| Patent application number | Description | Published |
|---|
| 20090054925 | Safe tweezers - A covered tweezers, comprising a body having two identical thin sheets of metal fused or welded together at one end resulting in a pair of free opposing ends, the free opposing ends having a different type of tip for each type of tweezers. A cover is fixed to the body of the tweezers excepting a head portion of the tweezers. A cap encloses the head portion of the tweezers. The cover is non-metallic such as plastic, wood, rubber material or fabric. The cover is fixed to the body of the tweezers, thereby avoiding the need of a case to hold the tweezers. | 02-26-2009 |
| 20090066101 | Easy view tweezers - A tweezers, comprising two identical elongated thin sheets having a stationary end and a pair of free opposing ends, the free opposing ends having a tip on each end; and, a first opening on a surface of the free opposing ends of the elongated thin sheet proximal to the tip for detecting an object pinched between the pair of free opposing ends. The tweezers can have a second opening on each surface of the free opposing end at a location behind the first opening proximal to the tip. The second opening is for accommodating a finger as it grips on the tweezers. | 03-12-2009 |
| 20090102214 | Compact double tweezers - Two tweezers which folds and unfolds relative to each other is connected by a central connector which allows the rotation of the tweezers without one tweezers rubbing into the other tweezers. Each tweezers has a tweezer head section extending to a base section. The base sections have an external base cover serving as handles for the tweezers. A cover shields the tweezer heads of the two tweezers. A spring assisted locator pin inserts and retracts from a hole as the tweezers positions back and forth from a folding position to an unfolding position. | 04-23-2009 |
| 20090102215 | Flipping double headed tweezers - A flipping double tweezers having a stationary and a movable tweezers. Each tweezers is formed from two elongated plates or molded as a single piece and has a tweezer head including a pincer and its tips and a fused rear section. The rear section of the stationary and the movable tweezers are designed to connect the tweezers and form a flipping mechanism whereby the movable tweezers can swing along a 180 degree orbit relative to the stationary tweezers. | 04-23-2009 |
| 20090211939 | Carry-on organizer - A carry-on organizer for beauty implements having a plurality of horizontally or vertically fused covers, holders or containers as components of the carry-on organizer, the components having different or uniform length and different or similar internal dimensions for covering, holding or housing the beauty implement. The components of the carry-on organizer can be all fused covers, all fused holders, all fused containers or a combination of fused covers, holders and containers. | 08-27-2009 |
| 20090214285 | Cosmetic holders with removable reservoir - A holder for cosmetic products having a hollow shell housing a removable reservoir containing a cosmetic composition. The removable reservoir is disposable or reusable. The removable reservoir comes with a replaceable applicator for the composition contained in the removable reservoir. The replaceable applicator has a handle acting as a cover for the removable reservoir. The handle inserts into an outer cover having an outside surface matching and complimenting the outside surface of the hollow shell. | 08-27-2009 |
| 20100054841 | Heated mascara - A heated mascara device having a mascara container housing a mascara formulation and a mascara applicator having an applicator head control heated by a heating system, the heating system turning on when the mascara applicator is disengaged from the mascara container and turning off when the mascara applicator is engaged with the mascara container. The applicator head has two sets of lined tooth protruding from a casing of the applicator head, a first set of a single combing toothed strip for combing the eyelashes and a second set of a plurality of lined applicator toothed strips for applying the mascara to the eyelashes. | 03-04-2010 |
| 20110121592 | Double tipped head tweezers - A tweezers formed from one or two elongated flat sheet. When they are formed from two elongated flat sheets, one end is joined together to form a stationary end resulting in a free opposing end opposite the stationary end. Each free opposing end has a head accommodating a plurality of tips at a distance from each other, the tips from the top member pairing with the tips from the bottom member, opening and closing according to a pressure exerted on a surface proximal to the free opposing ends. The tweezers formed from one flat elongated sheet having two opposite ends are folded at a mid section, the folded section forms the stationary end opposite a free opposing end formed from the two opposite ends of the elongated sheet. | 05-26-2011 |
| 20110186072 | Heated eyelash groomer - An eyelash groomer having multiple functions on a function head portion of the groomer. The number of functions depend upon the number of function head pieces. Each function head pieces is recommended to have a plurality of small bridges protruding perpendicularly from its respective bases to cage a heating element accessible to each function head piece of the function head of the eyelash groomer. The bridges also prevent the skin from directly contacting the heating element but allow the eyelashes direct contact for optimum curling. The bridges also serve as a guide for the eyelashes because the eyelashes enter at the intervals or spaces between the bridges. The heating element run horizontally beneath each function head piece. A heating mechanism heats the heating element and a protection case houses the components of the heating mechanism and serves as a handle for the eyelash groomer. | 08-04-2011 |
| 20120024863 | Multiple compartment container - A multiple compartment container having a plurality of independent double compartment containers within a container. Each double compartment container have an outer larger compartment fully enclosing an inner smaller compartment with each adjacent compartment having an independent open end located opposite each other to allow free accessibility to the compartment. Each open end accommodates a closure device to close the compartments. This prevents the contents of one compartment from mixing with the contents of the other compartment. | 02-02-2012 |
| 20120151701 | Multifaceted scrubbing device - A multifaceted scrubbing device comprising a body having a head portion on one end and a handle on another end, the head portion having at least three faces for accommodating at least three working surfaces of one type or of different types. The working surfaces may be attached permanently to the faces on the head portion of the scrubbing device or they may be replaceable. | 06-21-2012 |
