Patent application number | Description | Published |
20080277589 | SEMICONDUCTOR RADIOACTIVE RAY DETECTOR, RADIOACTIVE RAY DETECTION MODULE, AND NUCLEAR MEDICINE DIAGNOSIS APPARATUS - The present invention provides a semiconductor radioactive ray detector having the excellent energy resolution or time precision, a radioactive detection module, and a nuclear medicine diagnosis apparatus. The semiconductor radioactive ray detector has a structure in which plate-like elements made of cadmium telluride and conductive members are alternately laminated and the plate-like element made of cadmium telluride and the conductive member are adhered to each other with a conductive adhesive agent, and the Young's modulus of the conductive adhesive agent is in the range from 350 MPa to 1000 MPa, while the conductive members are made from a material with the linear expansion coefficient of the conductive members in the range from 5×10 | 11-13-2008 |
20100109052 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor chip in which LDMOSFET elements for power amplifier circuits used for a power amplifier module are formed, a source bump electrode is disposed on an LDMOSFET formation region in which a plurality of source regions, a plurality of drain regions and a plurality of gate electrodes for the LDMOSFET elements are formed. The source bump electrode is formed on a source pad mainly made of aluminum via a source conductor layer which is thicker than the source pad and mainly made of copper. No resin film is interposed between the source bump electrode and the source conductor layer. | 05-06-2010 |
20100172116 | SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME - A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO | 07-08-2010 |
20100230789 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A technology is provided which allows a reduction in the size of a semiconductor device without degrading an electromagnetic shielding effect and reliability against reflow heating. After a plurality of components are mounted over a component mounting surface of a module substrate, a resin is formed so as to cover the mounted components. Further, over surfaces (upper and side surfaces) of the resin, a shield layer including a laminated film of a Cu plating film and an Ni plating film is formed. In the shield layer, a plurality of microchannel cracks are formed randomly along grain boundaries and in a net-like configuration without being coupled to each other in a straight line, and form a plurality of paths extending from the resin to a surface of the shield layer by the microchannel cracks. | 09-16-2010 |
20110012263 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - In order to achieve the highly reliable and highly functional semiconductor device capable of the high-speed transmission by stacking thin chips and substrates, a connecting process and a connecting structure capable of making a solid connection at a low temperature with a low load and maintaining the shape of a connecting portion even if the connecting portion is heated in the stacking process and the subsequent mounting process are provided. In a semiconductor device in which semiconductor chips or wiring boards on which semiconductor chips are mounted are stacked, a connecting structure between electrodes of the stacked semiconductor chips or wiring boards includes a pair of electrodes mainly made of Cu and a solder layer made of Sn—In based alloy sandwiched between the electrodes, and Sn—Cu—Ni intermetallic compounds are dispersed in the solder layer. | 01-20-2011 |
20110128713 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a semiconductor device in which a plurality of wiring substrates each mounting an electronic component are stacked and sealed by a resin, the semiconductor device can be downsized, thinned, and highly reliable, and its manufacturing cost can be reduced. By using a metal paste for electrical connection between the stacked lower-layer side wiring substrate and upper-layer side wiring substrate, a connecting pitch can be smaller than that in a connecting method of using a solder ball including Cu core, and the connection at low temperature can be achieved. Also, by coating a metal paste by a print-coating method or a dispense-coating method, manufacturing steps are simplified, so that the manufacturing cost is reduced. | 06-02-2011 |
20110156225 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device achieving both electromagnetic wave shielding property and reliability in a heating process upon mounting electronic components. In the semiconductor device, mount devices | 06-30-2011 |
20110248389 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - An upper module board on which an integrated chip component with a low upper temperature limit is mounted and a lower module board on which a heat-generating semiconductor chip, a single chip component and an integrated chip component are mounted are electrically and mechanically connected via a plurality of conductive connecting members, and these are sealed together with mold resin. In such a circumstance, a shield layer made up of a stacked film of a Cu plating film and a Ni plating film is formed on side surfaces of the upper and lower module boards and surfaces (upper and side surfaces) of the mold resin, thereby realizing the electromagnetic wave shield structure. | 10-13-2011 |
