Patent application number | Description | Published |
20140239816 | LIGHTING CONTROL SYSTEM AND METHOD FOR CONTROLLING THE SAME - Lighting control systems and a method of control the same are provided. For example, the lighting control system includes at least one lighting device transmitting and receiving a wireless communication signal and controlled by a received wireless communication signal, a lighting device authentication code including unique identification information assigned to the lighting device, and a user terminal having an image recognition unit, the user terminal configured to recognize the lighting device authentication code using the image recognition unit, extract the unique identification information from the lighting device authentication code recognized by the image recognition unit, pair the user terminal with the lighting device based on the extracted unique identification information, and control the at least one lighting device. | 08-28-2014 |
20140239852 | LIGHTING CONTROL SYSTEM AND METHOD FOR CONTROLLING THE SAME - A lighting control system and a method for controlling the same are provided. The lighting control system includes at least one lighting device transmitting a wireless communication signal having unique identification information and controlled by a received wireless communication signal, and a user terminal receiving the wireless communication signal transmitted from the at least one lighting device, sorting and registering the at least one lighting device according to a strength of the wireless communication signal transmitted from the at least one lighting device, and pairing the user terminal with the registered lighting device to control the lighting device. Accordingly, a plurality of lighting devices located in a remote area can be conveniently registered and controlled from a certain location. | 08-28-2014 |
20150048760 | LIGHTING APPARATUS, LIGHTING CONTROL SYSTEM, AND METHOD OF CONTROLLING THE LIGHTING APPARATUS - A lighting apparatus connected to a network includes a light source for emitting light. A controller controls operation of the light source in response to an external control signal. A non-contact sensor detects a non-contact signal and generates a reset signal in response to detecting the non-contact signal. A communication interface communicatively connects the lighting apparatus to a wireless network to receive the external control signal from a remote apparatus via the wireless network and disconnects the lighting apparatus from the wireless network in response to receiving the reset signal from the non-contact sensor. | 02-19-2015 |
20160057839 | LIGHTING APPARATUS, LIGHTING CONTROL SYSTEM, AND METHOD OF CONTROLLING THE LIGHTING APPARATUS - A lighting apparatus connected to a network includes a light source for emitting light. A controller controls operation of the light source in response to an external control signal. A non-contact sensor detects a non-contact signal and generates a reset signal in response to detecting the non-contact signal. A communication interface communicatively connects the lighting apparatus to a wireless network to receive the external control signal from a remote apparatus via the wireless network and disconnects the lighting apparatus from the wireless network in response to receiving the reset signal from the non-contact sensor. | 02-25-2016 |
Patent application number | Description | Published |
20140049358 | CHIP RESISTOR AND METHOD OF MANUFACTURING THE SAME - There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni). | 02-20-2014 |
20140083664 | HEAT EXCHANGER - A heat exchanger having an improved structure which allows refrigerant tubes to be firmly bonded to heat exchange fins. The heat exchanger includes a plurality of refrigerant tubes spaced apart from each other, headers coupled to both end portions of the refrigerant tubes, and heat exchange fins coupled to the refrigerant tubes and disposed spaced apart from each other. Each of the heat exchange fins includes insertion grooves allowing the refrigerant tubes to be inserted thereinto, and bonding plates bonded to the refrigerant tubes. Each of the bonding plates includes a first bonding portion curved from one end portion thereof in a first direction and bonded to one surface of a corresponding one of the refrigerant tubes, and a second bonding portion curved from the other end portion thereof in a second direction and bonded to the other surface of the corresponding one of the refrigerant tubes. | 03-27-2014 |
20140367730 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device includes a light emitting structure, a first electrode unit, and a second electrode unit. The light emitting structure includes a first and second conductivity-type semiconductor layer, an active layer. The first electrode unit includes a first electrode pad and a first electrode finger extending from the first electrode pad, and having an annular shape with an open portion. The second electrode unit includes a second electrode pad and a second electrode finger extending from the second electrode pad, and has an annular shape with an open portion. One of the first and second electrode units substantially surrounds the other, and the center of the annular shape of at least one of the first and second electrode units is spaced apart from the center of the upper surface of the light emitting structure. | 12-18-2014 |
