Patent application number | Description | Published |
20090289360 | WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING - A method of forming an electronic assembly including a plurality of IC die having bonding terminals that have a solderable material thereon and a workpiece. The workpiece includes workpiece contact pads including an elevated ring having a ring height at least 5 μm above a minimum contact pad height in an indented bonding region that is within the elevated ring. The bonding terminals and/or the plurality of workpiece contact pads include solder thereon. A plurality of IC die are mounted on the workpiece. Heat is applied so that the solder becomes tacky while remaining below its melting temperature to obtain a tacked position. The plurality of IC die are pressed using a pressing tool to heat the solder to a peak temperature that is above the melting temperature. The elevated ring resists horizontal movement of the plurality of IC die from their tacked positions during pressing. | 11-26-2009 |
20090291524 | COMBINED METALLIC BONDING AND MOLDING FOR ELECTRONIC ASSEMBLIES INCLUDING VOID-REDUCED UNDERFILL - A method for forming electronic assemblies includes providing a plurality of IC die each having IC bonding conductors and a workpiece having workpiece bonding conductors. A curable dielectric film is applied to the IC bonding conductors or the workpiece surface. The plurality of IC die are placed on the workpiece surface so that the plurality of IC bonding conductors are aligned to and face the plurality of workpiece bonding conductors to provide a first bonding. The placing is performed at a vacuum level corresponding to a pressure <1 kPa, and at a temperature sufficient to provide tackiness to the curable dielectric film. The plurality of IC die are then pressed to provide a second bonding. A temperature during pressing cures the curable dielectric film to provide an underfill and forms metallic joints between the plurality of IC bonding conductors and the plurality of workpiece bonding conductors. | 11-26-2009 |
20100044883 | Plastic Semiconductor Package Having Improved Control of Dimensions - A device with a semiconductor chip assembled on a planar substrate and encapsulation compound surrounding the assembled chip and a portion of the substrate near the chip; the compound has a planar top area. The encapsulation compound has a plurality of side areas reaching from the substrate to the top area; these side areas form edge lines with the top area, where the top area plane intersects with the respective plane of each side area. The encapsulation compound is recessed along the edge lines so that the material is caved-in along the lines; this feature causes the recess to prevent any compound from the side area planes to reach the top area plane, whereby the planarity of the top area is preserved. | 02-25-2010 |
20100159643 | BONDING IC DIE TO TSV WAFERS - A method for bonding IC die to TSV wafers includes bonding at least one singulated IC die to respective ones of a plurality of IC die on a TSV wafer that includes a top semiconductor surface and TSV precursors including embedded TSV tips to form a die-wafer stack. The die-wafer stack is thinned beginning from the bottom surface of the TSV wafer to form a thinned die-wafer stack. The thinning includes exposing the embedded TSV tips to provide electrical access thereto from the bottom surface of the TSV wafer. The thinned die-wafer stack can be singulated to form a plurality of thinned die stacks. | 06-24-2010 |
20100159699 | SANDBLAST ETCHING FOR THROUGH SEMICONDUCTOR VIAS - To provide selective exposure of the TSV tip through a semiconductor wafer without undercut, the inventor has developed a new method of semiconductor device formation. An embodiment of the present teachings can include the use of sandblasting to remove a portion of the semiconductor wafer to expose the TSV tip without the need for additional wet and/or dry etching. | 06-24-2010 |
20110018115 | POP PRECURSOR WITH INTERPOSER FOR TOP PACKAGE BOND PAD PITCH COMPENSATION - An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm. | 01-27-2011 |
20110183464 | DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS - A method of forming stacked electronic articles using a through substrate via (TSV) wafer includes mounting a first carrier wafer to a top side of the TSV wafer using a first adhesive material that has a first debonding temperature. The TSV wafer is thinned from a bottom side of the TSV wafer to form a thinned TSV wafer. A second carrier wafer is mounted to the bottom side of the TSV wafer using a second adhesive material that has a second debonding temperature that is higher as compared to the first debonding temperature. The thinned TSV wafer is heated to a temperature above the first debonding temperature to remove the first carrier wafer from the thinned TSV wafer. At least one singulated IC die is bonded to TSV die formed on the top surface of the thinned TSV wafer to form the stacked electronic article. | 07-28-2011 |
20110309523 | POP PRECURSOR WITH INTERPOSER FOR TOP PACKAGE BOND PAD PITCH COMPENSATION - An electronic assembly adapted for forming package on package (PoP) devices includes a package substrate having a molded IC die thereon that defines a mold cap height and substrate contact pads lateral to the molded IC die. An interposer including an interposer substrate has bottom metal land pads and top metal land pads, interposer vias, and an open receptacle region formed through the interposer substrate. The substrate top surface is positioned relative to the interposer so that the molded IC die is within the open receptacle region to align the bottom metal land pads and substrate contact pads. An underfill layer is between the substrate top surface and the bottom side of the interposer substrate. A step height from the mold cap height minus a height of the top metal land pads is generally from 0 to 0.2 mm. | 12-22-2011 |
