 11-20-2014 |
20150014034 | PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity. | 01-15-2015 |