Patent application number | Description | Published |
20140203451 | ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME - The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively. | 07-24-2014 |
20140246648 | LIGHT EMITTING DEVICE PACKAGES AND METHODS OF FORMING THE SAME - A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes. | 09-04-2014 |
20140306261 | ELECTRONIC DEVICE PACKAGE AND PACKAGE SUBSTRATE FOR THE SAME - There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole. | 10-16-2014 |
20140339581 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A semiconductor light emitting device package is provided having a light transmissive substrate, and a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially laminated on the light transmissive substrate. The light emitting structure comprises a first surface and a second opposing surface facing the light transmissive substrate. The semiconductor light emitting device package comprises a via penetrating the second conductivity-type semiconductor layer and the active layer, and exposing the first conductivity-type semiconductor layer. A first electrode has a first portion disposed on the first surface, and a second portion extending into the via and contacting the first conductivity-type semiconductor layer. An insulating layer is disposed between the first electrode, and each of the second conductivity type semiconductor layer, the active layer, and the first surface. A second electrode is disposed on the first surface. | 11-20-2014 |
20140377894 | METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes. | 12-25-2014 |
20150228867 | LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DEVICE USING THE SAME - A light emitting diode package includes a package body having first and second electrode structures, a light emitting diode chip having a surface, on which first and second electrodes are disposed. The light emitting diode chip is disposed on the first and second electrode structures of the package body. A sheet-type wavelength conversion layer having a substantially constant thickness is disposed on an upper surface of the light emitting diode chip, and an encapsulating portion is disposed to surround the light emitting diode chip and the wavelength conversion layer. The encapsulating portion has an upper surface substantially parallel to the wavelength conversion layer. Side surfaces of the encapsulating portion have a plurality of side slope sections inclined toward the upper surface of the encapsulating portion. | 08-13-2015 |
20150236228 | LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween. | 08-20-2015 |
20150243846 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package including a first electrode pad and a second electrode pad formed to contact a lower surface of a light emitting device; a bonded insulating layer pattern formed to at least partially cover side surfaces and lower surfaces of the first electrode pad and the second electrode pad; a substrate, in which via holes are formed which penetrate the substrate from a first surface of the substrate that contacts a lower surface of the bonded insulating layer pattern to a second surface of the substrate that is opposite to the first surface; a through-electrode disposed in each via hole and contacting the lower surface of one of the respective first electrode pad and the second electrode pad; and a through-electrode insulating layer formed between the through-electrode and the substrate, and having an upper surface that contacts a portion of the lower surface of the bonded insulating layer pattern. | 08-27-2015 |
20150243853 | METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A method of manufacturing a light emitting diode (LED) package may include forming a light emitting structure having a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer on a growth substrate, forming first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, bonding a first surface of a light transmissive substrate opposite to a second surface thereof to the light emitting structure, identifying positions of the first and second electrodes that are seen through the second surface of the light transmissive substrate, forming one or more through holes in the light transmissive substrate to correspond to the first and second electrodes, and forming first and second via electrodes by filling the through holes with a conductive material. | 08-27-2015 |
20150357250 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE - A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages. | 12-10-2015 |
20150372207 | SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE - A semiconductor light emitting device package includes a semiconductor laminate having first and second surfaces and side surfaces, and including first and second conductivity-type semiconductor layers, and an active layer, a support body disposed on the second surface and including first and second package electrodes, a first electrode layer disposed on the first surface and connected to the first conductivity-type semiconductor layer and extended along a side of the semiconductor laminate to be connected to the first package electrode, a side insulating layer disposed on a side of the semiconductor laminate and electrically insulating the first electrode layer from the side of the semiconductor laminate, and a second electrode layer disposed on the second surface and electrically connecting the first conductivity-type semiconductor layer to the second package electrode. | 12-24-2015 |