| 20130017009 | MASCURLER (HEATED MASCARA)AANM CHO; YONG HOONAACI FullertonAAST CAAACO USAAGP CHO; YONG HOON Fullerton CA US - A cosmetic device for applying mascara and curling eyelashes simultaneously utilizing a heating means is disclosed. The cosmetic device comprises a battery housing, a brushing unit, a mascara container and a printed circuit board. The battery housing stores a battery and includes a battery cap, an over cap, a switch knob and an indicator. The brushing unit is designed for applying the mascara and curling the eyelashes simultaneously. The brushing unit includes a rod, a heating bar having a mascara brush and a comb brush and a heating means located inside the heating bar. The switch knob is designed to on/off the cosmetic device and the indicator indicates whether the switch knob is on/off. The heating means is adaptable to efficiently heat the brushing unit to make the mascara more liquid thereby allowing mascara application easily and evenly on the eyelashes of a user. | 01-17-2013 |
| Patent application number | Description | Published |
|---|
| 20090070223 | System and method for calculating postal charges - A system for calculating postal charges receives detailed information and configuration information about a bulk mail, and collects charge-calculation information on the basis of the detailed information and the configuration information. Then, the system determines discount rates for the bulk mail on the basis of the charge-calculation information, and generates charge information for the mails in consideration of the discount rates. Accordingly, the system for calculating postal charges can provide optimum charges for the mails to a client before the reception of the mails. | 03-12-2009 |
| 20090156221 | Handover method and apparatus in mobile network - A method and an apparatus for performing handover in a mobile communication network are provided. The method of performing handover in a mobile communication network includes: obtaining a service providing time period and a utility function on a candidate network basis; obtaining a selection function of each of the candidate networks using the utility function and the service providing time period; and selecting a network for handover among the plurality of mobile networks using the selection function. Therefore, in consideration of user satisfaction and a network service quality, utility functions are defined and by selecting a network for handover using the utility functions, a network suitable for a user environment can be effectively selected and thus it is possible to perform handover that has a performance and a cost suitable for user request and that can maximize a quality of a mobile service. | 06-18-2009 |
| 20100026497 | DEVICE AND METHOD FOR INSPECTING EQUIPMENT - An equipment inspecting device for inspecting at least one piece of equipment positioned in an office from among a plurality of offices included in the equipment inspection target recognizes office information for indicating a position of an office, and searches office equipment information for indicating a previous state of at least one piece of equipment positioned in the office by using the office information. The equipment inspecting device transmits the searched office equipment information to the equipment information collecting device so that an equipment information collecting device for collecting at least one piece of equipment information corresponding to at least one piece of equipment may generate update information for indicating a state change of at least one piece of equipment. Also, the equipment inspecting device receives the update information from the equipment information collecting device, and updates office equipment information by using the update information. | 02-04-2010 |
| 20110035337 | UNMANNED MAIL ACCEPTING METHOD AND DEVICE AND DATA MANAGING DEVICE - An unmanned mail accepting device verifies ordinary and registered mail to be provided by a client, settles postage for the verified ordinary and registered mail, and displays electronic postmark information on the mail. | 02-10-2011 |
| 20120114834 | AUTOMATIC STAMPING METHOD AND APPARATUS BASED ON PRESS ROLLER AND PIN PRESS - An automatic stamping apparatus includes a conveyor for conveying a stamping object, a stamper for stamping a pattern and two-dimensional bar code information on the stamping object, a reader for reading the pattern and the two-dimensional bar code information, and an information processor for determining a pattern and two-dimensional bar code information to be stamped on the stamping object, controlling the stamper based on the determined pattern and two-dimensional bar code information, receiving the stamped pattern and two-dimensional bar code information of the stamping object read by the reader, comparing the received stamped pattern and two-dimensional bar code information with a pattern and two-dimensional bar code information to be stamped on the stamping object, thus verifying the accuracy of the stamping. | 05-10-2012 |
| 20120127202 | SYSTEM AND METHOD FOR PROVIDING DELIVERY INFORMATION - Provided are a system and a method for logistics delivery using augmented reality, which are used for efficient logistics delivery through generation of an optimal delivery route and improvement of a delivery rate. The present invention is constituted by a mobile terminal which is used by a delivery man, a logistics information system, and a mobile communication company's server. When the delivery man scans an image in a delivery scheduled area by using the mobile terminal, a mobile apparatus displays detailed delivery information regarding a delivery point in an area for each set area unit and whether a customer is positioned in the vicinity of an address and generates the optimal delivery route. | 05-24-2012 |
| 20130278947 | SYSTEM FOR ACCEPTING MAIL MATTER - A system for accepting a mail matter is provided, which includes an image processing unit recognizing a mailing address; a weight measurement unit measuring a weight of the mail matter; a mailing address information input unit; a postage information storage unit; a postage settlement unit; an interface unit for selecting mailing addresses of an addresser and an addressee; a labeler printing the mailing addresses of the addresser and the addressee and a registered barcode on a label and attaching the label to the mail matter; a discharger discharging the mail matter; and an integrated control unit settling the postage through the postage settlement unit, attaching the selected mailing addresses of the addresser and the addressee and the registered barcode to the mail matter through the labeler, and discharging the mail matter through the discharger. | 10-24-2013 |
