Patent application number | Description | Published |
20110013341 | MULTILAYER CHIP CAPACITOR - Disclosed is a multilayer chip capacitor including a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes of opposite polarity disposed on an outer face of the capacitor body, first and second inner electrodes opposing each other inside the capacitor body to interpose the dielectric layer therebetween, the first inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the first outer electrode, and the second inner electrode comprising an electrode plate forming capacitance and a lead extending from the electrode plate and connected to the second outer electrode. The leads are bent at least once and each have an overlap portion overlapping a lead of an adjacent inner electrode of opposite or like polarity when viewed along a stacked direction in which the plurality of dielectric layers are stacked. | 01-20-2011 |
20110056735 | MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE - There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second inner electrodes opposing each other, interleaved with the dielectric layers in the capacitor body, and each including an electrode plate forming capacitance and a lead extending from the electrode plate, the lead of the first inner electrode and the lead of the second electrode being respectively connected to the first and second outer electrodes, and third inner electrodes interposed between the first and second inner electrodes. At least one of the third inner electrodes adjacent to the first inner electrode includes a conductive pattern having the same shape as the lead of the first inner electrode and is connected to the first outer electrode. At least one of the third inner electrodes adjacent to the second inner electrode includes a conductive pattern having the same shape as the lead of the second inner electrode and is connected to the second outer electrode. | 03-10-2011 |
20110309895 | MULTILAYER FILTER - A multilayer filter includes: a ceramic body in which a plurality of dielectric layers are laminated; an external ground electrode provided on an outer surface of the ceramic body and connected to a ground; an inductor pattern electrode provided on at least one of the dielectric layers and having one end connected to the external ground electrode; a capacitor pattern electrode provided on at least one of the dielectric layers; an external terminal electrode electrically connecting the inductor pattern electrode to the capacitor pattern electrode and forming a closed loop for generating inductance through the external ground electrode; and a variable dielectric layer provided between the capacitor pattern electrode and the inductor pattern electrode and adjusting a magnitude of inductance generated by the inductor pattern electrode. | 12-22-2011 |
20110317327 | Multi-layered ceramic capacitor - There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer and a plurality of ceramic layers are stacked therebetween, first and second external electrodes each formed on an outer surface of the sintered ceramic body part, a plurality of first and second internal electrode groups adjacent to each other in a stacking direction of the plurality of ceramic layers, having the ceramic layer therebetween, and including 2N or 2N+1 (N is an integer number larger than 1) internal electrodes electrically connected to the first and second external electrodes, wherein the 2N or 2N+1 (N is an integer number larger than 1) internal electrodes are disposed to face at least one internal electrode of other adjacent internal electrode groups. A length of each internal electrode has a pyramid shape. | 12-29-2011 |
20120327555 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths. | 12-27-2012 |
20120327556 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 12-27-2012 |
20120327557 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 12-27-2012 |
20130094119 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 04-18-2013 |
20130094123 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. | 04-18-2013 |
20130155574 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability. | 06-20-2013 |
20130169399 | THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME - There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance. | 07-04-2013 |
20130208400 | CHIP TYPE LAMINATED CAPACITOR - There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 □m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths. | 08-15-2013 |
20140196937 | MULTI-LAYERED CAPACITOR AND CIRCUIT BOARD MOUNTED WITH MULTI-LAYERED CAPACITOR - Disclosed herein is a multi-layered capacitor, including: an element formed by alternately multi-layering a dielectric layer and an internal electrode; and external terminals disposed at both ends of the element, wherein the dielectric layer disposed at an upper end U and a lower end L of the element is formed of a paraelectric material and the dielectric layer disposed at a central part C of the element is formed of a ferroelectric material. | 07-17-2014 |