Patent application number | Description | Published |
20080203563 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A COF package in exemplary form includes a flexible base film, inner leads each made of metal and having a thickness d | 08-28-2008 |
20090115034 | Semiconductor device - A semiconductor device according to the present invention includes a base tape (film carrier tape); a semiconductor chip mounted on the base tape; conducting leads formed on the base tape to be connected to the semiconductor chip; input terminals and output terminals connected to the conducting leads; and a protecting layer formed to cover the conducting leads completely. The base tape is provided at its side edges with roller-contact regions, where carrier rollers are to be in contact with. No holes and no unevenness area is formed on the roller-contact regions. | 05-07-2009 |
20090146287 | Semiconductor device having a chip-size package - Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180° toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith includes the steps of: depositing solder balls on electrode pads of the mother board; and placing the semiconductor device on the mother board and melting the solder balls so as to electrically connect the electrode pads of the mother board and the external electrode pads of the semiconductor device. | 06-11-2009 |
20110109933 | CUSTOM PAPER INFORMATION CONVERTER - A method for generating custom postscript printer description files, the method including obtaining paper type information, obtaining an original postscript printer description file, converting the paper type information into a postscript printer description format, inserting the converted paper type information into the original postscript printer description file to create a custom postscript printer description file, and storing the custom postscript printer definition file. | 05-12-2011 |
20120190746 | AFLATOXIN PRODUCTION INHIBITOR AND METHOD FOR CONTROLLING AFLATOXIN CONTAMINATION USING THE SAME - The present invention relates to provide an aflatoxin production inhibitor that inhibits aflatoxin production specifically and efficiently, is highly safe, and is practical, and an efficient production method thereof; and a method for controlling aflatoxin contamination that uses the aflatoxin production inhibitor, specifically relating to an aflatoxin production inhibitor that includes at least one of a dioctatin represented by the following formula (I) and a derivative thereof, as an active ingredient: | 07-26-2012 |
20120244697 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE - A semiconductor device that improves the heat cycle resistance and power cycle resistance of a power module. An electrode member in which copper posts are formed in a plurality of perforations cut in a support made of a ceramic material is soldered onto a side of an IGBT where an emitter electrode is formed. By soldering the copper posts onto the electrode, heat generated in the IGBT is transferred to the electrode member and is radiated. In addition, even if a material of which the IGBT is made and copper differ in thermal expansivity, stress on a soldered interface is reduced and distortion is reduced. This suppresses the appearance of a crack. As a result, the heat cycle resistance and power cycle resistance of a power module can be improved. | 09-27-2012 |
20120254980 | Switching hub, a system, a method of the switching hub and a program thereof - A switching hub, system and method for restricting a communication between terminals within a second network isolated form a first network. The terminals are connected to the first network or the second network, wherein a terminal with sufficient security level is connected to the first network and a terminal with insufficient security level is connected to the second network. And a communication between the terminals within the second network is restricted. | 10-04-2012 |
20130005953 | Readthrough Inducing Agent and Drug for Treating Genetic Disease Caused by Nonsense Mutation - A readthrough inducing agent for inducing readthrough of a premature stop codon generated by nonsense mutations, the readthrough inducing agent comprising a compound having a structure expressed by the following Structural Formula (A), and a drug for treating a genetic disease caused by nonsense mutations, the drug comprising the readthrough inducing agent. | 01-03-2013 |
20130081139 | QUARANTINE NETWORK SYSTEM, SERVER APPARATUS, AND PROGRAM - A quarantine network system | 03-28-2013 |