| 20140050351 | APPARATUS AND METHOD FOR RECEIVING UNMANNED MAIL - Provided is an apparatus for receiving an unmanned mail capable of automatically acquiring the address information even though the user does not directly input the address information. The apparatus acquires address information of an addressee by automatically recognizing the address of the mail when the address is written on the mail, and acquires the address information of the addressee through the paper on which the address is printed or written, identification, and biometric recognition when the address is not written on the mail. The apparatus may acquire the address information of the addressee through a mail sender's voice. | 02-20-2014 |
| 20140172896 | APPARATUS FOR ANALYZING GEOGRAPHIC INFORMATION AND METHOD THEREOF - Disclosed are a geographic information analyzing apparatus and a method thereof, and more specifically, a geographic information analyzing apparatus which is capable of analyzing a region arbitrarily set by a user and a method thereof. The a geographic information analyzing apparatus disclosed in this specification includes a data storing unit which includes a spatial data storing unit which stores geospatial information and an attribute data storing unit which stores attribute information corresponding to the spatial data; a map viewer which provides a user interface and receives spatial information of an arbitrary region from a user, and a function providing unit which compares the geospatial information with the spatial information of the arbitrary region to calculate an overlapping ratio and performs analysis in accordance with a previously set function using attribute information in accordance with the overlapping ratio. | 06-19-2014 |
| Patent application number | Description | Published |
|---|
| 20110026452 | Apparatus and method of processing rescue request signal - Provided is a rescue request signal processing device connected with a repeater and including a signal detector configured to detect identification information of a wireless communication terminal from an uplink signal outputted from the wireless communication terminal; a signal strength information generator configured to generate strength information of the uplink signal of the wireless communication terminal when the detected identification information of the wireless communication terminal is identical with identification information of a wireless communication terminal included in a request signal for location information transmitted from a location information requesting device; and a transmitter configured to transmit the strength information of the uplink signal and at least one of location information and identification information of the repeater to a location information server. | 02-03-2011 |
| 20110063903 | NONVOLATILE MEMORY DEVICES, SYSTEMS HAVING THE SAME, AND WRITE CURRENT CONTROL METHODS THEREOF - Provided is a nonvolatile memory device, a memory system having the same, and a write current control method thereof. The memory system includes a nonvolatile memory device and a memory controller. The nonvolatile memory device has a plurality of write modes. The memory controller includes a sensor configured to sense environment information of the memory system. The memory controller is configured to select one of the write modes according to the sensed environment information and control the nonvolatile memory device according to the selected write mode. Accordingly, the nonvolatile memory device provides a write current for appropriate current consumption in a write operation. | 03-17-2011 |
| 20110122685 | MULTI-LEVEL PHASE-CHANGE MEMORY DEVICE AND METHOD OF OPERATING SAME - A multi-level cell (MLC) phase-change memory device divides data into data groups each comprising multiple bits of data, and stores each of the data groups in a selected phase-change memory cell. A data group is stored in a selected phase-change memory cell by applying a pulse current to the selected phase-change memory cell with a pulse current characteristic corresponding to a data value of the data group. The pulse current characteristic can comprise, for instance, a magnitude, downward slope, or duration of the pulse current. Data is read from a selected phase-change memory cell by sensing a voltage of a bitline connected to the selected phase-change memory cell and comparing the sensed voltage simultaneously with a plurality of reference voltages. | 05-26-2011 |
| 20110180730 | COUNTERFEIT DETECTOR - The present disclosure provides a counterfeit detector which identifies whether a security document or the like is authentic by irradiating UV rays from UV LEDs onto fluorescent security marks formed on the security document. UV rays emitted from the UV LEDs are independently condensed and reflected, thus enabling a user to more effectively identify the fluorescent security marks that are formed in special shapes using UV fluorescent material. | 07-28-2011 |
| 20110235403 | METHOD AND APPARATUS MANAGING WORN CELLS IN RESISTIVE MEMORIES - A method and apparatus for management worn resistive memory cells are presented. A normal read mode or worn memory cell detecting mode are used depending on the wear state of a resistive memory cell. A detection reference point is changed upon wear indication to detect the resistance of the resistive memory cell. The resistance of the resistive memory cell is detected using the changed detection reference point to determine whether or not the resistive memory cell is worn by comparing the detected resistance to a wear reference level. | 09-29-2011 |
| 20110280086 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY SYSTEM - A semiconductor memory device comprises a memory cell array comprising a plurality of memory cells, and a filling command determiner that receives a command signal and an address signal and determines whether the command signal corresponds to a filling command. Upon determining that the command signal corresponds to a filling command, the filling command determiner connects a first source voltage to a bitline and connects a second source voltage to a complementary bitline corresponding to the bitline. The bitline is connected to a selected memory cell corresponding to the address signal. | 11-17-2011 |
| 20120075947 | Semiconductor Memory Devices Having Self-Refresh Capability - A semiconductor memory device is provided. The semiconductor memory device includes at least one memory bank including a plurality of memory cells and a self-refresh controller configured to generate a refresh address and to output a row address for a page to be refreshed based on the refresh address. The semiconductor memory device drives the at least one memory bank based on the row address and selectively refreshes pages in the at least one memory bank in response to the row address. | 03-29-2012 |
| 20140104929 | METHOD AND APPARATUS MANAGING WORN CELLS IN RESISTIVE MEMORIES - A method and apparatus for management worn resistive memory cells are presented. A normal read mode or worn memory cell detecting mode are used depending on the wear state of a resistive memory cell. A detection reference point is changed upon wear indication to detect the resistance of the resistive memory cell. The resistance of the resistive memory cell is detected using the changed detection reference point to determine whether or not the resistive memory cell is worn by comparing the detected resistance to a wear reference level. | 04-17-2014 |