Patent application number | Description | Published |
20110143695 | SENSING APPARATUS, NETWORK SYSTEM AND CONTROLLING METHOD ON THE BASIS OF SATELLITE - Disclosed is a sensing apparatus, a network system, and a controlling method on the basis of a satellite. A satellite-based sensing network system, comprising: a plurality of satellite transmitters that collect information on a peripheral environment and an operating state, and transmits it to peripheral satellites; a satellite wireless receiving/display device that directly receives and displays the information collected from the satellites; a ground control center that receives, stores, and analyzes the information collected from the satellites; and a management center that maintains and repairs the satellite transmitter based on the analyzed results. | 06-16-2011 |
20140213195 | APPARATUS AND METHOD FOR ANALYZING EFFECT ON WIRELESS COMMUNICATION SYSTEM BY SOLAR COSMIC RADIO WAVE - Provided is an apparatus and method for analyzing an effect on a wireless communication system that may analyze an effect of a solar activity on a wireless communication system based on strength of solar cosmic radio waves. An apparatus for analyzing an effect on a wireless communication system may include a solar cosmic radio wave strength collecting unit to collect strength of solar cosmic radio waves according to a solar activity; and an interference determining unit to determine a level of interference of the solar activity against the wireless communication system, based on the strength of solar cosmic radio waves. | 07-31-2014 |
20150134250 | METHOD OF ANALYSIS OF ELECTRON DENSITY OF IONOSPHERE - A method for an ionosonde to analyze the electron density of the ionosphere includes: receiving oblique sounding data in an oblique direction, rather than vertically above the ionosonde in the sky; converting the oblique sounding data into vertical sounding data; calculating the amplitude array based on the vertical sounding data; and analyzing the electron density of the ionosphere in the sky at an intermediate location based on the oblique sounding data and the converted vertical sounding data. | 05-14-2015 |
20150192670 | METHOD AND APPARATUS FOR EXTRACTING IONOSPHERIC TRACE - A method and apparatus for extracting an ionospheric trace are provided. The trace extraction method includes: searching for a signal data having maximum strength among signal data displayed on an ionogram of the ionosphere; selecting the point where the signal data having maximum strength is placed as a first point; extracting the trace on the right side of the first point while increasing frequency of the signal data; and extracting the trace on the left side of the first point while decreasing the frequency. | 07-09-2015 |
Patent application number | Description | Published |
20090041952 | METHOD OF DEPOSITING SILICON OXIDE FILMS - Methods of depositing a silicon oxide film are disclosed. One embodiment is a plasma enhanced atomic layer deposition (PEALD) process that includes supplying a vapor phase silicon precursor, such as a diaminosilane compound, to a substrate, and supplying oxygen plasma to the substrate. Another embodiment is a pulsed hybrid method between atomic layer deposition (ALD) and chemical vapor deposition (CVD). In the other embodiment, a vapor phase silicon precursor, such as a diaminosilane compound, is supplied to a substrate while ozone gas is continuously or discontinuously supplied to the substrate. | 02-12-2009 |
20090278224 | METHODS OF FORMING AN AMORPHOUS SILICON THIN FILM - A method for forming an amorphous silicon thin film is disclosed. In some embodiments, a method includes loading a substrate into a reaction chamber; and conducting a plurality of deposition cycles on the substrate. Each of at least two of the cycles includes: supplying a silicon precursor to the reaction chamber during a first time period; applying radio frequency power to the reaction chamber at least partly during the first time period; stopping supplying of the silicon precursor and applying of the radio frequency power during a second time period between the first time period and an immediately subsequent deposition cycle; and supplying hydrogen plasma to the reaction chamber during a third time period between the second time period and the immediately subsequent deposition cycle. The method allows formation of an amorphous silicon film having an excellent step-coverage and a low roughness at a relatively low deposition temperature. | 11-12-2009 |
