Patent application number | Description | Published |
20120132940 | OPTICAL SEMICONDUCTOR DEVICE - According to one embodiment, an optical semiconductor device includes an n-type semiconductor layer, a p-type semiconductor layer, and a functional part. The functional part is provided between the n-type semiconductor layer and the p-type semiconductor layers. The functional part includes a plurality of active layers stacked in a direction from the n-type semiconductor layer toward the p-type semiconductor layer. At least two of the active layers include a multilayer stacked body, an n-side barrier layer, a well layer and a p-side barrier layer. The multilayer stacked body includes a plurality of thick film layers and a plurality of thin film layers alternately stacked in the direction. The n-side barrier layer is provided between the multilayer stacked body and the p-type layer. The well layer is provided between the n-side barrier layer and the p-type layer. The p-side barrier layer is provided between the well layer and the p-type layer. | 05-31-2012 |
20120146045 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes a light emitting layer, a light transmitting layer and a first semiconductor layer. The light transmitting layer is transmittable with respect to light emitted from the light emitting layer. The first semiconductor layer contacts the light transmitting layer between the light emitting layer and the light transmitting layer. The light transmitting layer has a thermal expansion coefficient larger than a thermal expansion coefficient of the light transmitting layer, has a lattice constant smaller than a lattice constant of the active layer, and has a tensile stress in an in-plane direction. | 06-14-2012 |
20120217471 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting part. The n-type semiconductor layer includes a nitride semiconductor. The p-type semiconductor layer includes a nitride semiconductor. The light emitting part is provided between the n-type and the p-type semiconductor layers and includes an n-side barrier layer and a first light emitting layer. The first light emitting layer includes a first barrier layer, a first well layer, and a first AlGaN layer. The first barrier layer is provided between the n-side barrier layer and the p-type semiconductor layer. The first well layer contacts the n-side barrier layer between the n-side and the first barrier layer. The first AlGaN layer is provided between the first well layer and the first barrier layer. A peak wavelength λp of light emitted from the light emitting part is longer than 515 nanometers. | 08-30-2012 |
20120299015 | NITRIDE SEMICONDUCTOR DEVICE AND NITRIDE SEMICONDUCTOR LAYER GROWTH SUBSTRATE - According to one embodiment, a nitride semiconductor device includes a substrate and a semiconductor functional layer. The substrate is a single crystal. The semiconductor functional layer is provided on a major surface of the substrate and includes a nitride semiconductor. The substrate includes a plurality of structural bodies disposed in the major surface. Each of the plurality of structural bodies is a protrusion provided on the major surface or a recess provided on the major surface. An absolute value of an angle between a nearest direction of an arrangement of the plurality of structural bodies and a nearest direction of a crystal lattice of the substrate in a plane parallel to the major surface is not less than 1 degree and not more than 10 degrees. | 11-29-2012 |
20130062612 | NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER - According to one embodiment, a nitride semiconductor device includes a foundation layer, a first stacked intermediate layer, and a functional layer. The foundation layer includes an AlN buffer layer formed on a substrate. The first stacked intermediate layer is provided on the foundation layer. The first stacked intermediate layer includes a first AlN intermediate layer provided on the foundation layer, a first AlGaN intermediate layer provided on the first AlN intermediate layer, and a first GaN intermediate layer provided on the first AlGaN intermediate layer. The functional layer is provided on the first stacked intermediate layer. The first AlGaN intermediate layer includes a first step layer in contact with the first AlN intermediate layer. An Al composition ratio in the first step layer decreases stepwise in a stacking direction from the first AlN intermediate layer toward the first step layer. | 03-14-2013 |
20130087760 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR WAFER - According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer and configured to emit a light having a peak wavelength of 440 nanometers or more. Tensile strain is applied to the first semiconductor layer. An edge dislocation density of the first semiconductor layer is 5×10 | 04-11-2013 |
20130234106 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - According to one embodiment, a semiconductor light-emitting device includes: a first conductivity type first semiconductor layer containing a nitride semiconductor crystal and having a tensile stress in a (0001) surface; a second conductivity type second semiconductor layer containing a nitride semiconductor crystal and having a tensile stress in the (0001) surface; a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, containing a nitride semiconductor crystal, and having an average lattice constant larger than the lattice constant of the first semiconductor layer; and a first stress application layer provided on a side opposite to the light emitting layer of the first semiconductor layer and applying a compressive stress to the first semiconductor layer. | 09-12-2013 |
20130234151 | NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR WAFER - According to one embodiment, a nitride semiconductor element includes a foundation layer, a functional layer and a stacked body. The stacked body is provided between the foundation layer and the functional layer. The stacked body includes a first stacked intermediate layer including a first GaN intermediate layer, a first high Al composition layer of Al | 09-12-2013 |