| 20150138159 | REFLECTIVE DISPLAY AND ELECTRONIC PEN SYSTEM USING THE SAME - Disclosed are a reflective display and an electronic pen system using the same. An information pattern for providing position information is formed at pixels configuring the reflective display, and the information pattern includes virtual grid lines and marks. | 05-21-2015 |
| 20150198751 | OPTICAL FILM AND DIGITAL PEN SYSTEM USING THE SAME - An optical film and a digital pen system using the same are provided. The optical film includes a film layer including a fine structure, a coating layer coated on the fine structure and having an infrared ray scattering property, and a matching layer laminated above or below the film layer and having a refractive index matching a refractive index of the fine structure within a predetermined error range. | 07-16-2015 |
| Patent application number | Description | Published |
|---|
| 20100185876 | KEYBOARD-INPUT INFORMATION-SECURITY APPARATUS AND METHOD - A keyboard-input information-security apparatus and method are provided. The apparatus includes an interrupt-descriptor table for storing a list of addresses of functions for handling interrupts, and storing an address of a secure input interrupt-service routine at a specific location in an address area for an operating-system input interrupt-service routine supported by an operating system; a secure input-device driver for changing keyboard-interrupt-vector information to invoke the address of the secure input interrupt-service routine when a keyboard interrupt is generated by a keyboard, and receiving and encoding data input via the keyboard based on the address of the secure input interrupt-service routine; and a secure input unit for delivering the encoded data from the secure input-device driver to an application program, thereby providing higher-level security than a conventional keyboard-security scheme, and particularly, effectively blocking a port-polling attack or an action trying to change a setting in a debug register. | 07-22-2010 |
| 20100308865 | SEMICONDUCTOR DEVICE - A semiconductor device includes a buffer unit configured to include first and second buffers, connected to each other in a cross-coupled manner, to receive a reference voltage and to buffer an input signal applied to the first and second buffers based on the reference voltage to drive an output terminal with a current-driving capacity; and a drive power adjustor configured to adjust the current-driving capacity depending on a level of a power supply voltage applied to the buffering unit. | 12-09-2010 |
| 20110027535 | ANISOTROPIC PARTICLE-ARRANGED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - Provided are a light, thin, short and small, and multi-functional anisotropic particle-arranged structure including two electrodes having fine pitches that are repeatedly compressed to be connected to external elements, and a method of manufacturing the anisotropic particle-arranged structure. The anisotropic particle-arranged structure includes an elastic polymer layer, and elastic conductors or elastic thermal conductors formed in the elastic polymer layer so that upper and lower portions of the elastic conductors or elastic thermal conductors are exposed. | 02-03-2011 |
| 20110156771 | SEMICONDUCTOR DEVICE AND METHOD FOR OPERATING THE SAME - A semiconductor device includes: an internal clock signal generation unit configured to receive an external clock signal and to generate an internal clock signal in response to a control signal; and a monitoring unit configured to monitor environmental elements reflected in a circuit response to the control signal. | 06-30-2011 |
| 20110156778 | INTERNAL CLOCK SIGNAL GENERATOR AND OPERATING METHOD THEREOF - An internal clock signal generation circuit is capable of controlling a unit delay time depending on a frequency of an external clock signal. The internal clock signal generation circuit includes an internal clock signal generation unit configured to generate an internal clock signal corresponding to a plurality of unit delay cells enabled in response to a control signal, and a unit delay time control unit configured to detect a frequency of an external clock signal and control a unit delay time of each of the plurality of unit delay cells. | 06-30-2011 |
| 20110187432 | SEMICONDUCTOR DEVICE - A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal. | 08-04-2011 |
| 20120008435 | DELAY LOCKED LOOP - A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal. | 01-12-2012 |
| 20130038368 | SEMICONDUCTOR DEVICE - A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal. | 02-14-2013 |
| 20130120042 | DELAY LOCKED LOOP - A delay locked loop includes a closed loop circuit configured to generate preliminary delay information, a control unit configured to update the preliminary delay information into delay information in response to a control signal, and a first delay unit configured to delay an input clock signal by a first delay value determined by the delay information and generate an output clock signal. | 05-16-2013 |
| 20130200531 | Circuit Board, Method for Fabricating the Same and Semiconductor Package Using the Same - A circuit board is provided including a core insulation film having a thickness and including a first surface and an opposite second surface, an upper stack structure and a lower stack structure. The upper stack structure has a thickness and has an upper conductive pattern having a thickness and an overlying upper insulation film stacked on the first surface of the core insulation film. The lower stack structure has a thickness and has a lower conductive pattern having a thickness and an overlying lower insulation film stacked on the second surface of the core insulation film. A ratio P of a sum of the thicknesses of the upper conductive pattern and the lower conductive pattern to a sum of the thicknesses of the core insulation film, the upper stack structure and the lower stack structure is in a range from about 0.05 to about 0.2. | 08-08-2013 |
| 20130230104 | METHOD AND APPARATUS FOR ENCODING/DECODING IMAGES USING THE EFFECTIVE SELECTION OF AN INTRA-PREDICTION MODE GROUP - A video encoding/decoding method and apparatus select a prediction mode set based on neighboring pixels and, in some embodiments, obviate the need to encode additional information for selecting a prediction mode set and thereby improve the performance of compression. | 09-05-2013 |
| 20150123115 | METHOD FOR PRODUCING AN OXIDE FILM USING A LOW TEMPERATURE PROCESS, AN OXIDE FILM AND AN ELECTRONIC DEVICE THEREOF - Disclosed are a method for producing an oxide film using a low temperature process, an oxide film and an electronic device. The method for producing an oxide film according to an embodiment of the present invention includes the steps of coating a substrate with an oxide solution, and irradiating the oxide solution coat with ultraviolet rays under an inert gas atmosphere. | 05-07-2015 |