20110020545 | LATERAL-FLOW DEPOSITION APPARATUS AND METHOD OF DEPOSITING FILM BY USING THE APPARATUS - A deposition apparatus according to an exemplary embodiment of the present invention is a lateral-flow deposition apparatus in which in which a process gas flows between a surface where a substrate is disposed and the opposite surface, substantially in parallel with the substrate. The lateral-flow deposition apparatus includes: a substrate support that moves up/down and rotates the substrate while supporting the substrate; a reactor cover that defines a reaction chamber by contacting the substrate support; and a substrate support lifter and a substrate support rotator that move the substrate support. | 01-27-2011 |
Patent application number | Description | Published |
20120082367 | METHOD OF FORMING IMAGE OF SEMICONDUCTOR DEVICE, AND METHOD OF DETECTING A DEFECT OF THE SEMICONDUCTOR DEVICE BY USING THE IMAGE FORMING METHOD - A method forms an ultimate or final image of a sample by selecting some of a plurality of image frames and integrating the selected frames. The method includes providing a semiconductor device including a region of interest and a peripheral region; obtaining a plurality of image frames each including a region of interest image and a peripheral region image respectively corresponding to the region of interest and the peripheral region; selecting at least some of the plurality of image frames based on a contrast between the region of interest image and the peripheral region image; and obtaining an image of the semiconductor device by integrating the selected image frames. | 04-05-2012 |
20120155740 | METHOD OF DETECTING DEFECT IN PATTERN AND APPARATUS FOR PERFORMING THE SAME - A method and apparatus for detecting a defect in a pattern are provided. The method includes: obtaining a pattern image from a pattern in a region of interest on a semiconductor substrate and obtaining a reference image are obtained; matching the obtained pattern image and the obtained reference image to select a pixel group including pixels indicating defect information of the pattern image; adjusting a defect detection threshold of the selected pixel group; comparing the obtained pattern image and the obtained reference image to detect a pattern defect in a detection region corresponding to the selected pixel group of the pattern image, according to the adjusted defect detection threshold. | 06-21-2012 |
20120268159 | METHOD OF DETECTING DEFECTS IN A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME - A method of detecting a defect of a semiconductor device includes forming test patterns and unit cell patterns in a test region a cell array region of a substrate, respectively, obtaining reference data with respect to the test patterns by irradiating an electron beam into the test region, obtaining cell data by irradiating the electron beam into the cell array region, and detecting defects of the unit cell patterns by comparing the obtained cell data with the obtained reference data. | 10-25-2012 |
20140273441 | METHOD FOR FORMING PATTERNS OF SEMICONDUCTOR DEVICE USING SADP PROCESS - To fabricate patterns of a semiconductor device, a mask film is formed on a substrate. A plurality of first patterns and a plurality of second patterns are formed on the mask film. The plurality of first patterns is spaced apart from each other at a first distance. The plurality of second patterns is spaced apart from each other at a second distance. The second distance is different from the first distance. A spacer film is conformally formed on the plurality of first patterns and the plurality of second patterns to a predetermined thickness. The spacer film fills spaces between the plurality of second patterns. A part of the spacer film is partially removed to form a plurality of spacer film patterns are formed on side walls of the plurality of the first patterns. The plurality of first patterns and the plurality of second patterns are removed. A plurality of patterns is formed on the substrate using the plurality of spacer film as a mask. | 09-18-2014 |
Patent application number | Description | Published |
20140175393 | ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - An organic light emitting diode display device capable of improving capacitance Cst of a storage capacitor and transmittance and a method of fabricating the same are disclosed. The organic light emitting diode display device includes a driving thin film transistor (TFT) formed on the substrate, a passivation film formed to cover the TFT driver, a color filter formed on the passivation film in a luminescent region, a planarization film formed to cover the color filter, a transparent metal layer formed on the planarization film, an insulating film formed on the transparent metal layer, a first electrode connected to the TFT driver and overlapping the transparent metal layer while interposing the insulating film therebetween, an organic light emitting layer and a second electrode which are sequentially formed on the first electrode. The transparent metal layer, the insulating film, and the first electrode constitute a storage capacitor in the luminescent region. | 06-26-2014 |
