Patent application number | Description | Published |
20130099512 | METHOD OF MANUFACTURING TAIL TRIM USING CLAD METAL PLATE - Provided is a method of manufacturing a tail trim using a clad metal plate, and a tail trim made of a clad metal plate, which thus enables decrease in weight and improved corrosion resistance, and which further enables increased heat resistance. The method includes rolling two washed metal materials to obtain an initial clad metal plate, and then heat treating and further rolling the initial clad metal plate to obtain a final clad metal plate; pressing the final clad metal plate, thus forming a main tail trim and a housing, the housing including a tail trim upper cover and a tail trim lower cover; and subjecting the main tail trim and the housing to tungsten inert gas welding, thus manufacturing the tail trim. | 04-25-2013 |
20140020303 | METHOD FOR MANUFACTURING LIGHT-REFLECTION ALUMINUM DOOR FRAME MOLDING - Disclosed is a method for manufacturing a light-reflection aluminum door frame molding which comprises a multi-coating-applied aluminum material to thereby improve corrosion resistance and reduce costs. A method for manufacturing a light-reflection aluminum door frame molding includes cutting a metallic plate into a predetermined size, performing anodizing on the metallic plate to form an oxidized film on a surface thereof, performing opaque clear coating and transparent coating on the metallic plate to implement light reflection, and performing press molding on the metallic plate to provide the metallic plate in the shape of a door frame molding. | 01-23-2014 |
20140041196 | METHOD FOR MANUFACTURING ALUMINUM ROOF MOLDING USING POROUS OXIDE LAYER - Disclosed is a method of manufacturing an aluminum roof molding using porous oxide layer comprising; forming a porous oxide layer on a surface of the aluminum material by anodizing the aluminum material; a slitting the aluminum material on which the porous oxide layer is formed; roll forming the aluminum material to a shape of the roof molding; heating the roll formed aluminum material with a high frequency; and forming a PVC layer on the heated aluminum material and simultaneously extruding the aluminum material to bind the PVC layer to the aluminum material. | 02-13-2014 |
20140059939 | DOORBELT MOLDING FOR VEHICLE AND METHOD FOR MANUFACTURING DOORBELT MOLDING - The present invention provides a method for manufacturing the doorbelt molding including: forming an anodized layer on a surface of an aluminum alloy plate by performing an anodizing treatment on the aluminum alloy plate; forming a clear coating layer on the anodized layer by performing a clear coating treatment on the aluminum alloy plate on which the anodized layer is formed; molding a sectional shape of an outer frame by roll-forming the aluminum alloy plate over which the anodized layer and the clear coating layer are formed; forming a molding intermediate member in which the outer frame and an inner molding are integrally formed by integrally injection-molding a synthetic resin into the outer frame formed by the roll-forming, wherein the synthetic resin is a material of the inner molding; bending and cutting the molding intermediate member to manufacture the doorbelt molding. | 03-06-2014 |
20140145455 | METHOD OF MANUFACTURING TAIL TRIM USING CLAD METAL PLATE - Provided is a method of manufacturing a tail trim using a clad metal plate, and a tail trim made of a clad metal plate, which thus enables decrease in weight and improved corrosion resistance, and which further enables increased heat resistance. The method includes rolling two washed metal materials to obtain an initial clad metal plate, and then heat treating and further rolling the initial clad metal plate to obtain a final clad metal plate; pressing the final clad metal plate, thus forming a main tail trim and a housing, the housing including a tail trim upper cover and a tail trim lower cover; and subjecting the main tail trim and the housing to tungsten inert gas welding, thus manufacturing the tail trim. | 05-29-2014 |
20150354082 | METHOD FOR MANUFACTURING LIGHT-REFLECTION ALUMINUM DOOR FRAME MOLDING - Disclosed is a method for manufacturing a light-reflection aluminum door frame molding which comprises a multi-coating-applied aluminum material to thereby improve corrosion resistance and reduce costs. A method for manufacturing a light-reflection aluminum door frame molding includes cutting a metallic plate into a predetermined size, performing anodizing on the metallic plate to form an oxidized film on a surface thereof, performing opaque clear coating and transparent coating on the metallic plate to implement light reflection, and performing press molding on the metallic plate to provide the metallic plate in the shape of a door frame molding. | 12-10-2015 |
Patent application number | Description | Published |
20080197366 | White light emitting diode module - A white LED module includes a circuit board, a blue LED chip disposed on the circuit board, a green light source of an LED chip or phosphor disposed on the circuit board, and a red light source of an LED chip or phosphor disposed on the circuit board. At least one of the green and red light sources is a phosphor, which is excited by the blue LED chip to radiate. The blue LED chip emits light in a triangular region defined by color coordinates (0.0123, 0.5346), (0.0676, 0.4633) and (0.17319, 0.0048), the green light source emits light in a triangular region defined by color coordinates (0.025, 0.5203), (0.4479, 0.541) and (0.0722, 0.7894), and the red light source emits light in a triangular region defined by color coordinates (0.556, 0.4408), (0.6253, 0.3741) and (0.7346, 0.2654). | 08-21-2008 |