20120292772 | SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME - A shielded electronic component including a wiring board, at least one semiconductor chip mounted on a main surface of the wiring board, a sealant which seals the whole of an upper surface of the wiring board, and a nickel (Ni) plating film formed on an upper surface of the sealant is provided. The Ni plating film is formed on a palladium (Pd) pretreatment layer formed on the upper surface of the sealant with using high-pressure CO | 11-22-2012 |
Patent application number | Description | Published |
20080309213 | SPARK PLUG FOR INTERNAL COMBUSTION ENGINE - In the spark plug, the ground electrode located so as to form a spark discharge gap with the center electrode thereof includes a ground base member fixed to the mounting fitting thereof and an electrode support member connected to the ground base member. The electrode support member has an opposed surface on which a projecting member is mounted so as to face the center electrode across from the spark discharge gap, and a retreating surface continuing the opposed surface and having such a shape as to approach a fore-end of the spark plug with distance from a junction between the projecting member and the opposed surface. The ground electrode further includes an angular portion at each of intersections between its back surface portion on which the electrode support member is provided, and the retreating surface. | 12-18-2008 |
20080314354 | SPARK PLUG AND CYLINDER HEAD ASSEMBLY ENSURING RELIABLE IGNITION OF AIR/FUEL MIXTURE - A spark plug and cylinder head assembly includes a spark plug and a cylinder head of an engine. The cylinder head has a bore and a surface which faces a combustion chamber of the engine and on which the bore opens. The spark plug is fit in the bore of the cylinder head, and includes a metal shell, an insulator retained in the metal shell, a center electrode secured in the insulator, and a ground electrode facing the center electrode through a spark gap. An end surface of the metal shell has an outer edge and an inner edge, and tapers from the outer edge to the inner edge in a direction toward the inside of an air pocket formed between the metal shell and the insulator. The outer edge of the end surface of the metal shell protrudes from the surface of the cylinder head into the combustion chamber. | 12-25-2008 |
20100139606 | BAFFLE PLATE - A baffle plate includes a discharge portion that discharges lubricating oil that has dropped onto the baffle plate, to an oil pan. The discharge portion extends to be inclined in a direction in which cylinders are arranged, with respect to a rotation central axis of a crankshaft. The discharge portion includes a guide groove in which an upstream portion in a rotational direction of the crankshaft is located under a counter weight, and a downstream portion in the rotational direction of the crankshaft is located under a crank bearing. The discharge portion includes a discharge hole that is formed in the downstream portion of the guide groove in the rotational direction, and that provides communication between the oil pan and an engine block. | 06-10-2010 |
Patent application number | Description | Published |
20100266451 | Sensing device - To shorten the time required for an oscillation frequency to stabilize in a sensing device sensing a substance to be sensed by using the fact that a natural frequency of a piezoelectric resonator changes when the substance to be sensed is adsorbed by an adsorption layer formed on the piezoelectric resonator. A sensing device includes: an oscillator circuit | 10-21-2010 |
20100313636 | Sensing device and sensing method - To provide a sensing device and a sensing method that, by a simple method of liquid supply to first and second excitation electrodes, makes it possible to make a first oscillation area adsorb an adsorption substance that adsorbs a substance to be sensed in a sample solution and a blocking substance that prevents the adsorption of a substance and to make the electrode in a second oscillation area adsorb the blocking substance. By the supply of a solution containing the adsorption substance to a first liquid storage space | 12-16-2010 |
20100319736 | Sensing device - To provide a sensing device having a high processing power and capable of high-accuracy measurement. It is determined whether or not an oscillation frequency is stabilized while a buffer solution is supplied to a quartz-crystal resonator | 12-23-2010 |
20100329928 | Sensing device - To provide a sensing device using a piezoelectric sensor having an oscillation area for detection and an oscillation area for reference and capable of achieving a high measurement sensitivity by improving shapes of excitation electrodes. On a quartz-crystal piece | 12-30-2010 |
20100329932 | Sensing device - To provide a sensing device that measures a substance to be sensed while letting a sample solution flow and has improved accuracy in detecting the substance to be sensed. The sensing device includes: a channel forming member | 12-30-2010 |
20110316522 | Sensing device - To provide a sensing device that holds a piezoelectric sensor and a channel forming member placed on the sensor in a closely contacted state while maintaining a shape of space of a passage space formed inside the device. In a sensing device | 12-29-2011 |