20150144910 | Array Substrate For Display Device And Method Of Fabricating The Same - An array substrate for a display device includes a first thin film transistor (TFT) including a first semiconductor layer, a first gate electrode corresponding to the first semiconductor layer, a first source electrode and a first drain electrode; a second TFT including a second semiconductor layer, a second gate electrode corresponding to the second semiconductor layer, a second source electrode and a second drain electrode; a first transparent capacitor electrode connected to the first drain electrode; a first passivation layer on the first transparent capacitor electrode; a second transparent capacitor electrode on the first passivation layer and connected to the second drain electrode, the second transparent capacitor electrode overlapping the first transparent capacitor electrode; a second passivation layer on or over the first passivation layer and the second transparent capacitor electrode; and a first electrode on the second passivation layer and connected to the second transparent capacitor electrode. | 05-28-2015 |
20150187854 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND FABRICATING METHOD THEREOF - Disclosed is an organic light emitting display device. The organic light emitting display device includes: at least one transistor arranged in a transistor region of the substrate and configured to include a channel layer, an insulation film, a gate electrode, a source electrode and a drain electrode; a storage capacitor arranged in the storage capacitor region, the pixel region and the pad region of the substrate and configured to include a first storage electrode, an insulation film pattern and a second storage electrode; a color filter arranged over the storage capacitor opposite to the pixel region; and an organic light emitting diode arranged on the color filter and configured to include a first electrode, an organic emission layer and a second electrode. | 07-02-2015 |
Patent application number | Description | Published |
20120063866 | FIBER REINFORCED PLASTIC BOLT AND METHOD FOR PRODUCING THE SAME - A fiber reinforced plastic bolt(FRP) and a method for producing the same are disclosed. The FRP bolt is useful in the industrial areas which require a bolt having electric-insulation, anti-corrosive, thermal-insulation, and non-magnetic properties. The method for producing the FRP bolt includes the steps of: winding a prepreg around a surface of an internal body, wherein the internal body includes a first reinforcing fiber which is unidirectionally aligned along the axis of the bolt, and a synthetic resin which is impregnated into the first reinforcing fiber, and the prepreg includes a second reinforcing fiber and a thermosetting resin which is impregnated into the second reinforcing fiber; forming a fiber reinforced plastic round bar by heat-hardening the prepreg; and forming a screw thread on the surface of the fiber reinforced plastic round bar. | 03-15-2012 |
20160117799 | IMAGE UP-SCALE DEVICE AND METHOD - An image scale device for up-scaling an input image by generating data signals for a plurality of additional pixels, the additional pixels added to the input image to generate an up-scaled image, the device comprising an RGB interpolator configured to generate red (R), green (G), and blue (B) data signals for each of the additional pixels on the basis of the R, G, and B data signals of an arbitrary pixel among pixels of the input image that are adjacent to the respective additional pixel, and a W interpolator configured to generate a white (W) data signal for each of the additional pixels on the basis of W data signals of the pixels of the input image that are adjacent to the respective additional pixel. | 04-28-2016 |
Patent application number | Description | Published |
20140355892 | IMAGE PROCESSING METHOD AND APPARATUS - An image processing method includes searching for areas matching each other between a plurality of input images, the plurality of input images comprising a reference image and a target image, generating hierarchical image structures formed of a plurality of hierarchical images having different resolutions with respect to the matching areas between the plurality of input images, repeatedly performing image processing based on a similarity of values of pixels matching each other in the plurality of hierarchical images of the same level by using the hierarchical image structures generated with respect to the matching areas, and generating an output image by using pixel values according to the repeated image processing. | 12-04-2014 |
20150098658 | METHOD AND APPARATUS FOR PROCESSING IMAGE DATA, AND RECORDING MEDIUM - A method of processing image data includes a plurality of different processes performed based on edge information generated as a result of performing a preset process from among the plurality of different processes. Therefore, the time for processing the image data is reduced, and image quality is enhanced. | 04-09-2015 |
20150116338 | IMAGE PROCESSING APPARATUS AND METHOD - Disclosed are an image processing apparatus and method that more efficiently process image data. The image processing apparatus includes a vector data manager that receives at least some of all image data and converts the received image data into vector data, a vector processor that receives the vector data from the vector data manager, performs a vector processing operation by using the vector data, and generates output vector data as a result of the vector processing operation, and a synchronizer that controls a timing of when the vector data manager transmits the vector data to the vector processor. | 04-30-2015 |