Patent application number | Description | Published |
20090263153 | CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS - There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency. | 10-22-2009 |
20100047968 | ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME - The present invention relates to an adhesive sheet for producing a semiconductor device, which is used when a semiconductor element is caused to adhere onto an adherend and the semiconductor element is wire-bonded, in which a lipophilic lamellar clay mineral is contained. | 02-25-2010 |
20100313667 | PRESSURE-SENSITIVE ADHESIVE SHEET FOR TESTING - Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection. | 12-16-2010 |
20110065217 | PRESSURE-SENSITIVE ADHESIVE SHEET AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE HAVING SAME - A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the base film contains conductive fibers, and in which an electrically conductive path is formed between the pressure-sensitive adhesive layer and the base film. With this structure, an electrical continuity test can be performed even in a condition where a semiconductor wafer or a semiconductor chip formed by dicing the semiconductor wafer is applied, and deformation (warping) and damage of the semiconductor wafer and generation of flaws and scratches on the backside can be prevented in the test. | 03-17-2011 |
20110088721 | CLEANING SHEET, TRANSFER MEMBER PROVIDED WITH CLEANING FUNCTION, AND METHOD FOR CLEANING SUBSTRATE PROCESSING APPARATUS - A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus. | 04-21-2011 |
20110290468 | HEAT CONDUCTIVE ADHESIVE COMPOSITION AND HEAT CONDUCTIVE ADHESIVE SHEET - An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 μm or more and 300 μm or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 μm or more and 20 μm or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 μm and 60 μm or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 μm and 300 μm or less. | 12-01-2011 |
20130068419 | THERMALLY CONDUCTIVE REINFORCING SHEET, MOLDED ARTICLE AND REINFORCING METHOD THEREOF - A thermally conductive reinforcing sheet includes a reinforcing layer. After the thermally conductive reinforcing sheet is attached to an aluminum board having a thickness of 1.0 mm and is heated at 80° C. for 10 minutes, the bending strength at a displacement of 1 mm of the resulting sheet is 10 N or more and the thermal conductivity of the reinforcing layer is 0.25 W/m·K or more. | 03-21-2013 |
20130101772 | THERMALLY CONDUCTIVE REINFORCING COMPOSITION, THERMALLY CONDUCTIVE REINFORCING SHEET, REINFORCING METHOD, AND REINFORCING STRUCTURE - A thermally conductive reinforcing composition includes a curing component, a rubber component, and thermally conductive particles. | 04-25-2013 |
20130244020 | BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER, PRODUCING METHOD THEREOF, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER - A bubble-containing thermally conductive resin composition layer contains at least: (a) an acrylic polymer containing an alkyl (meth)acrylate as a monomer main component; (b) thermally conductive particles; and (c) bubbles. | 09-19-2013 |
20130302659 | THERMALLY CONDUCTIVE MEMBER, AND BATTERY DEVICE USING THE SAME - An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more. | 11-14-2013 |
20140004342 | FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET | 01-02-2014 |
20140037924 | FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET - A flame-retardant thermally-conductive pressure-sensitive adhesive sheet includes a substrate and a flame-retardant thermally-conductive pressure-sensitive adhesive layer provided on at least one surface of the substrate. The substrate includes a polyester film and the thickness of the polyester film is 10 to 40 μm, and the thermal resistance of the flame-retardant thermally-conductive pressure-sensitive adhesive sheet is 10 cm | 02-06-2014 |
20140090196 | CLEANING SHEET, CARRYING MEMBER WITH A CLEANING FUNCTION AND METHOD OF CLEANING SUBSTRATE PROCESSING EQUIPMENT - A cleaning sheet comprising a cleaning layer and a releasable protective film laminated on the cleaning layer, wherein each of the relative intensities of the fragment ions Of CH | 04-03-2014 |
20140090199 | CLEANING SHEET, CARRYING MEMBER WITH A CLEANING FUNCTION AND METHOD OF CLEANING SUBSTRATE PROCESSING EQUIPMENT - A cleaning sheet comprising a cleaning layer and a releasable protective film laminated on the cleaning layer, wherein each of the relative intensities of the fragment ions of CH | 04-03-2014 |
20140311525 | LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION - A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer. | 10-23-2014 |
20140311666 | LABEL SHEET FOR CLEANING AND CONVEYING MEMBER HAVING CLEANING FUNCTION - A label sheet for cleaning is formed of a label for cleaning including a cleaning layer having a 180° peeling adhesion to a silicon wafer of 0.20 N/10 mm or less after receiving an active energy and an adhesive layer provided on one of surfaces of said cleaning layer, and a separator on which the label is removably provided through the adhesive layer. | 10-23-2014 |