Patent application number | Description | Published |
20090009979 | Substrate Joining Member and Three-Dimensional Structure Using the Same - Three-dimensional structure ( | 01-08-2009 |
20090026634 | ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD - An electronic part mounting structure includes electronic part ( | 01-29-2009 |
20090215287 | Substrate Connecting Member and Connecting Structure - A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals. | 08-27-2009 |
20090266582 | THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. | 10-29-2009 |
20090268423 | INTERCONNECT SUBSTRATE AND ELECTRONIC CIRCUIT MOUNTED STRUCTURE - Interconnect substrate ( | 10-29-2009 |
20090321122 | RELAY SUBSTRATE, METHOD FOR MANUFACTURING THE RELAY SUBSTRATE AND THREE-DIMENSIONAL CIRCUIT DEVICE USING THE RELAY SUBSTRATE - Relay substrate ( | 12-31-2009 |
20100008056 | STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN - A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting. | 01-14-2010 |
20100029044 | CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - Conductive bump ( | 02-04-2010 |
20100052189 | ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - Electronic component mounting structure ( | 03-04-2010 |
20120125676 | THREE-DIMENSIONAL CIRCUIT BOARD AND ITS MANUFACTURING METHOD - A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape. | 05-24-2012 |