20080205058 | Backlight unit having light emititng diodes and method of manufacturing the same - There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern. | 08-28-2008 |
20080265269 | White light emitting device and white light source module using the same - A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram. | 10-30-2008 |
20090059123 | PLANE LIGHT SOURCE AND LCD BACKLIGHT UNIT HAVING THE SAME - There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P | 03-05-2009 |
20090059579 | Surface light source using white light emitting diodes and liquid crystal display backlight unit having the same - There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes. | 03-05-2009 |
20100284186 | PLANE LIGHT SOURCE AND LCD BACKLIGHT UNIT HAVING THE SAME - There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P | 11-11-2010 |
20110122600 | SLIM TYPE BACKLIGHT UNIT WITH THROUGH-HOLE ADHESIVE HEAT DISSIPATING MEANS - A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly. | 05-26-2011 |
20110157492 | SURFACE LIGHT SOURCE USING WHITE LIGHT EMITTING DIODES AND LIQUID CRYSTAL DISPLAY BACKLIGHT UNIT HAVING THE SAME - There is provided a surface light source using white light emitting diodes including: a plurality of white light emitting diodes arranged at a predetermined distance from one another, wherein the white light emitting diodes are arranged such that a light emitting diode unit defined by each of the white light emitting diodes and corresponding ones of the white light emitting diodes disposed at a closest distance from the each white light emitting diode has a central light amount ranging from 80% to 120% with respect to an average light amount of the white light emitting diodes. | 06-30-2011 |
20110242437 | WHITE LIGHT EMITTING DEVICE AND WHITE LIGHT SOURCE MODULE USING THE SAME - A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram. | 10-06-2011 |
20130258211 | WHITE LIGHT EMITTING DEVICE AND WHITE LIGHT SOURCE MODULE USING THE SAME - A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram. | 10-03-2013 |
20130301276 | SLIM TYPE BACKLIGHT UNIT WITH THROUGH-HOLE ADHESIVE HEAT DISSIPATING MEANS - A backlight unit of the invention is reduced in thickness, weight and manufacturing costs but improved in heat releasing efficiency. In the backlight unit, a flexible printed circuit board has at least one through hole perforated therein. An LED package is disposed on a top portion of the flexible printed circuit board corresponding to the through hole. The backlight unit of the invention employs the flexible printed circuit board in place of a metal printed circuit board as a means to conduct current to the LED package. This produces a slimmer and lighter backlight unit and also saves manufacturing costs. In addition, the LED package is directly bonded onto a bottom plate by a heat conducting adhesive, thereby ensuring heat generated from the LED package to be released more quickly. | 11-14-2013 |
Patent application number | Description | Published |
20130009320 | Semiconductor package and method of manufacturing the same - There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip. | 01-10-2013 |
20130015544 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAMEAANM HAN; Myeong WooAACI HwaseongAACO KRAAGP HAN; Myeong Woo Hwaseong KRAANM Yoo; Do JaeAACI SuwonAACO KRAAGP Yoo; Do Jae Suwon KRAANM Lee; Jung AunAACI SuwonAACO KRAAGP Lee; Jung Aun Suwon KRAANM Yoon; Jung HoAACI AnyangAACO KRAAGP Yoon; Jung Ho Anyang KRAANM Park; Chul GyunAACI YonginAACO KRAAGP Park; Chul Gyun Yongin KR - There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern. | 01-17-2013 |
20130015563 | Semiconductor packageAANM Lee; Jung AunAACI SuwonAACO KRAAGP Lee; Jung Aun Suwon KRAANM Han; Myeong WooAACI HwaseongAACO KRAAGP Han; Myeong Woo Hwaseong KRAANM Yoo; Do JaeAACI SuwonAACO KRAAGP Yoo; Do Jae Suwon KRAANM Park; Chul GyunAACI YonginAACO KRAAGP Park; Chul Gyun Yongin KR - There is provided a semiconductor package, and more particularly, a semiconductor package including an antenna embedded in an inner portion thereof. The semiconductor package includes: a semiconductor chip; a main antenna disposed to be adjacent to the semiconductor chip and electrically connected thereto; a sealing part sealing both of the semiconductor chip and the main antenna; and an auxiliary antenna formed on an outer surface of the sealing part and coupled to the main antenna. | 01-17-2013 |
20130217181 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A method of manufacturing a semiconductor package, the method including: disposing a plurality of semiconductor chips; forming a sealing part sealing the plurality of semiconductor chips; forming a substrate part on at least one surface of the sealing part; and forming an antenna part on the sealing part or the substrate part. | 08-22-2013 |
20130292809 | SEMICONDUCTOR PACKAGE - A semiconductor package including an antenna formed integrally therewith. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part and electrically connected to the semiconductor chip. | 11-07-2013 |
