Patent application number | Description | Published |
20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
20090314438 | Supporting plate peeling apparatus - A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate. | 12-24-2009 |
20100000680 | SEPARATING APPARATUS AND SEPARATING METHOD - A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes | 01-07-2010 |
20100310817 | SUPPORT PLATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PROCESSING SUBSTRATE - This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive. | 12-09-2010 |
20100314043 | STICKING METHOD AND STICKING APPARATUS - A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate | 12-16-2010 |
20110259527 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 10-27-2011 |
20120118511 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer, positioned on a surface of the supporter to which surface the substrate is attached, and made of a compound having an infrared-absorbing structure. | 05-17-2012 |
20130000852 | STRIPPING DEVICE AND STRIPPING METHOD - A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate. | 01-03-2013 |
20130113147 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus including a transfer unit for transferring, under reduced pressure, a laminate including a wafer and a support plate which are bonded to each other and supported by use of support pins that supports an inner periphery of a first surface of the wafer, the first surface being opposite to a second surface of the wafer onto which a second surface the support plate is bonded. | 05-09-2013 |
20130213582 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of an inorganic material and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting layer, and the release layer having a flat surface which faces the adhesive layer. | 08-22-2013 |
20130220554 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member. | 08-29-2013 |
20140166209 | LAMINATE AND METHOD FOR SEPARATING THE SAME - A laminate including a supporter which transmits infrared; a substrate supported by the supporter; an adhesive layer via which the supporter and the substrate are attached to each other; and a separation layer positioned on a surface of the supporter to which surface the substrate is attached, and which is made of a compound having an infrared-absorbing structure. A target is tightly attached and supported in the laminate while securing easy separation of a supporter from the target. | 06-19-2014 |
20140169929 | TRANSPORT ARM, TRANSPORT APPARATUS AND TRANSPORT METHOD - A transport arm including a holding unit that holds a substrate by vacuum adsorption. The holding unit has an air discharge port and an adsorption member formed so as to surround the air discharge port. The adsorption member is a squeeze packing. | 06-19-2014 |
20140311680 | LAMINATED BODY AND METHOD FOR SEPARATING LAMINATED BODY - A laminate including a supporting member which is light transmissive; a supported substrate which is supported by the supporting member; an adhesive layer which is provided on a surface of the supported substrate on which surface the supported substrate is supported by the supporting member; and a release layer, which (i) is provided between the supporting member and the supported substrate and (ii) contains a polymer including, in a repeating unit, a structure having a light absorption property, a property of the polymer being changed when the polymer absorbs light irradiated via the supporting member. | 10-23-2014 |
20140318714 | SUPPORTING MEMBER SEPARATION APPARATUS AND SUPPORTING MEMBER SEPARATION METHOD - A supporting member separation apparatus that separates a supporting member from a laminate having a substrate, an adhesive layer, a release layer which has a property that changes when it absorbs light, and the supporting member which are laminated in this order. The apparatus includes a holding unit that holds one surface of the laminate, a lifting and lowering unit that lifts and lowers the holding unit, and an adjustment unit that maintains a constant applied force to the holding unit. | 10-30-2014 |
20140332147 | STICKING APPARATUS AND STICKING METHOD - A sticking apparatus including a pair of plate members sandwiching a laminate between the pair of plate members, and supporting members supporting the plate members. The supporting members supporting at least one of the plate members are located in a form of multiple dots or lines adjacent to each other at regular intervals on the plate member. | 11-13-2014 |
20140374017 | BONDING METHOD AND BONDING APPARATUS - A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. | 12-25-2014 |
20150013917 | PROCESSING METHOD AND PROCESSING APPARATUS - A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. | 01-15-2015 |