20140117469 | TSV-MEMS COMBINATION - A through-substrate via (TSV)-MEMS combination includes a TSV die including a substrate and a plurality of TSVs which extend of a full thickness of the substrate. The TSV die includes a top side surface including circuitry and top side bonding pads thereon, a bottom side surface including bottom side bonding features thereon, and a through-hole through the full thickness of the substrate. A microelectromechanical systems (MEMS) die having a floating sensing structure including solder balls thereon is bound to the top side bonding pads or bottom side bonding features of the TSV die. A layer of adhesive material is surrounding the solder balls, which can provide a sealant ring for the TSV-MEMS bonds. | 05-01-2014 |
Patent application number | Description | Published |
20090176336 | Method of Manufacturing a Semiconductor Device - The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements | 07-09-2009 |
20100015759 | POP Semiconductor Device Manufacturing Method - The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate 400 that includes on the surface multiple semiconductor chips 410 and liquid resin 434 supplied to multiple semiconductor devices is supported by an electrically insulated lower die 200. An upper die 110 in which multiple shape-forming parts (cavities) 112 are formed is pressed against lower die 200 through the medium of a polymer release film 300, and liquid resin 434 on the substrate is molded. | 01-21-2010 |
20110151623 | EXPOSED MOLD - A method for forming a semiconductor device can include providing a patterned layer of mold compound having a plurality of individual mold compound structures overlying a base film. The plurality of mold compound structures are aligned with a plurality of semiconductor dice to interpose the individual mold compound structures between the plurality of semiconductor dice. A pressure is applied to the individual mold compound structures to fill spaces between each of the plurality of semiconductor dice with the mold compound. The mold compound structures can be formed on the base film using a photosensitive mold compound. The mold compound structures can also be formed through the use of a patterned mask and a screen printing process. | 06-23-2011 |
20110254150 | Method of Manufacturing a Semiconductor Device - The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements | 10-20-2011 |
Patent application number | Description | Published |
20110278890 | MASSAGE CHAIR - A massage chair includes a seat, a backrest and a front cover. The front cover is shaped to cover the front face of the backrest and the top face of the seat. The upper and lower ends of the front cover are detachably attached to the upper part of the backrest and the front part of the seat through upper and lower attachments, respectively. The left and right ends of the front cover are detachably attached only to the left and right ends of the seat through left and right attachments, respectively. The attachment positions of the left and right ends of the front cover correspond to positions of the left and right ends of the seat, respectively. | 11-17-2011 |
20110316316 | MASSAGE CHAIR - A massage chair includes a main frame, a seat, and a backrest. The main frame includes a back frame configured to support the backrest and a base frame configured to support the seat. The base frame is formed by combining a plurality of structural members. The plurality of structural members are arranged on positions corresponding to edges of a hexahedron. Part of the back frame serves as part of the structural members of the base frame. | 12-29-2011 |
20120157898 | MASSAGER - Provided is a massager which enables armrests to be used effectively even with a backrest in a reclined state. The massager includes: a backrest having a massaging mechanism for massaging the back of a user; a frame which supports the backrest in such a manner that the backrest can be reclined backwards; a pair of armrests which extend forward respectively from left and right side positions of the backrest; and a linking mechanism which changes an attitude of the pair of armrests in conjunction with a reclining operation of the backrest, in such a manner that a rear part of each armrest falls lower than the front part of each armrest, when the backrest is reclined backward. | 06-21-2012 |
20120157899 | MASSAGER - A massager in which a backrest and side walls holding massage members have a unified form, is provided. The massager has: a backrest including, in an integrated fashion, a backrest section in which a massage mechanism for massaging a user's back is provided, and a pair of projecting sections which project to the left and right-hand sides from at least the upper part of the backrest section; side walls which respectively project forwards from front surfaces of the pair of projecting sections; and air bags which are provided respectively on inner side faces of the pair of side walls and used for massaging the sides of the user leaning against the backrest section. | 06-21-2012 |