20140001619 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140003013 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140029201 | POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF - There is provided a power package module, including: a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component. | 01-30-2014 |
20140110833 | POWER MODULE PACKAGE - Disclosed herein is a power module package. The power module package includes a substrate having one surface formed with a circuit pattern including a chip mounting pad and an external connection pad and the other surface; a semiconductor chip mounted on the chip mounting pad; and an external connection terminal having one terminal and the other terminal, the one terminal being connected to the external connection pad and the other terminal protruding to the outside, in which the external connection pad and the external connection terminal are bonded to each other by welding. | 04-24-2014 |
20140117408 | UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME - Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate. | 05-01-2014 |
20140167237 | POWER MODULE PACKAGE - Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals. | 06-19-2014 |
20140167239 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a substrate including a metal layer, a first insulation layer formed on the metal layer, a first circuit pattern formed on the first insulation layer and including a first pad and a second pad spaced apart from the first pad, a second insulation layer formed on the first insulation layer to cover the first circuit pattern, and a second circuit pattern formed on the second insulation layer and including a third pad formed on a location corresponding to the first pad and a fourth pad spaced apart from the third pad; a semiconductor chip mounted on the second circuit pattern; one end being electrically connected to the semiconductor chip, and another end protruding from the outside, wherein the first pad and the third pad, and the second pad and the fourth pad have different polarities. | 06-19-2014 |
20140167242 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module. | 06-19-2014 |
Patent application number | Description | Published |
20130249871 | DIGITIZER - Disclosed herein is a digitizer, including: an input unit in which a magnet is embedded; a driving coil in which source supplies to induce a line of magnetic force; a sensing coil in which voltage or current is induced by the line of magnetic force; and a controlling unit supplying the source to the driving coil and measuring the voltage or the current induced in the sensing coil, wherein the controlling unit senses a change amount in the voltage or the current induced in the sensing coil to calculate a coordinate, when the voltage or the current induced in the sensing coil is changed by the magnet. | 09-26-2013 |
20130250190 | BACK LIGHT UNIT INTEGRATED DIGITIZER - Disclosed herein is a back light unit integrated digitizer. The back light unit integrated digitizer includes a cover disposed on one surface of the back light unit to protect the back light unit; and a loop coil formed on the cover, wherein the loop coil is directly formed on the cover of the back light unit to integrally form the digitizer in the back light unit, thereby reducing the overall thickness to implement slimness and saving manufacturing costs to secure price competitiveness. | 09-26-2013 |
20140035841 | SENSOR FOR DIGITIZER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a sensor for a digitizer and a method for manufacturing the same. The sensor for a digitizer includes a magnetic layer having insulation property, a first coil formed on one surface of the magnetic layer, an insulating layer formed on one surface of the magnetic layer while covering the first coil, and a second coil formed on one surface of the insulating layer. By this configuration, the coil is directly formed on the magnetic layer to simplify a structure and improve stability of a signal transmitted and received from and to a coil by the magnetic layer. | 02-06-2014 |
20140062921 | DIGITIZER - Disclosed herein is a digitizer, including: a transparent substrate that is partitioned into an active area and an inactive area at an outside of the active area; an electrode that is formed in the active area on one surface of the transparent substrate; a coil that is formed in the active area on one surface of the transparent substrate; and a magnetic sheet that is formed in the inactive area on the other surface of the transparent substrate corresponding to the coil. | 03-06-2014 |
20140071083 | DIGITIZER - Disclosed herein is a digitizer including: a transparent substrate; an electrode formed on the transparent substrate to sense a change in capacitance; and a coil formed on the transparent substrate to receive a signal transmitted from the outside. As the touch input unit, various units such as an electronic pen and user's finger, and the like, can be used. | 03-13-2014 |
20140146003 | DIGITIZER PEN, INPUT DEVICE, AND OPERATING METHOD THEREOF - There are provided a digitizer pen, an input device, and an operating method thereof. The digitizer pen includes a body unit; and a pair of pen coil units provided in the body unit and disposed adjacently to both ends of the body unit in a length direction thereof, respectively, wherein at least one pen coil unit of the pair of pen coil units is operated by being electromagnetically coupled to a sensor coil close thereto. | 05-29-2014 |
