Patent application number | Description | Published |
20100222956 | METHOD AND APPARATUS FOR DECIDE TURN CONDITION USING SENSOR - A method and apparatus of determining a straight-driving state or a turning state of a moving object using an acceleration sensor are provided. The method of determining a turning state using a sensor includes: reading sensor output signals of different axes from an acceleration sensor while a moving object is being driven wherein the acceleration sensor is an at least two axes acceleration sensor and detects an acceleration of the moving object; and comparing the read sensor output signals of the different axes and determining whether the moving object is in a straight-driving state or in a turning state. | 09-02-2010 |
20110015892 | METHOD AND APPARATUS FOR DECIDE TRAVEL CONDITION USING SENSOR - A method and apparatus of determining a stationary state and a driving state of a moving object using a sensor are provided. The method of determining a driving state using a sensor includes: calculating an amount of change ΔP in a sensor output signal of the sensor wherein the sensor detects a vibration of a moving object; and comparing the calculated amount of change ΔP in the sensor output signal with a predetermined set range of the sensor output signal and determining whether the moving object is in a stationary state or in a driving state. | 01-20-2011 |
20110022348 | METHOD AND APPARATUS FOR DECIDE VERTICAL TRAVEL CONDITION USING SENSOR - A method and apparatus for determining a vertical driving state using a sensor which determines the driving state according to a gravity change of a moving object by using an acceleration sensor are provided. The method of determining a driving state using a sensor includes: reading a sensor output signal according to a gravity value of a moving object while being driven, from a sensor which senses a gravity value of the moving object with respect to a direction of gravity; and determining whether the moving object is in a level driving state or inclining/declining-slope driving state by comparing the read sensor output signal with a predetermined reference range. | 01-27-2011 |
20110178700 | METHOD AND APPARATUS FOR PERFORMING QUICK SEARCH OF PATH DISPLAY TERMINAL - A method and apparatus for performing a quick search of a path display terminal are provided. The quick search device of a path display terminal comprises: a vehicle position display unit for displaying a position of a vehicle on a map generated based on map data; a quick search display unit for displaying a quick search area for inputting a search word in a portion of the map; a search unit for searching for a destination corresponding to the search word; and a path display unit for generating and displaying a path from the vehicle position to the destination. | 07-21-2011 |
20130290433 | OPEN TYPE POI SERVICE SYSTEM USING SNS METHOD AND METHOD THEREOF - Disclosed are an open type POI service system using an SNS method and a method thereof. The open type POI system includes an SNS media studio server which opens a POI to a user and registers an interest location designated by a user as an open type POI. Therefore, the SNS media studio server includes a database which stores an open type POI related to a user, and supplies the open type POI to another user who is related to the user by connection of the open type POI and SNS. | 10-31-2013 |
Patent application number | Description | Published |
20110207266 | PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE - A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact. | 08-25-2011 |
20120168937 | FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A flip chip package and a method of manufacturing the same are provided. The flip chip package include: a package substrate, a semiconductor chip and conductive hollow bumps. The semiconductor chip may be arranged over an upper surface of the package substrate. The conductive hollow bumps may be interposed between the semiconductor chip and the package substrate to electrically connect the semiconductor chip with the package substrate. Thus, a wide gap may be formed between the semiconductor chip and the package substrate by the thick conductive hollow bumps. As a result, a sufficient amount of the molding member may be supplied to each of the conductive hollow bumps to surround each of the conductive hollow bumps. | 07-05-2012 |
20120307445 | PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE - A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. | 12-06-2012 |
20130148310 | PRINTED CIRCUIT BOARD HAVING WIRE PATTERN - A printed circuit board (PCB) includes a wire pattern having first and second surfaces facing in opposite directions from each other, the wire pattern including a first region having a first thickness and a second region having a second thickness greater than the first thickness; a core insulation layer on the second surface in the first region, the core insulation layer having a third surface adjacent to the second surface in the first region and a fourth surface facing in an opposite direction from the third surface, the fourth surface being connected to the second surface; and a first protection layer covering a portion of the fourth surface of the core insulation layer and a portion of the second surface in the second region. | 06-13-2013 |
20140361442 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package. | 12-11-2014 |
20150103494 | PRINTED CIRCUIT BOARDS HAVING METAL LAYERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided. | 04-16-2015 |
20150262841 | METHOD OF MANUFACTURING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE - A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed. | 09-17-2015 |