Patent application number | Description | Published |
20100120803 | 3,4-DIHYDROQUINAZOLINE DERIVATIVES - The present invention relates to 3,4-dihydroquinazoline derivatives, a process of preparing them and a pharmaceutical composition including them. The 3,4-dihydroquinazoline derivatives of the present invention have excellent T-type calcium channel blocking effect and anti-cancer activity. | 05-13-2010 |
20130021768 | CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME - Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided. | 01-24-2013 |
20130057559 | DISPLAY DEVICES - A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis. | 03-07-2013 |
20130155653 | DISPLAY DEVICES, AND DISPLAY AND ELECTRONIC SYSTEMS INCLUDING THE DISPLAY DEVICES - A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board. | 06-20-2013 |
20130208426 | SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING THE SAME - A semiconductor chip and a first heat dissipation pattern are mounted on a substrate. The first heat dissipation pattern has an opening therein and exposes the semiconductor chip therethrough. A second heat dissipation pattern including a thermal interface material (TIM) is interposed between a side surface of the semiconductor chip and the first heat dissipation pattern. | 08-15-2013 |
20140167245 | SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS USING THE SAME - A semiconductor package includes a flexible base film having a first surface opposing a second surface, a semiconductor chip mounted on the first surface of the base film, and a touch sensing structure including at least one conductive pattern adjacent to the semiconductor chip. The at least one conductive pattern is disposed through the base film and has a surface exposed at the second surface of the base film. A contact condition of the semiconductor package is determined based on detection of a conductive path between the at least one conductive pattern and a conductive frame or support surface of the semiconductor package. The contact condition provides an indication of heat dissipation that may be expected to occur for the chip during operation. | 06-19-2014 |