20140176486 | TOUCH SCREEN AND METHOD FOR DRIVING THE SAME - Disclosed herein are a touch screen and a method for driving the same. The touch screen includes: a switching unit including a plurality of switches connected to traces of driving lines and sensing lines of the touch screen, respectively; a sensing unit sensing capacitance and electromagnetic resonance (EMR) according to a switching operation of the switching unit; and a main controlling unit controlling the switching operation of the switching unit according to an operation mode of the touch screen. Therefore, it is possible to improve sensitivity of sensing without increasing a bezel region of the touch screen. In addition, the EMR and the capacitance may be sensed using the same trace structure, and an antenna pattern may be formed and operated as an antenna. | 06-26-2014 |
20140253822 | DISPLAY DEVICE INCLUDING TOUCH PANEL - Disclosed herein is a display device including a touch panel including: a touch panel including a window substrate and an electrode pattern formed on one surface of the window substrate and a display unit bonded to one surface of the touch panel, wherein a stopper is formed in a spaced space between the display unit and the electrode pattern facing each other. | 09-11-2014 |
Patent application number | Description | Published |
20110156527 | Motor - There is provided a motor. A motor according to an aspect of the invention may include: a rotor case having a coupling hook extending downward in an axial direction, secured to a shaft, and performing rotation; a sleeve supporting the shaft; and a sleeve housing having a projection provided at a front end portion of an upper part thereof in the axial direction and a spiral passage provided along the projection such that the coupling hook moves along the spiral passage while the sleeve is pressed and inserted into an inner circumferential surface thereof. | 06-30-2011 |
20110187241 | Motor - There is provided a motor including a sleeve supporting a shaft; a sleeve holder allowing the sleeve to be fixed to an inner circumferential surface thereof and having a coupling rack protruding downwardly from a bottom surface in an axial direction; and a base plate having a sleeve holder insertion hole provided therein such that the sleeve holder insertion hole has a curvature defined by an inner circumferential surface thereof, in contact with an outer circumferential surface of the coupling rack of the sleeve holder, and a bottom surface thereof, in contact with a coupling portion of the coupling rack. | 08-04-2011 |
20110197212 | Encoder sensor, motor provided with encoder sensor and optical disk driving device equipped with motor - There is provided an encoder sensor according to an exemplary embodiment of the present invention. The encoder sensor may include: a light emitting unit and a light receiving part disposed at a distance in a readable range of an encoding mark of a disk; a receiving part receiving the light emitting unit and the light emitting unit; and a lead frame extending into an opposite direction of the disk from the receiving part and electrically connected to a printed circuit board. | 08-11-2011 |
20110283302 | Disk chucking device and motor device having the same - Disclosed is a disk chucking device. A disk chucking device according to an aspect of the invention may include: a chuck housing mounted on one surface of a rotor case being rotatable and having a receiving portion with an outside opening to be connected to a receiving space provided therein; and a chuck chip comprising an elastic plate being elastically transformed when a disc being mounted on the rotor case is inserted and securing an inter circumferential surface of the disc. | 11-17-2011 |
20120047523 | Spindle motor and disk driver having the same - Disclosed herein is provided a spindle motor and a disk driver having the same. There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a bush combined with the top portion of the shaft to be rotated together with the shaft; a rotor case including a cylindrical wall part combined with the outer peripheral surface of the bush; an air flow spreading part formed on the axial bottom part of the bush and spreading the air flow generated between the shaft and the sleeve to the radial outer side when the shaft is rotated; and a sealing part formed on the axial bottom portion of the bush and formed between the cylindrical wall part and the air flow spreading part to seal oil when the shaft is rotated. | 02-23-2012 |
20120153781 | MOTOR - There is provided a motor including a sleeve rotatably supporting a shaft; a sleeve holder having the sleeve inserted thereinto and including fixing parts; and a base member including fixing counterparts corresponding to the fixing parts of the sleeve holder and fixedly coupled to the sleeve holder, wherein the sleeve holder and the base member have guide parts and guide counterparts respectively provided therein, the guide parts and guide counterparts having corresponding shapes and guiding the sleeve holder to a mounting position thereof. | 06-21-2012 |
20120248914 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a sleeve holder supporting the sleeve and formed through a pressing process; a stator core fixedly mounted on an outer circumferential surface of the sleeve holder; and a pulling magnet fixedly mounted on an upper surface of the stator core, wherein the stator core includes a burr insertion stepped part formed in a lower portion of an inner diameter portion thereof. | 10-04-2012 |