| 20150188529 | SEMICONDUCTOR DEVICE - A semiconductor device including a common delay circuit configured to delay an input signal in response to a delay control code to output a first delayed input signal and a second delayed input signal; a first delay circuit configured to delay the first delayed input signal in response to the delay control code and to output a first output signal; and a second delay circuit configured to delay the second delayed input signal in response to the delay control code and to output a second output signal. | 07-02-2015 |
| Patent application number | Description | Published |
|---|
| 20090312065 | MOBILE COMMUNICATION TERMINAL AND DATA INPUT METHOD - A mobile communication terminal includes a display module to display image data on an image display area, an input module to generate touch data according to a touch input in a touch area, and a storage module to store the touch data associated with the image data. A data input method includes displaying image data on an image display area, generating touch data according to a touch input in a touch area, associating the touch data with the image data, and storing the touch data associated with the image data. | 12-17-2009 |
| 20120147039 | TERMINAL AND METHOD FOR PROVIDING AUGMENTED REALITY - A terminal to provide augmented reality includes a camera unit to capture a real-world view having a marker comprising a first region and a second region; a memory unit to store an object corresponding to the marker, first control information to control a first part of the object, and second control information to control a second part of the object; an object control unit to control the first part of the object based on the first control information if the first region is selected, and to control the second part of the object based on the second control information if the second region is selected; an image processing unit to synthesize the object with the real-world view into a synthesized view; and a display unit to display the synthesized view. | 06-14-2012 |
| 20140043427 | MOBILE COMMUNICATION TERMINAL AND DATA INPUT METHOD - A mobile communication terminal includes a display module to display image data on an image display area, an input module to generate touch data according to a touch input in a touch area, and a storage module to store the touch data associated with the image data. A data input method includes displaying image data on an image display area, generating touch data according to a touch input in a touch area, associating the touch data with the image data, and storing the touch data associated with the image data. | 02-13-2014 |
| 20140191970 | TERMINAL TO SET A TOUCH LOCK LAYER, AND METHOD THEREOF - There is provided a method and a terminal to sets a touch lock layer. The terminal comprising, a display displaying a layer including an image object and an operable touch lock layer within being overlapped each other, an input unit receiving a user input for at least one of the displayed layers, and a control unit controlling the operable touch lock layer based on the user input. | 07-10-2014 |
| 20160042547 | MOBILE COMMUNICATION TERMINAL AND DATA INPUT METHOD - A communication terminal includes a transceiver to receive first touch information from a counterpart terminal, the first touch information having coordinate information of a touch input inputted by a user of the counterpart terminal, the coordinate information being identified based on a coordinate of the touch input on an image displayed on the counterpart terminal. An image signal processor of the communication terminal controls the first touch information to be displayed on a display of the communication terminal, and controls image information corresponding to the image displayed on the counterpart terminal to be displayed on the display in association with the first touch information, and controls the first touch information to be displayed on the image information. | 02-11-2016 |
| Patent application number | Description | Published |
|---|
| 20090011466 | CONCATAMERIC IMMUNOADHESION MOLECULE - Disclosed are concatameric proteins comprising two soluble domains, in which the C-terminus of a soluble domain of a biologically active protein is linked to the N-terminus of an identical soluble domain or a distinct soluble domain of a biologically active protein. Also, the present invention discloses dimeric proteins formed by formation of intermolecular disulfide bonds at the hinge region of two monomeric proteins formed by linkage of a concatamer of two identical soluble extracellular regions of proteins involving immune response to an Fc fragment of an immunoglobulin molecule, their glycosylated proteins, DNA constructs encoding the monomeric proteins, recombinant expression plasmids containing the DNA construct, host cells transformed or transfected with the recombinant expression plasmids, and a method of preparing the dimeric proteins by culturing the host cells. Further, the present invention discloses pharmaceutical or diagnostic compositions comprising the dimeric protein or its glycosylated form. | 01-08-2009 |
| 20100041586 | METHOD OF IMPROVING EFFICACY OF BIOLOGICAL RESPONSE-MODIFYING PROTEINS AND THE EXEMPLARY MUTEINS - Disclosed is a protein variant which substitutes valine for phenylalanine residue in a binding domain having a biological response-modifying function by binding to a receptor, ligand or substrate. Also, the present invention discloses a DNA encoding the protein variant, a recombinant expression vector to which the DNA is operably linked, a host cell transformed or transfected with the recombinant expression vector, and a method of preparing the protein variant comprising cultivating the host cell and isolating the protein variant from the resulting culture. Further, the present invention discloses a pharmaceutical composition comprising the protein variant and a pharmaceutically acceptable carrier. | 02-18-2010 |
| 20100278827 | CONCATAMERIC IMMUNOADHESION MOLECULE - Disclosed are concatameric proteins comprising two soluble domains, in which the C-terminus of a soluble domain of a biologically active protein is linked to the N-terminus of an identical soluble domain or a distinct soluble domain of a biologically active protein. Also, the present invention discloses dimeric proteins formed by formation of intermolecular disulfide bonds at the hinge region of two monomeric proteins formed by linkage of a concatamer of two identical soluble extracellular regions of proteins involving immune response to an Fc fragment pf an immunoglobulin molecule, their glycosylated proteins, DNA constructs encoding the monomeric proteins, recombinant expression plasmids containing the DNA construct, host cells transformed or transfected with the recombinant expression plasmids, and a method of preparing the dimeric proteins by culturing the host cells. Further, the present invention discloses pharmaceutical or diagnostic compositions comprising the dimeric protein or its glycosylated form. | 11-04-2010 |
