Patent application number | Description | Published |
20130207093 | ORGANIC LIGHT EMITTING DEVICE COMPRISING ENCAPSULATING STRUCTURE - Provided is an organic light emitting diode including an organic light-emitting part including a first electrode, an organic material layer having a light-emitting layer, and a second electrode, and an encapsulating layer included on an entire top surface of the organic light-emitting part. Here, the encapsulating layer has a structure in which at least two of a water barrier film, a glass cap, a metal foil and a conductive film are stacked. Accordingly, the diode may have excellent water and oxygen barrier effects, and deterioration of the diode or running failure may be prevented. | 08-15-2013 |
20130240862 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRODE DEVICE USING THE SAME - An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer. | 09-19-2013 |
20130251989 | ADHESIVE FILM - The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability. | 09-26-2013 |
20140091296 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE - Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 10 | 04-03-2014 |
20140110699 | ADHESIVE FILM - An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process. | 04-24-2014 |
20140217621 | ENCAPSULATION FILM - The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 08-07-2014 |
20140235742 | PHOTOCURABLE ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE SEAL, ORGANIC ELECTRONIC DEVICE AND METHOD FOR SEALING SAME - Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator, an organic electronic device having an encapsulant including the composition using a film-state product, that is, a curable pressure-sensitive adhesive film, including the composition, and a method of manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, the method includes assembling a photocurable pressure-sensitive adhesive film including an acrylic polymer, an epoxy resin, a crosslinking agent and a photopolymerization initiator with an top substrate; and assembling the top substrate to the bottom substrate on which an organic light-emitting element is formed to cover an entire surface of the organic light-emitting element with the curable pressure-sensitive adhesive layer, and radiating light only to an edge of the assembled top and bottom substrates in which the organic light-emitting element is not disposed to photocure. Therefore, mechanical strength may be ensured due to entire encapsulation, the simplification of a process by photocuring may be achieved without direct radiation of light to the organic light-emitting element, and lifespan of the element may be increased. | 08-21-2014 |
20140264302 | ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME - An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive. | 09-18-2014 |
20140318707 | METHOD FOR MANUFACTURING ELECTORNIC DEVICE - Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method. | 10-30-2014 |
20140319497 | PHOTOCURABLE ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE SEAL, ORGANIC ELECTRONIC DEVICE, AND METHOD FOR SEALING SAME - Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased. | 10-30-2014 |
20140319999 | ENCAPSULATION FILM - Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 10-30-2014 |
20140377554 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION - Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and an organic electronic device. The exemplary pressure-sensitive adhesive composition may provide an encapsulating layer of the pressure-sensitive adhesive film and the organic electronic device, which exhibits excellent moisture blocking property, transparency, durability and reliability at a high temperature and high humidity, step difference compensating property and adhesive strength. | 12-25-2014 |
20150034940 | ADHESIVE FILM AND PRODUCT FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film and an organic electronic device (OED) encapsulation product using the same. As moisture resistance is maintained by preventing traveling of moisture in a matrix resin, moisture or oxygen input to the organic electronic device from an external environment may be effectively prevented, and temporal stability, life span and durability may be enhanced even when a panel of the organic electronic device is formed as a thin film, thereby ensuring long-term reliability. | 02-05-2015 |
20150048356 | ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process. | 02-19-2015 |
20150060836 | ADHESIVE FILM AND SEALING METHOD FOR ORGANIC ELECTRONIC DEVICE USING SAME - Provided are an adhesive film, an organic electronic device (OED) encapsulation product using the same, and a method of encapsulating the organic electronic device, and more particularly, an adhesive film for encapsulating an organic electronic element including a first adhesive layer having a loss coefficient (tan δ) at 60 to 100° C. of 1 to 5, and a second adhesive layer formed on the first adhesive layer, and a method of encapsulating an organic electronic device using the same. | 03-05-2015 |