20130049553 | SPINDLE MOTOR - Disclosed herein is a spindle motor including: a rotor part including a shaft and a rotor case coupled to the shaft to rotate integrally with the shaft, having a rotor magnet coupled to an inner side thereof, and having a disk mounted on one surface thereof; and a stator part including a base plate having the rotor part coupled thereto, a bearing part rotatably supporting the shaft, and an armature having a stator core part coupled to an outer peripheral surface of the bearing part so as to face the rotor magnet and a coil wound several times around the stator core part, wherein the stator core part is formed by stacking a plurality of stator cores having different thickness ratios. | 02-28-2013 |
Patent application number | Description | Published |
20140002226 | INDUCTOR AND METHOD OF MANUFACTURING THE SAME | 01-02-2014 |
20140034367 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg. | 02-06-2014 |
20140063427 | RESIN COMPOSITION FOR THERMAL RADIATION BOARD AND THERMAL RADIATION BOARD COMPRISING THE SAME - There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter. | 03-06-2014 |
20140077129 | EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg. | 03-20-2014 |
20140079924 | RESIN COMPOSITION FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING CORE LAYER AND PREPREG USING THE SAME - The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics. | 03-20-2014 |
20140106147 | PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties. | 04-17-2014 |
20140127483 | COPPER-CLAD LAMINATE. METHOD FOR MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate. | 05-08-2014 |
20140147639 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD - Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature. | 05-29-2014 |
20150057393 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME - Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same. | 02-26-2015 |
20150147542 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD COMPRISING THE SAME - A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured. | 05-28-2015 |
Patent application number | Description | Published |
20150014900 | COMPOSITE CONDUCTIVE POWDER, CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE INCLUDING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR - There is provided a composite conductive powder including a conductive particle, and a coating layer formed on a surface of the conductive particle and including glass, wherein when a thickness of the coating layer in a portion A in which the coating layer is the thickest, on the surface of the conductive particle is defined as a, and a thickness of the coating layer in a portion B forming an angle of 90° with respect to the portion A on the surface of the conductive particle, based on a center of the conductive particle is defined as b, 0.1≦b/a≦0.7 is satisfied. | 01-15-2015 |
20150068794 | MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME THEREON - There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin. | 03-12-2015 |
20150116895 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof, and more specifically, a conductive paste composition for an external electrode, allowing for decreased blister and glass beading defects by improving a removal of residual carbon at low temperature before necking between metal particles is generated and the metal particles are densified during a firing process of the external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof. | 04-30-2015 |
Patent application number | Description | Published |
20090294297 | METHOD OF FORMING PLATING LAYER - There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a thermoplastic resin and including openings; forming a plating layer on portions of the seed layer corresponding to the openings; and removing the pattern layer. This method ensures that the plating layer is formed with a sufficient thickness and the substrate, particularly, a ceramic substrate suffers minimal chemical damage during a plating process. Moreover, the plating layer is formed with a more uniform thickness. | 12-03-2009 |
20100059266 | CERAMIC MULTI-LAYER CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF - Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired. | 03-11-2010 |
20110148447 | MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME - There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided. | 06-23-2011 |
20120037610 | CERAMIC FIRING FURNACE - A ceramic firing furnace is provided. A uniform gas atmosphere is formed in the ceramic firing furnace to thus minimize a defective ceramic substrate when the ceramic substrate is fired. The ceramic firing furnace includes: a case having an internal space in which a shaped body is disposed; a heating element disposed in the interior of the case and radiating heat; and a plurality of air supply units fastened through the case such that the plurality of air supply units are rotatable by an external force, and supplying a gas to the internal space of the case. | 02-16-2012 |
Patent application number | Description | Published |