20130237036 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER - According to one embodiment, a method for manufacturing a nitride semiconductor layer is disclosed. The method can include forming a first lower layer on a major surface of a substrate and forming a first upper layer on the first lower layer. The first lower layer has a first lattice spacing along a first axis parallel to the major surface. The first upper layer has a second lattice spacing along the first axis larger than the first lattice spacing. At least a part of the first upper layer has compressive strain. A ratio of a difference between the first and second lattice spacing to the first lattice spacing is not less than 0.005 and not more than 0.019. A growth rate of the first upper layer in a direction parallel to the major surface is larger than that in a direction perpendicular to the major surface. | 09-12-2013 |
20140045289 | METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a method is disclosed for manufacturing a nitride semiconductor layer. The method can include forming a first nitride semiconductor layer on a substrate in a reactor supplied with a first carrier gas and a first source gas. The first nitride semiconductor layer includes indium. The first carrier gas includes hydrogen supplied into the reactor at a first flow rate and includes nitrogen supplied into the reactor at a second flow rate. The first source gas includes indium and nitrogen and supplied into the reactor at a third flow rate. The first flow rate is not less than 0.07% and not more than 0.15% of a sum of the first flow rate, the second flow rate, and the third flow rate. | 02-13-2014 |
20140048819 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - According to one embodiment, a semiconductor light-emitting device includes: a first conductivity type first semiconductor layer containing a nitride semiconductor crystal and having a tensile stress in a (0001) surface; a second conductivity type second semiconductor layer containing a nitride semiconductor crystal and having a tensile stress in the (0001) surface; a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, containing a nitride semiconductor crystal, and having an average lattice constant larger than the lattice constant of the first semiconductor layer; and a first stress application layer provided on a side opposite to the light emitting layer of the first semiconductor layer and applying a compressive stress to the first semiconductor layer. | 02-20-2014 |
20140061693 | NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR WAFER - According to one embodiment, a nitride semiconductor wafer includes: a silicon substrate; a buffer section provided on the silicon substrate; and a functional layer provided on the buffer section and contains nitride semiconductor. The buffer section includes first to n-th buffer layers (n being an integer of 4 or more) containing nitride semiconductor. An i-th buffer layer (i being an integer of 1 or more and less than n) of the first to n-th buffer layers has a lattice length Wi in a first direction parallel to a major surface of the first buffer layer. An (i+1)-th buffer layer provided on the i-th buffer layer has a lattice length W(i+1) in the first direction. In the first to n-th buffer layers the i-th buffer layer and the (i+1)-th buffer layer satisfy relation of (W(i+1)−Wi)/Wi≦0.008. | 03-06-2014 |
20140084296 | NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR WAFER - A nitride semiconductor wafer includes a silicon substrate, a stacked multilayer unit, a silicon-containing unit, and an upper layer unit. The silicon substrate has a major surface. The stacked multilayer unit is provided on the major surface. The stacked multilayer unit includes N number of buffer layers. The buffer layers include an i-th buffer layer, and an (i+1)-th buffer layer provided on the i-th buffer layer. The i-th buffer layer has an i-th lattice length Wi in a first direction parallel to the major surface. The (i+1)-th buffer layer has an (i+1)-th lattice length W(i+1) in the first direction. A relation that (W(i+1)−Wi)/Wi≦0.008 is satisfied for all the buffer layers. The silicon-containing unit is provided on the stacked multilayer unit. The upper layer unit is provided on the silicon-containing unit. | 03-27-2014 |
20140084338 | SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR LAYER - According to one embodiment, a semiconductor wafer includes a substrate, an AlN buffer layer, a foundation layer, a first high Ga composition layer, a high Al composition layer, a low Al composition layer, an intermediate unit and a second high Ga composition layer. The first layer is provided on the foundation layer. The high Al composition layer is provided on the first layer. The low Al composition layer is provided on the high Al composition layer. The intermediate unit is provided on the low Al composition layer. The second layer is provided on the intermediate unit. The first layer has a first tensile strain and the second layer has a second tensile strain larger than the first tensile strain. Alternatively, the first layer has a first compressive strain and the second layer has a second compressive strain smaller than the first compressive strain. | 03-27-2014 |
20140124790 | NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR WAFER - According to one embodiment, a nitride semiconductor element includes a foundation layer, a functional layer and a stacked body. The stacked body is provided between the foundation layer and the functional layer. The stacked body includes a first stacked intermediate layer including a first GaN intermediate layer, a first high Al composition layer of Al | 05-08-2014 |
20140166978 | SEMICONDUCTOR LIGHT EMITTING DEVICE - According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting part. The n-type semiconductor layer includes a nitride semiconductor. The p-type semiconductor layer includes a nitride semiconductor. The light emitting part is provided between the n-type and the p-type semiconductor layers and includes an n-side barrier layer and a first light emitting layer. The first light emitting layer includes a first barrier layer, a first well layer, and a first AIGaN layer. The first barrier layer is provided between the n-side barrier layer and the p-type semiconductor layer. The first well layer contacts the n-side barrier layer between the n-side and the first barrier layer. The first AIGaN layer is provided between the first well layer and the first barrier layer. A peak wavelength λp of light emitted from the light emitting part is longer than 515 nanometers. | 06-19-2014 |