| 20130071331 | NON-DIFFUSIVE BOTULINUM TOXIN CAUSING LOCAL MUSCLE PARALYSIS, AND PURIFICATION METHOD THEREOF - A method for purifying a non-spreading botulinum toxin that causes local muscle paralysis and a non-spreading botulinum toxin obtained thereby includes the steps of: subjecting a purified botulinum toxin type A product to ion-exchange chromatography using a controlled pH of buffer, concentration of sodium chloride (NaCl), thereby separating the botulinum toxin type A product into subfractions; and collecting a subfraction having an A260/A280 value in a specific range from the separated subfractions. | 03-21-2013 |
| 20130089513 | METHOD OF IMPROVING EFFICACY OF BIOLOGICAL RESPONSE-MODIFYING PROTEINS AND THE EXEMPLARY MUTEINS - Disclosed is a protein variant which substitutes valine for phenylalanine residue in a binding domain having a biological response-modifying function by binding to a receptor, ligand or substrate. Also, the present invention discloses a DNA encoding the protein variant, a recombinant expression vector to which the DNA is operably linked, a host cell transformed or transfected with the recombinant expression vector, and a method of preparing the protein variant comprising cultivating the host cell and isolating the protein variant from the resulting culture. Further, the present invention discloses a pharmaceutical composition comprising the protein variant and a pharmaceutically acceptable carrier. | 04-11-2013 |
| Patent application number | Description | Published |
|---|
| 20100013066 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a main substrate, a semiconductor chip having a first side and a second side, the first side of the semiconductor chip disposed on the main substrate and electrically connected to the main substrate, and a conductive network formed on the second side of the semiconductor chip. | 01-21-2010 |
| 20110008048 | Optical system using optical signal and solid state drive module using the optical signal - An optical system and an SSD module that maintain optimal SI, PI and EMI characteristics without a shield based on a ground voltage and an impedance match. The optical system includes a solid state drive (SSD) module and an input/output (I/O) interface. The SSD module includes a plurality of solid state memory units. The input/output (I/O) interface receives data to be written to at least one of the solid state memory units from a main memory unit, the input/output (I/O) interface transmits data written in at least one of the solid state memory units to the main memory unit. The SSD module and the I/O interface transmit and receive data using an optical medium. | 01-13-2011 |
| 20110241168 | PACKAGE ON PACKAGE STRUCTURE - A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate. | 10-06-2011 |
| 20110304015 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI). | 12-15-2011 |
| 20110304763 | IMAGE SENSOR CHIP AND CAMERA MODULE HAVING THE SAME - An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to surround the light receiving unit, and an electromagnetic wave shielding layer formed on the logic unit and not formed on the light receiving unit. | 12-15-2011 |
| 20110316119 | SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR - Provided is a semiconductor package including a de-coupling capacitor. The semiconductor package includes a substrate, on an upper surface of which a semiconductor chip is mounted; a plurality of first conductive bumps that are disposed on a lower surface of the substrate and that electrically connect the substrate to an external device; and a de-coupling capacitor that is disposed on the lower surface of the substrate and includes an electrode portion and at least one dielectric layer, wherein the electrode portion of the de-coupling capacitor includes second conductive bumps that electrically connect the substrate to an external device. | 12-29-2011 |
| 20110317381 | EMBEDDED CHIP-ON-CHIP PACKAGE AND PACKAGE-ON-PACKAGE COMPRISING SAME - An embedded chip-on-chip package comprises a printed circuit board having a recessed semiconductor chip mounting unit, a first semiconductor chip embedded in the recessed semiconductor chip mounting unit, and a second semiconductor chip mounted on the first semiconductor chip and the printed circuit board. | 12-29-2011 |
| 20120064827 | SEMICONDUCTOR DEVICE INCLUDING COUPLING CONDUCTIVE PATTERN - A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern. | 03-15-2012 |
| 20120080222 | CIRCUIT BOARD INCLUDING EMBEDDED DECOUPLING CAPACITOR AND SEMICONDUCTOR PACKAGE THEREOF - A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode. | 04-05-2012 |
| 20120086109 | Semiconductor Device Including Shielding Layer And Fabrication Method Thereof - Example embodiments relate to a semiconductor device. The semiconductor device may include a first semiconductor chip including a semiconductor substrate, a first through via that penetrates the semiconductor substrate, a second semiconductor chip stacked on one plane of the first semiconductor chip, and a shielding layer covering at least one portion of the first and/or second semiconductor chip and electrically connected to the first through via. | 04-12-2012 |
| 20120126431 | SEMICONDUCTOR PACKAGE - A semiconductor package having improved EMI and crosstalk characteristics is provided. The semiconductor package includes a semiconductor package including a substrate, at least one first semiconductor chip formed on a top surface of the substrate and electrically connected to the substrate, and at least one second semiconductor chip formed on a top surface of the first semiconductor chip and electrically connected to the first semiconductor chip, wherein first and second conductive layers are formed on the top surfaces of the first semiconductor chip and the second semiconductor chip, respectively, and the first conductive layer and the second conductive layer are connected to a ground portion. | 05-24-2012 |
| 20120139090 | STACKED PACKAGE STRUCTURE - A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package. | 06-07-2012 |
| 20120306062 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure. | 12-06-2012 |
| 20130043584 | SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES, PACKAGE STACK STRUCTURES, AND ELECTRONIC SYSTEMS HAVING FUNCTIONALLY ASYMMETRIC CONDUCTIVE ELEMENTS - A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit. | 02-21-2013 |
| 20130163696 | APPARATUS FOR COMPENSATING FOR DISTORTION OF TRANSMITTER ARRAY IN RADIO COMMUNICATION SYSTEM AND METHOD FOR CONTROLLING THE SAME - Provided is a method in which a Digital Pre-Distorter (DPD) performs digital pre-distortion on a received In-phase (I) signal, a received Quadrature-phase (Q) signal, a feedback I signal, and a feedback Q signal; a mixer mixes a signal output from the DPD with a frequency signal output from an oscillator; each of n phase shifters phase-shifts a signal output from the mixer according to a preset beamforming pattern; each of n Power Amplifiers (PAs) amplifies a signal output from an associated phase shifter according to a gain, the PAs connected to the associated phase shifter on a one-to-one basis; each of n envelope detectors detects an envelope signal from a signal output from an associated PA, the envelope detector connected to the associated PA on a one-to-one basis; and a control unit determines whether the n PAs operate normally, using the envelope signals output from the n envelope detectors. | 06-27-2013 |
