Patent application number | Description | Published |
20090113801 | SLIDE DOOR OPENING/CLOSING DEVICE OF MOTOR VEHICLE - A lower guide rail is mounted to a lower surface of a vehicle floor panel. Front and rear cable guides are provided on front and rear ends of the lower guide rail. A lower roller bracket fixed to a slide door is guided by the lower guide rail. An electric actuator unit is mounted to the lower surface of the floor panel. The electric actuator unit includes a cable wind/rewind drum. A watertight cover is mounted to the lower surface of the floor panel in a manner to cover the electric actuator unit. A first inner cable is guided by the front cable guide and has one end portion wound on the wind/rewind drum and the other end fixed to the lower roller bracket. A second inner cable is guided by the rear cable guide and has one end portion wound on the wind/rewind drum and the other end fixed to the lower roller bracket. | 05-07-2009 |
20090133333 | DOOR-OPENING DEVICE FOR A VEHICLE SLIDING DOOR - A sliding door slides along the side of a vehicle. An electric drive unit is disposed on a floor of the vehicle and a lower guide rail is disposed under the floor. A lower roller bracket coupled to the sliding door moves along the lower guide rail back and forth. A door-opening outer tube mounted to the sliding door extends from the electric drive unit to a rear wire guide at the rear end of the lower guide rail. A door-closing outer tube extends from the electric drive unit to a front wire guide at the front end of the lower guide rail. A door-opening wire extends through the door-opening outer tube from the electric drive unit to the lower roller bracket. A door-closing wire extends through the door-closing outer tube from the electric drive unit to the lower roller bracket. | 05-28-2009 |
20130333290 | VEHICLE DOOR OPENING DEVICE - A vehicle door opening device comprises a drive unit, an opening cable and a closing cable. The drive unit comprises a housing, a motor mounted to the housing and having armature, and a drum rotated by the motor. At a vertex of the housing, an exterior angle was approximately right angles. The axis of the armature is perpendicular to a side of the housing having the vertex at the end. The drive unit can be made smaller. | 12-19-2013 |
20140062101 | VEHICLE DOOR LATCH SYSTEM - In a vehicle, a striker engages with a latch which engages with a ratchet. A door of the vehicle is closed. A motion-transmitting path for transmitting power to the ratchet from an electric drive mechanism is provided. A release-canceling mechanism connects or cuts off the motion-transmitting path. When the ratchet is released from the latch, the door-cooperating lever cuts off the release-canceling mechanism to enable the ratchet to engage with the latch again. Hence the door is closed. | 03-06-2014 |
20150028618 | SEAT LOCK APPARATUS - A seat lock apparatus includes a case member having a striker entrance groove and a hook lever that is provided rotatably via a hook shaft and is movable between an opening position and a restraining position where the hook lever closes an opening in a striker entrance groove. The apparatus is configured to position the hook lever in the restraining position while positioning the striker in the striker entrance groove when a seatback is erected. The striker entrance groove is formed such that when the striker enters the striker entrance groove and abuts against the hook lever positioned in the restraining position, only a portion of the case member, which is positioned closer to a central side of the seatback than the hook lever is in an axial direction of the hook shaft, is brought into abutment with the striker. | 01-29-2015 |
Patent application number | Description | Published |
20080318346 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 12-25-2008 |
20110097849 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 04-28-2011 |
20110290427 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 12-01-2011 |
20120270340 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 10-25-2012 |
20130130408 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 05-23-2013 |
20130299098 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 11-14-2013 |