Patent application number | Description | Published |
20080197501 | INTERCONNECTION SUBSTRATE AND SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF INTERCONNECTION SUBSTRATE - An interconnection substrate including therein one or more resin layers, each of the resin layers including therein a via-hole penetrating from a top surface to a bottom surface of the resin layer. A via-plug of metal particles is formed in the via-hole. Each of the metal particles has a flat shape generally parallel to a plane of the resin layer. | 08-21-2008 |
20090212013 | METHOD FOR MANUFACTURING ELECTRODE FOIL - A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine particles, forming the composite fine particles into an aerosol, jetting the aerosol to the metal foil in an atmosphere under a reduced pressure, depositing the composite fine particles onto the metal foil to form a aerosol deposition layer, and removing selectively the resin from the aerosol deposition layer to form the valve metal layer. | 08-27-2009 |
20090316333 | METHOD FOR MANUFACTURING CAPACITOR, AND CAPACITOR - A method for manufacturing a capacitor, includes: accelerating conductor particles by ejecting the conductor particles together with gas, each surface of the conductor particles covered with a dielectric entirely; fixing the conductor particles to a substrate with the surface of the conductor particles still covered with the dielectric entirely by colliding the conductor particles with the substrate; and sandwiching a deposited film formed of the conductor particles fixed to the substrate between electrodes. | 12-24-2009 |
20100123996 | STRUCTURAL BODY, CAPACITOR, AND METHOD OF FABRICATING THE CAPACITOR - A structural body which includes a first dielectric layer formed on a first substrate and including first conductive particles, each surface of the first conductive particles being entirely covered with a first dielectric film; and a second dielectric layer formed on the first dielectric layer wherein a volume ratio of a dielectric in the second dielectric layer is higher than a volume ratio of a dielectric in the first dielectric layer. | 05-20-2010 |
20120074521 | METHOD OF MANUFACTURING CAPACITOR, AND CAPACITOR, CIRCUIT SUBSTRATE AND SEMICONDUCTOR APPARATUS - A method of manufacturing a capacitor includes forming a first ceramic film on a first base made of a metal, forming a second ceramic film on a second base made of a metal, forming a first copper electrode pattern and a first copper via-plug on a surface of one of the first and second ceramic films, the electrode pattern and the via-plug being separate from each other, bonding the first and second ceramic films together with the first electrode pattern and the via-plug therebetween, by applying a pulsed voltage between the first base and the second base while the first base and the second base are pressed so that the first ceramic film and the second ceramic film are pressed on each other, and removing the second base. | 03-29-2012 |
20120300371 | ELECTRODE FOIL, METHOD OF MANUFACTURING ELECTRODE FOIL, AND ELECTROLYTIC CAPACITOR - An electrode foil includes a structure a structure in which metal particles and ceramic particles, which primarily include at least one of valve metal particles having a dielectric constant and ceramic particles, are deposited on a surface of a metal foil. | 11-29-2012 |
20130038981 | CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR - A method of manufacturing a capacitor includes forming, above a first metal foil, a first dielectric film of a ceramic material containing barium oxide by blowing dry ceramic particles to the first metal foil from a nozzle, forming, in the first dielectric film, a first via conductor connected to the first metal foil and a second via conductor connected to the first metal foil, forming, above the first dielectric film, a first electrode pattern connected to the first via conductor, and patterning the first metal foil to form a second electrode pattern connected to the second via conductor. | 02-14-2013 |
20150143679 | METHOD FOR MANUFACTURING CAPACITOR, AND CAPACITOR - A method for manufacturing a capacitor, includes: accelerating conductor particles by ejecting the conductor particles together with gas, each surface of the conductor particles covered with a dielectric entirety; fixing the conductor particles to a substrate with the surface of the conductor particles still covered with the dielectric entirely by colliding the conductor particles with the substrate; and sandwiching a deposited film formed of the conductor particles fixed to the substrate between electrodes. | 05-28-2015 |