Patent application number | Description | Published |
20110262825 | FUEL CELL SEPARATOR MATERIAL, FUEL CELL SEPARATOR USING SAME, AND FUEL CELL STACK - A fuel cell separator material, comprising an alloy layer | 10-27-2011 |
20120009496 | FUEL CELL SEPARATOR MATERIAL, FUEL CELL SEPARATOR USING SAME, FUEL CELL STACK, AND METHOD FOR PRODUCING FUEL CELL SEPARATOR MATERIAL - A fuel cell separator material, comprising an alloy layer 6 containing Au and a first component containing Al, Cr, Co, Ni, Cu, Mo, Sn or Bi, or an Au single layer | 01-12-2012 |
20140295322 | MATERIAL FUEL CELL SEPARATOR, FUEL CELL SEPARATOR USING SAME, FUEL CELL STACK, AND METHOD OF PRODUCING FUEL CELL SEPARATOR MATERIAL - A material for fuel cell separator, wherein a surface layer | 10-02-2014 |
20140329107 | METAL MATERIAL FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material | 11-06-2014 |
20150047879 | METALLIC MATERIAL FOR ELECTRONIC COMPONENTS, AND CONNECTOR TERMINALS, CONNECTORS AND ELECTRONIC COMPONENTS USING SAME - The present invention provides a metallic material for electronic components having a low degree of whisker formation and a high durability, and connector terminals, connectors and electronic components using the metallic material. The metallic material for electronic components includes: a base material; on the base material, an lower layer constituted with one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co and Cu; on the lower layer, an upper layer constituted with an alloy composed of one or both of Sn and In (constituent elements A) and one or two or more of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir (constituent elements B), wherein the thickness of the lower layer is 0.05 μm or more; the thickness of the upper layer is 0.005 μm or more and 0.6 μm or less; and in the upper layer, the relation between the ratio, the constituent elements A/(the constituent elements A+the constituent elements B) [mass %] (hereinafter, referred to as the proportion of Sn+In) and the plating thickness [μm] is given by | 02-19-2015 |
20150255906 | ELECTRONIC COMPONENT METAL MATERIAL AND METHOD FOR MANUFACTURING THE SAME - There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material | 09-10-2015 |
20150259813 | SURFACE TREATED PLATING MATERIAL AND METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENTS - The present invention provides a surface treated plating material being suppressed in the occurrence of whiskers, maintaining satisfactory solderability and satisfactory contact resistance even when exposed to a high temperature environment, and being low in the terminal-connector insertion force. The surface treated plating material is a plating material including: a metal base material; a lower layer constituted with Ni or Ni alloy plating; and an upper layer constituted with Sn or Sn alloy plating, wherein the lower layer and the upper layer are sequentially formed on the metal base material; P and N are present on the upper layer surface; the amounts of the P and N elements deposited on the upper layer surface are respectively P: 1×10 | 09-17-2015 |
20150295333 | ELECTRONIC COMPONENT METAL MATERIAL AND METHOD FOR MANUFACTURING THE SAME - There are provided an electronic component metal material which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The electronic component metal material | 10-15-2015 |