Patent application number | Description | Published |
20130033332 | QUARTZ-CRYSTAL CONTROLLED OSCILLATOR - An atmosphere temperature at which a quartz-crystal oscillator and an oscillation circuit are placed is controlled in high accuracy, and an output frequency with high stability is obtained. If oscillation outputs of first and second quartz-crystal oscillators are set to f | 02-07-2013 |
20130293312 | OSCILLATOR - An oscillator outputs a control signal to suppress an influence caused by temperature characteristic of f | 11-07-2013 |
20140132361 | HEATER DEVICE AND OSCILLATION APPARATUS - A heater device includes a temperature detector, a heater control circuit, a heater, a voltage supply path, and an overheat prevention circuit. The overheat prevention circuit includes a positive-temperature-coefficient thermistor and a pull-up resistor. The positive-temperature-coefficient thermistor is interposed on the voltage supply path in a position for being heated by the heater. The pull-up resistor that includes: one end connected between the heater and the positive-temperature-coefficient thermistor, and another end connected to a direct current power source. The control voltage to be applied to the heater is restricted to a voltage at a connection point between the positive-temperature-coefficient thermistor and the pull-up resistor when the control voltage from the heater control circuit is abnormally decreased. | 05-15-2014 |
20140159821 | OSCILLATION APPARATUS - An oscillation apparatus corrects a setting value for an output frequency based on a detection result of an environmental temperature. The oscillation apparatus includes a first crystal unit, a second crystal unit, an integrated circuit chip, and a container. The first crystal unit includes first excitation electrodes on respective surfaces of a crystal element. The second crystal unit includes second excitation electrodes on respective surfaces of a crystal element. The integrated circuit chip includes a first oscillation circuit, a second oscillation circuit, and a correction unit. The container houses the first crystal unit, the second crystal unit, and the integrated circuit chip. Assuming that distances from a gravity center position of the integrated circuit chip to respective gravity center positions of the first excitation electrodes and the second excitation electrodes in plan view are denoted by D1 and D2, D1/D2 is within a predetermined range close to 1. | 06-12-2014 |
20150028960 | OSCILLATOR - An oscillator uses a differential signal corresponding to a difference between an oscillation output f1 of a first oscillator circuit and an oscillation output f2 of a second oscillator circuit as a temperature detection value, and outputs a control signal for reducing an influence caused by a temperature characteristic of the oscillation output f1 based on the differential signal. The oscillator includes a switching unit configured to alternately switch between a first state where a first connecting terminal and a second connecting terminal are connected to a storage unit for access of an external computer to the storage unit, and a second state where the first connecting terminal and the second connecting terminal are respectively connected to a first signal path and a second signal path via a frequency reduction unit such that the output signals from the frequency reduction unit are extracted to an external frequency measuring unit. | 01-29-2015 |
20150061783 | CRYSTAL CONTROLLED OSCILLATOR - A crystal controlled oscillator includes a crystal unit, an oscillator circuit, a temperature detector for crystal unit, a heating unit for crystal unit, a temperature detector for oscillator circuit, and a heating unit for oscillator circuit. The heating unit for crystal unit is configured to control an output of the crystal unit based on a temperature detected by the temperature detector for crystal unit to compensate the temperature of the atmosphere where the crystal unit is placed to be constant. An output of the heating unit for oscillator circuit is controlled independently from the heating unit for crystal unit based on a temperature detected by the temperature detector for oscillator circuit to compensate the temperature of the atmosphere where the oscillator circuit is placed to be constant. | 03-05-2015 |
20150077189 | OSCILLATOR - An oscillator includes a voltage controlled oscillator, a PLL circuit, a crystal unit and an oscillator circuit configured to generate a clock, a digital control circuit, and a clock switching unit. The digital control circuit is configured to set an oscillation parameter of the oscillator circuit, and a parameter of the PLL circuit. The clock switching unit is configured to supply an output signal of the voltage controlled oscillator to the digital control circuit as a clock signal so as to cause the digital control circuit to operate using the clock signal when powered on, and configured to supply an output signal of the oscillator circuit to the digital control circuit as a clock signal after the digital control circuit sets the oscillation parameter of the oscillator circuit. An initial voltage is supplied to the voltage controlled oscillator as a control voltage when the oscillator is powered on. | 03-19-2015 |