| 20130165059 | BEAMFORMING APPARATUS AND METHOD IN MOBILE COMMUNICATION SYSTEM - Provided is a beamforming apparatus in a receiver in a mobile communication system. The beamforming apparatus includes a Local Oscillator (LO) signal generator for generating an LO signal; a phase shifter for generating a predetermined number of phase-shifted LO signals with respect to the generated LO signal; a switching network for mapping the phase-shifted LO signals to RF signals received via a plurality of receive paths; and a mixer for mixing the RF signals with the mapped LO signals to down-convert a frequency of the RF signals. | 06-27-2013 |
| 20130168871 | SEMICONDUCTOR PACKAGE WITH PACKAGE ON PACKAGE STRUCTURE - A semiconductor package of a package on package structure reducing an overall thickness of the package and simplifying design complexity of wiring paths is provided. The package includes a first package including a first substrate and a first semiconductor chip portion mounted thereon, a second package disposed on the first package and including a second substrate and a second semiconductor chip portion mounted thereon, and a connection member connecting the first and second substrates. The second semiconductor chip portion includes at least one semiconductor chip including a group of chip pads corresponding to one channel, and the group of chip pads is concentrated on a first edge of the semiconductor chip. An intellectual property core corresponding to the one channel is formed on an edge of the first semiconductor chip portion and the IP core corresponds to the edge on which the group of chip pads is concentrated. | 07-04-2013 |
| 20130200509 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate including a mounting surface having a plurality of ground pads, a semiconductor chip disposed on the mounting surface, a conductive connection part connected to at least one of the plurality of ground pads and having a greater width at a center than at an end, a molding member exposing a top surface of the conductive connection part while wrapping the mounting surface, the conductive connection part and the semiconductor chip, and a heat slug disposed on the molding member and connected to the top surface of the conductive connection part. | 08-08-2013 |
| 20140110831 | MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - A multi-chip package may include a package substrate, an interposer chip, a first semiconductor chip, a thermal dissipation structure and a second semiconductor chip. The interposer chip may be mounted on the package substrate. The first semiconductor chip may be mounted on the interposer chip. The first semiconductor chip may have a size smaller than that of the interposer chip. The thermal dissipation structure may be arranged on the interposer chip to surround the first semiconductor chip. The thermal dissipation structure may transfer heat in the first semiconductor chip to the interposer chip. The second semiconductor chip may be mounted on the first semiconductor chip. Thus, the heat in the first semiconductor chip may be effectively transferred to the interposer chip through the thermal dissipation line. | 04-24-2014 |
| 20140151859 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI). | 06-05-2014 |
| 20140175679 | SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES, PACKAGE STACK STRUCTURES, AND ELECTRONIC SYSTEMS HAVING FUNCTIONALLY ASYMMETRIC CONDUCTIVE ELEMENTS - A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit. | 06-26-2014 |
| 20140319701 | SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP - A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate. | 10-30-2014 |
| 20140328023 | SEMICONDUCTOR PACKAGE HAVING EMI SHIELDING FUNCTION AND HEAT DISSIPATION FUNCTION - A semiconductor package includes a substrate, a semiconductor chip located on a top surface of the substrate, signal lines formed on the top surface of the substrate and configured to allow different types of signals to input/output thereto/therefrom, a ground line unit formed on the top surface of the substrate and configured to divide the signal lines into signal lines to/from which the same types of signals are input/output to be isolated from one another, barrier walls configured to contact the ground line unit, and a heat dissipation unit disposed on the semiconductor chip, wherein the ground line unit includes diagonal ground lines located in diagonal directions of the substrate about the semiconductor chip, and the heat dissipation unit includes a thermal interface material (TIM) located on a top surface of the semiconductor chip, and a heat dissipation plate configured to cover the TIM and the substrate. | 11-06-2014 |
| 20140339692 | SEMICONDUCTOR PACKAGE STACK HAVING A HEAT SLUG - A semiconductor package stack, comprising: a lower semiconductor package including a lower semiconductor chip mounted on a lower package board; an upper semiconductor package stacked on the lower semiconductor package and including an upper semiconductor chip mounted on an upper package board, wherein the upper package board includes an opening configured to expose a lower surface of the upper semiconductor chip; and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of the lower semiconductor chip. | 11-20-2014 |
| 20150024545 | STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE DEVICE - A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package. | 01-22-2015 |
| 20150255381 | SEMICONDUCTOR PACKAGE - A semiconductor package having a structure in which a decoupling capacitor is disposed to be adjacent with a semiconductor chip using a vertical chip interconnection (VCI) to improve power integrity. The semiconductor package includes a semiconductor substrate including a first finger pad and a second finger pad, a semiconductor chip mounted on the semiconductor substrate and including a first chip pad and a second chip pad, a bonding tape electrically connecting the first finger pad and the first chip pad, and a bonding wire electrically connecting the second finger pad and the second chip pad. Here, the bonding tape is formed to make contact with a sidewall of the semiconductor chip in a vertical direction of the semiconductor chip. | 09-10-2015 |