20110156527 | Motor - There is provided a motor. A motor according to an aspect of the invention may include: a rotor case having a coupling hook extending downward in an axial direction, secured to a shaft, and performing rotation; a sleeve supporting the shaft; and a sleeve housing having a projection provided at a front end portion of an upper part thereof in the axial direction and a spiral passage provided along the projection such that the coupling hook moves along the spiral passage while the sleeve is pressed and inserted into an inner circumferential surface thereof. | 06-30-2011 |
20110187241 | Motor - There is provided a motor including a sleeve supporting a shaft; a sleeve holder allowing the sleeve to be fixed to an inner circumferential surface thereof and having a coupling rack protruding downwardly from a bottom surface in an axial direction; and a base plate having a sleeve holder insertion hole provided therein such that the sleeve holder insertion hole has a curvature defined by an inner circumferential surface thereof, in contact with an outer circumferential surface of the coupling rack of the sleeve holder, and a bottom surface thereof, in contact with a coupling portion of the coupling rack. | 08-04-2011 |
20110197212 | Encoder sensor, motor provided with encoder sensor and optical disk driving device equipped with motor - There is provided an encoder sensor according to an exemplary embodiment of the present invention. The encoder sensor may include: a light emitting unit and a light receiving part disposed at a distance in a readable range of an encoding mark of a disk; a receiving part receiving the light emitting unit and the light emitting unit; and a lead frame extending into an opposite direction of the disk from the receiving part and electrically connected to a printed circuit board. | 08-11-2011 |
20110283302 | Disk chucking device and motor device having the same - Disclosed is a disk chucking device. A disk chucking device according to an aspect of the invention may include: a chuck housing mounted on one surface of a rotor case being rotatable and having a receiving portion with an outside opening to be connected to a receiving space provided therein; and a chuck chip comprising an elastic plate being elastically transformed when a disc being mounted on the rotor case is inserted and securing an inter circumferential surface of the disc. | 11-17-2011 |
20120153781 | MOTOR - There is provided a motor including a sleeve rotatably supporting a shaft; a sleeve holder having the sleeve inserted thereinto and including fixing parts; and a base member including fixing counterparts corresponding to the fixing parts of the sleeve holder and fixedly coupled to the sleeve holder, wherein the sleeve holder and the base member have guide parts and guide counterparts respectively provided therein, the guide parts and guide counterparts having corresponding shapes and guiding the sleeve holder to a mounting position thereof. | 06-21-2012 |
20120174140 | DISK CHUCKING DEVICE - There is provided a disk chucking device including: a chucking mechanism body installed on a rotor case; a chuck chip movably installed on the chucking mechanism body and fixing a disk thereto; and a spring member installed such that both ends thereof are supported by the chucking mechanism body and the chuck chip, and including a permanent deformation suppressing part provided in a bent portion thereof in order to prevent permanent deformation of the bent portion when the disk is loaded and unloaded and having a smaller pitch than that of other portions. | 07-05-2012 |
20120248914 | SPINDLE MOTOR - There is provided a spindle motor including: a sleeve rotatably supporting a shaft; a sleeve holder supporting the sleeve and formed through a pressing process; a stator core fixedly mounted on an outer circumferential surface of the sleeve holder; and a pulling magnet fixedly mounted on an upper surface of the stator core, wherein the stator core includes a burr insertion stepped part formed in a lower portion of an inner diameter portion thereof. | 10-04-2012 |
20130221782 | BEARING ASSEMBLY AND MOTOR INCLUDING THE SAME - There are provided a bearing assembly and a motor including the same capable of securing shaft system reliability while maintaining motor slimness. The bearing assembly includes a sleeve supporting a shaft via oil; and a sleeve holder having the sleeve inserted thereinto and fixedly supporting the sleeve, wherein an upper end of the sleeve is protruded from the sleeve holder to be higher than an upper end of the sleeve holder in an upward axial direction. | 08-29-2013 |
20140285924 | SPINDLE MOTOR AND RECORDING DISK DRIVING DEVICE INCLUDING THE SAME - There is provided a spindle motor including: a sleeve fixedly installed on the base member and having a circulation hole formed therein; a shaft rotatably inserted into a shaft hole of the sleeve; a rotor hub fixedly installed on an upper end portion of the shaft; and a thrust member installed in an installation groove of the sleeve and forming a connection part while being installed in the installation groove, the connection part being connected to the circulation hole, wherein the connection part is formed by the sleeve and the rotor hub and connects a sealing part in which a liquid-vapor interface is disposed and the circulation hole to each other, and an upper and lower radial dynamic grooves allowing a lubricating fluid to move from a lower end portion of the shaft toward the upper end portion thereof during rotation of the shaft. | 09-25-2014 |