Patent application number | Description | Published |
20100035376 | METHOD OF LOCALLY CRYSTALLIZING ORGANIC THIN FILM AND METHOD OF FABRICATING ORGANIC THIN FILM TRANSISTOR USING THE SAME - A method of partially crystallizing an organic thin film and a method of fabricating an organic thin film transistor (OTFT) are provided. An organic thin film used as an active layer of an OTFT is partially coated with an organic solvent by direct graphic art printing or partially annealed by laser beam irradiation, thereby local improving the crystallinity of the organic thin film. The charge mobility of the OTFT can be improved and crosstalk between devices can be reduced without additional patterning the organic thin film. | 02-11-2010 |
20100108996 | COMPOSITION FOR ORGANIC THIN FILM TRANSISTOR, ORGANIC THIN FILM TRANSISTOR FORMED BY USING THE SAME, AND METHOD FOR FORMING THE ORGANIC FILM TRANSISTOR - Provided are a composition for organic thin film transistors including a material including an anthracenyl group and a cross-linker including a maleimide group, an organic thin film transistor formed by using the composition, and a method for manufacturing the same. | 05-06-2010 |
20100237443 | ORGANIC THIN FILM TRANSISTORS AND METHODS OF FORMING THE SAME - Provided is an organic thin film transistor, method of forming the same, and a memory device employing the same. The organic thin film transistor includes a substrate, a source electrode and a drain electrode on the substrate, an active layer on the substrate between the source electrode and the drain electrode, a gate electrode controlling the active layer, and an organic dielectric layer between the active layer and the gate electrode. The organic dielectric layer includes nanoparticles, a hydrophilic polymer surrounding the nanoparticles, and a hydrophobic polymer. | 09-23-2010 |
20110094774 | MULTI-LAYER INTERCONNECTION STRUCTURE MANUFACTURING METHOD THEREOF - Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring. | 04-28-2011 |
20110272661 | RESISTIVE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - Provided are a resistive memory device and a method of fabricating the same. The resistive memory device comprises an electron channel layer formed by means of a swelling process and an annealing process. Thus, conductive nanoparticles are uniformly dispersed in the electron channel layer to improve reliability of the resistive memory device. According to the method, an electron channel layer is formed by means of a printing process, a swelling process, and an annealing process. Thus, fabrication time is reduced. | 11-10-2011 |
20130005079 | ORGANIC THIN FILM TRANSISTORS AND METHODS OF FORMING THE SAME - Provided is an organic thin film transistor, method of forming the same, and a memory device employing the same. The organic thin film transistor includes a substrate, a source electrode and a drain electrode on the substrate, an active layer on the substrate between the source electrode and the drain electrode, a gate electrode controlling the active layer, and an organic dielectric layer between the active layer and the gate electrode. The organic dielectric layer includes nanoparticles, a hydrophilic polymer surrounding the nanoparticles, and a hydrophobic polymer. | 01-03-2013 |
20130292160 | MULTI-LAYER INTERCONNECTION STRUCTURE - Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring. | 11-07-2013 |
20140001453 | ORGANIC INSULATING LAYER COMPOSITION, METHOD OF FORMING ORGANIC INSULATING LAYER, AND ORGANIC THIN FILM TRANSISTOR INCLUDING THE ORGANIC INSULATING LAYER | 01-02-2014 |