| 20150282001 | BEAMFORMING METHOD AND APPARATUS FOR SERVING MULTIPLE USERS - A beamforming method is provided. The beamforming method includes determining different beams for pieces of user equipment based on channel information fed back from the pieces of user equipment, predicting beam qualities of the pieces of user equipment for the beams, determining whether the beam qualities satisfy Quality of Service (QoS) for the pieces of user equipment, generating a wide nulling beam by applying wide nulling to a second beam having a side lobe acting as interference against one first beam, when the beam quality of the first beam does not satisfy the QoS; predicting beam qualities for the beams including the wide nulling beam instead of the second beam, and simultaneously communicating with the user equipment through the beams including the wide nulling beam instead of the second beam, when the beam qualities for the beams including the wide nulling beam instead of the second beam satisfy the QoS. | 10-01-2015 |
| Patent application number | Description | Published |
|---|
| 20100291342 | METHOD OF PREPARING THERMOPLASTICS-CONTINUOUS FIBER HYBRID COMPOSITE - Provided is a method of preparing thermoplastics-continuous fiber hybrid composite, which is easily woven and has excellent uniformity and impregnation at the time of hot melt impregnation after the weaving, including: a) widely and uniformly stretching a bundle of glass fibers; b) heating the stretched glass fibers; c) preparing a thermoplastics-continuous fiber bonding material by binding the heated glass fiber with thermoplastics; d) preparing a multi-layered thermoplastics-continuous fiber bonding material by folding the bonding material in a shape of zigzag; and e) pressing the multi-layered thermoplastics-continuous fiber bonding material. | 11-18-2010 |
| 20130164501 | METHOD OF PREPARING THERMOPLASTICS-CONTINUOUS FIBER HYBRID COMPOSITE - Provided is a method of preparing thermoplastics-continuous fiber hybrid composite, which is easily woven and has excellent uniformity and impregnation at the time of hot melt impregnation after the weaving, including: a) widely and uniformly stretching a bundle of glass fibers; b) heating the stretched glass fibers; c) preparing a thermoplastics-continuous fiber bonding material by binding the heated glass fiber with thermoplastics; d) preparing a multi-layered thermoplastics-continuous fiber bonding material by folding the bonding material in a shape of zigzag; and e) pressing the multi-layered thermoplastics-continuous fiber bonding material. | 06-27-2013 |
| 20130241188 | PRODUCTION METHOD FOR A SPLASH SHIELD USING A CONTINUOUS EXTRUSION-INJECTION-FOAMING MOULDING PROCESS - The present invention relates to a method for producing a splash shield, in which method a base-portion raw material comprising a plastic, glass fibers, a compatibilizer and rubber is subjected to melt extrusion while at the same time injection molding is performed, and then, without removing the injection-molded article from the injection mold, the injection mold is rotated in the open state, and the injection-molded article is conveyed to a foaming mold and subsequently undergoes flame treatment and a polyurethane foam molding step. A single process in the production method is used for the procedure in which the materials are separately compounded and pelletized and the procedure in which the injection-molded article is molded. | 09-19-2013 |
| 20130252059 | BATTERY PACK CASE ASSEMBLY FOR ELECTRIC AND HYBRID VEHICLES USING A PLASTIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix. | 09-26-2013 |
| 20140333077 | BUMPER BACK BEAM BEING EQUIPPED WITH A FIBER COMPOSITE REINFORCING MATERIAL WITH HOLLOW SECTION INSIDE AND A BUMPER HAVING THE SAME - The present invention relates to a bumper back beam being equipped with a fiber composite reinforcing material with hollow section inside and a bumper having the same. The bumper back beam comprise a body formed with a synthetic resin, and a fiber composite reinforcing material with hollow section that is fastened inside the body, wherein the bumper back beam, as being built inside a bumper cover, reduces impact coming in from outside. | 11-13-2014 |
| 20140352886 | BATTERY PACK CASE ASSEMBLY FOR ELECTRIC AND HYBRID VEHICLES USING A PLASTIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is a battery pack case assembly for an electric or hybrid vehicle and a method for manufacturing the same. The battery pack case assembly includes a case body and a cover. The case body receives a battery pack, and the cover is coupled to the case body. The case body is formed of a plastic composite in which a long fiber or a blend of a long fiber and a continuous fiber is used as a reinforcing fiber in a plastic matrix. A separate reinforced member is bonded to both side bracket parts for coupling to a vehicle body, and is formed of a plastic composite in which a long fiber, a continuous, or a blend of a long fiber and a continuous fiber is used as the reinforcing fiber in the plastic matrix. | 12-04-2014 |
| 20150137538 | BUMPER BACK BEAM MADE OF COMPOSITE MATERIAL AND HAVING IMPROVED ENERGY ABSORPTION RATE, AND BUMPER INCLUDING SAME - The present invention provides a bumper including: the bumper back beam made of a composite material, which has an arch-shaped collision surface, one side surface of which is formed so as to extend in a box shape from the collision surface, and a flange surface of which is formed so as to be bent outward from the side surface and made of the fiber-reinforced composite material, wherein the flange surface is fastened to a stay which is cut into a plurality of units based on a fastening point; and said stay, which is fastened to the bumper back beam, wherein a fastening hole corresponding to the fastening point is formed as an elongate hole. | 05-21-2015 |
| 20150224751 | FUNCTIONAL FILM FOR IMPROVING IMPREGNATION PROPERTIES OF COMPOSITE MATERIAL AND METHOD FOR MANUFACTURING COMPOSITE MATERIAL USING SAME - Disclosed are a film for forming a composite material, which is capable of improving impregnation properties by using a carrier film on which a low viscosity resin layer is formed, and a method for manufacturing a composite material using the same. The film for forming a composite material, according to the present invention, comprises: a continuous fibrous layer; and a carrier film which is adhered to any one side of the continuous fibrous layer and has a low viscosity resin layer formed on the adhered side of the continuous fibrous layer. Thus, the present invention provides the advantage of having a composite material with excellent impregnation properties and excellent mechanical performance. | 08-13-2015 |
| 20150291417 | DEVICE PACKAGING METHOD AND DEVICE PACKAGE USING THE SAME - A device packaging method and a device package using the same may be provided. The device packaging method includes forming a package sacrificial layer by applying a first material on a substrate on which a device has been formed; forming a package cap by applying a second material on the package sacrificial layer; generating gas molecules from the package sacrificial layer by applying external stimuli such as light or heat to the package sacrificial layer; and heating the gas molecule and forming a cavity between the device and the package cap. | 10-15-2015 |