Patent application number | Description | Published |
20100179365 | METHOD AND APPARATUS FOR PRODUCING PROPYLENE - A method for producing propylene including: transferring a feed gas including dimethyl ether and/or methanol and C4 and/or C5 olefins into a reactor, and reacting the feed gas in the presence of a catalyst, the feed gas prior to transferring into the reactor having a (supplied C4 and/or C5 olefins)/(supplied dimethyl ether and methanol) ratio of 0.25 to 7.5, in terms of the molar ratio based on the number of carbon atoms, and the feed gas being contacted with the catalyst at 350° C. to 600° C.; and an apparatus for producing propylene including: a hydrogenation reactor in which alkynes and/or dienes contained in C4 and/or C5 hydrocarbons is partially hydrogenated to be converted into an olefin having one double bond; a reactor in which C4 and/or C5 hydrocarbons is reacted with dimethyl ether and/or methanol in the presence of a catalyst; and a separator for separating propylene from the reaction product. | 07-15-2010 |
20100179366 | PROCESS AND APPARATUS FOR PRODUCING PROPYLENE - A process for producing propylene, which including feeding at least one of dimethyl ether and methanol to a reactor to be reacted in the presence of a catalyst; supplying an obtained reaction product to a separator by which low-boiling compounds having a boiling point of −50° C. or lower at atmospheric pressure among the reaction product are separated; and recycling a proportion of at least 70% of a total amount of the separated low-boiling compounds to said reactor. | 07-15-2010 |
20110169794 | PHOTODETECTOR, PHOTODETECTOR ARRAY AND DISPLAY DEVICE WITH PHOTODETECTION - According to one embodiment, a photodetector includes a substrate, a first semiconductor region, a second semiconductor region, a third semiconductor region, an insulating film, a first electrode, a second electrode, and a shield film. The first semiconductor region is provided on a major surface of the substrate. The second semiconductor region and the third semiconductor region are provided in a substantially identical plane to the first semiconductor region. The second semiconductor region is contacted with the first semiconductor region and has an impurity concentration higher than the first semiconductor region. The third semiconductor region is contacted with the second semiconductor region. The shield film is provided on the insulating film and electrically connected to the first electrode. A periphery of the shield film is disposed to cover an interface between the second semiconductor region and the third semiconductor region in a planar view. | 07-14-2011 |
Patent application number | Description | Published |
20080291568 | MAGNETIC DISK APPARATUS AND METHOD FOR CONTROLLING MAGNETIC HEAD - A magnetic disk apparatus includes: a driving unit; a position error feedback control system; and a velocity control system. The driving unit is configured to move a magnetic head operative for magnetic recording/reproduction of information on a magnetic disk. The position error feedback control system is configured to perform feedback control of the driving unit based on difference between target track position and detected position of the magnetic head. The velocity control system is configured to vary a target velocity curve based on position of the magnetic head before motion, the target track position of the magnetic head, and position of a data sector to be subjected to recording/reproduction, for using a control mathematical model of the driving unit to control the driving unit so that velocity of the driving unit follows the target velocity curve. | 11-27-2008 |
20130074533 | AIR-CONDITIONING SYSTEM - According to one embodiment, an air conditioning system includes a compressor, a condenser, an expansion valve, a switching valve, an evaporator, a pump, a radiator, and a heat storage unit. The switching valve performs switching so that a first heat medium flows through either a first flow path or a second flow path. The pump supplies a second heat medium to the heat source. The heat storage unit has a heat storage material. The heat storage unit has a first heat exchange region in which heat is exchanged between the first heat medium flowing through the first flow path and the heat storage material. The heat storage unit has a second heat exchange region which is provided upstream of the radiator and in which heat is exchanged between the second heat medium supplied to the heat source and the heat storage material. | 03-28-2013 |
20140060794 | HEAT STORAGE APPARATUS, AIR CONDITIONING APPARATUS, AND HEAT STORAGE METHOD - A disclosure describes a heat storage apparatus to store heat generated by a heat generator via a medium includes: a first circuit closed to circulate the medium therethrough in a direction; a heat exchanger to exchange the heat; a heat storage tank including a phase change material to exchange heat with the medium; a first measurement unit to measure a temperature of the medium; a cooling unit to cool the medium when the temperature of the medium is higher than a predetermined target temperature and to set the temperature of the medium to be approximately equal to the target temperature; a count unit to count an elapsed time from when the phase change material exchanges heat with the medium and starts a phase change; and a determination unit to determine whether the phase change material is allowed to be supercooled or not based on the elapsed time. | 03-06-2014 |
20140262126 | COOLING APPARATUS AND COOLING METHOD - In one embodiment, a heat exchanger is provided at portion of a circulation circuit to provide heat from a heating element to a medium. A cooling unit is provided at portion of the circulation circuit to cool the medium. A heat storage tank is arranged between the heat exchanger and the cooling unit, and includes a phase change material. A bypass circuit bypasses the heat storage tank. A control valve is capable of switching a flow of the medium to one of the heat storage tank or the bypass circuit. A measurement unit measures a temperature of the phase change material. A determination unit uses the measured temperature and determines whether or not the phase change material is in a heat storable state. A control unit controls the control valve to switch the flow of the medium from the bypass circuit to the heat storage tank. | 09-18-2014 |